ES2185046T3 - Caja de transistores de potencia radioelectrica con doble conexion a tierra. - Google Patents
Caja de transistores de potencia radioelectrica con doble conexion a tierra.Info
- Publication number
- ES2185046T3 ES2185046T3 ES97941326T ES97941326T ES2185046T3 ES 2185046 T3 ES2185046 T3 ES 2185046T3 ES 97941326 T ES97941326 T ES 97941326T ES 97941326 T ES97941326 T ES 97941326T ES 2185046 T3 ES2185046 T3 ES 2185046T3
- Authority
- ES
- Spain
- Prior art keywords
- ceramic substrate
- grounding path
- metallic
- transistor
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6644—Packaging aspects of high-frequency amplifiers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
UN CUBIERTA DE TRANSISTOR DE POTENCIA DE RF (10) CONFIGURADA PARA MONTARLA EN EL DISIPADOR TERMICO DE UN TABLERO DE CIRCUITOS IMPRESOS DE MULTIPLES CAPAS Y QUE COMPRENDE UNA TRAYECTORIA DE PUESTA A TIERRA ELECTRICA LATERAL SUPERIOR DESDE UNA PASTILLA DE TRANSISTOR (16) QUE HAY COLOCADA ENCIMA DE UN SUBSTRATO CERAMICO (18) HASTA UNA BRIDA DE MONTAJE (30), SIN PASAR A TRAVES DEL SUBSTRATO CERAMICO, EJ, COLOCANDO UN REVESTIMIENTO METALICO SOBRE UNA SUPERFICIE EXTERIOR DEL SUBSTRATO CERAMICO PARA CONECTAR ELECTRICAMENTE UN HILO METALICO MONTADO EN LA PARTE SUPERIOR A LA BRIDA. TAMBIEN SE PUEDE FORMAR UNA TRAYECTORIA DE PUESTA A TIERRA DIRECTA DE LA PASTILLA DE TRANSISTOR A LA BRIDA DE MONTAJE A TRAVES DE UNOS AGUJEROS METALIZADOS (34) FORMADOS A TRAVES DEL SUBSTRATO CERAMICO. LA TRAYECTORIA DE PUESTA A TIERRA LATERAL SUPERIOR TAMBIEN ESTA CONFIGURADA PARA CONECTAR LA CAPA DE REFERENCIA DE PUESTA A TIERRA INTERMEDIA DEL TABLERO DE CIRCUITOS IMPRESOS DE MULTIPLES CAPAS CUANDO SE ASEGURA LA BRIDADE MONTAJE AL DISIPADOR TERMICO. DE ESTE MODO, LA CUBIERTA DE TRANSISTOR DE POTENCIA SE PONE A TIERRA AL MISMO POTENCIAL DE REFERENCIA QUE EL RESTO DE LOS ELEMENTOS ACOPLADOS AL TABLERO DE CIRCUITOS IMPRESOS, AL TIEMPO QUE SE MANTIENEN LAS CARACTERISTICAS DE ALTO RENDIMIENTO PROPORCIONADAS POR LOS AGUJEROS DE PUESTA A TIERRA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/684,474 US5889319A (en) | 1996-07-19 | 1996-07-19 | RF power package with a dual ground |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2185046T3 true ES2185046T3 (es) | 2003-04-16 |
Family
ID=24748185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES97941326T Expired - Lifetime ES2185046T3 (es) | 1996-07-19 | 1997-07-02 | Caja de transistores de potencia radioelectrica con doble conexion a tierra. |
Country Status (11)
Country | Link |
---|---|
US (1) | US5889319A (es) |
EP (1) | EP0912997B1 (es) |
JP (1) | JP2001502845A (es) |
KR (1) | KR100338655B1 (es) |
CN (1) | CN1230290A (es) |
AU (1) | AU4325997A (es) |
CA (1) | CA2260823A1 (es) |
DE (1) | DE69716081T2 (es) |
ES (1) | ES2185046T3 (es) |
TW (1) | TW358993B (es) |
WO (1) | WO1998003999A1 (es) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6404065B1 (en) * | 1998-07-31 | 2002-06-11 | I-Xys Corporation | Electrically isolated power semiconductor package |
US6462413B1 (en) * | 1999-07-22 | 2002-10-08 | Polese Company, Inc. | LDMOS transistor heatsink package assembly and manufacturing method |
US6493861B1 (en) | 1999-12-28 | 2002-12-10 | Intel Corporation | Interconnected series of plated through hole vias and method of fabrication therefor |
JP2003521127A (ja) * | 2000-01-28 | 2003-07-08 | エリクソン インコーポレイテッド | 多重アース信号路ldmos電力用パッケージ |
US6586833B2 (en) * | 2000-11-16 | 2003-07-01 | Silicon Semiconductor Corporation | Packaged power devices having vertical power mosfets therein that are flip-chip mounted to slotted gate electrode strip lines |
US6583673B2 (en) * | 2001-02-26 | 2003-06-24 | Infineon Technologies Ag | Stability enhanced multistage power amplifier |
US6731002B2 (en) | 2001-05-04 | 2004-05-04 | Ixys Corporation | High frequency power device with a plastic molded package and direct bonded substrate |
US6727585B2 (en) | 2001-05-04 | 2004-04-27 | Ixys Corporation | Power device with a plastic molded package and direct bonded substrate |
US6674157B2 (en) | 2001-11-02 | 2004-01-06 | Fairchild Semiconductor Corporation | Semiconductor package comprising vertical power transistor |
US6566749B1 (en) | 2002-01-15 | 2003-05-20 | Fairchild Semiconductor Corporation | Semiconductor die package with improved thermal and electrical performance |
EP2741426B1 (en) | 2011-08-01 | 2017-12-20 | Murata Manufacturing Co., Ltd. | High-frequency module |
US9484222B2 (en) | 2014-02-19 | 2016-11-01 | Freescale Semiconductor, Inc. | Semiconductor devices, semiconductor device packages, and packaging techniques for impedance matching and/or low frequency terminations |
CN106252290B (zh) * | 2016-07-06 | 2019-03-12 | 苏州能讯高能半导体有限公司 | 封装外壳及应用该封装外壳的电子元件 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3649872A (en) * | 1970-07-15 | 1972-03-14 | Trw Inc | Packaging structure for high-frequency semiconductor devices |
US3713006A (en) * | 1971-02-08 | 1973-01-23 | Trw Inc | Hybrid transistor |
DE2510982A1 (de) * | 1975-03-13 | 1976-09-30 | Bosch Gmbh Robert | Hybrides halbleiterbauelement |
US3958195A (en) * | 1975-03-21 | 1976-05-18 | Varian Associates | R.f. transistor package having an isolated common lead |
US4042952A (en) * | 1976-06-09 | 1977-08-16 | Motorola, Inc. | R. F. power transistor device with controlled common lead inductance |
US4193083A (en) * | 1977-01-07 | 1980-03-11 | Varian Associates, Inc. | Package for push-pull semiconductor devices |
US4200880A (en) * | 1978-03-28 | 1980-04-29 | Microwave Semiconductor Corp. | Microwave transistor with distributed output shunt tuning |
US4213141A (en) * | 1978-05-12 | 1980-07-15 | Solid State Scientific Inc. | Hybrid transistor |
JPS5746662A (en) * | 1980-09-04 | 1982-03-17 | Toshiba Corp | Semiconductor rectifier |
US4495515A (en) * | 1982-07-26 | 1985-01-22 | At&T Bell Laboratories | Electrically isolating two piece mounting washer arrangement |
US4574879A (en) * | 1984-02-29 | 1986-03-11 | The Bergquist Company | Mounting pad for solid-state devices |
JPS60210853A (ja) * | 1984-03-06 | 1985-10-23 | Fujitsu Ltd | 半導体装置 |
US5200362A (en) * | 1989-09-06 | 1993-04-06 | Motorola, Inc. | Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film |
US5170337A (en) * | 1992-01-29 | 1992-12-08 | General Electric Company | Low-inductance package for multiple paralleled devices operating at high frequency |
US5406125A (en) * | 1993-04-15 | 1995-04-11 | Martin Marietta Corp. | Semiconductor device having a metalized via hole |
-
1996
- 1996-07-19 US US08/684,474 patent/US5889319A/en not_active Expired - Lifetime
-
1997
- 1997-07-02 CN CN97197814A patent/CN1230290A/zh active Pending
- 1997-07-02 WO PCT/US1997/010865 patent/WO1998003999A1/en active IP Right Grant
- 1997-07-02 CA CA002260823A patent/CA2260823A1/en not_active Abandoned
- 1997-07-02 EP EP97941326A patent/EP0912997B1/en not_active Expired - Lifetime
- 1997-07-02 AU AU43259/97A patent/AU4325997A/en not_active Abandoned
- 1997-07-02 KR KR1019997000396A patent/KR100338655B1/ko not_active IP Right Cessation
- 1997-07-02 ES ES97941326T patent/ES2185046T3/es not_active Expired - Lifetime
- 1997-07-02 JP JP10506929A patent/JP2001502845A/ja active Pending
- 1997-07-02 DE DE69716081T patent/DE69716081T2/de not_active Expired - Fee Related
- 1997-11-14 TW TW086116987A patent/TW358993B/zh active
Also Published As
Publication number | Publication date |
---|---|
AU4325997A (en) | 1998-02-10 |
JP2001502845A (ja) | 2001-02-27 |
KR100338655B1 (ko) | 2002-05-30 |
WO1998003999A1 (en) | 1998-01-29 |
KR20010029445A (ko) | 2001-04-06 |
EP0912997B1 (en) | 2002-10-02 |
DE69716081T2 (de) | 2003-02-06 |
US5889319A (en) | 1999-03-30 |
DE69716081D1 (de) | 2002-11-07 |
CN1230290A (zh) | 1999-09-29 |
CA2260823A1 (en) | 1998-01-29 |
TW358993B (en) | 1999-05-21 |
EP0912997A1 (en) | 1999-05-06 |
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