ES2175401T3 - Dispositivo de puente semiconductor y procedimiento de fabricacion. - Google Patents

Dispositivo de puente semiconductor y procedimiento de fabricacion.

Info

Publication number
ES2175401T3
ES2175401T3 ES97921498T ES97921498T ES2175401T3 ES 2175401 T3 ES2175401 T3 ES 2175401T3 ES 97921498 T ES97921498 T ES 97921498T ES 97921498 T ES97921498 T ES 97921498T ES 2175401 T3 ES2175401 T3 ES 2175401T3
Authority
ES
Spain
Prior art keywords
semiconductor
volframio
titanium
layer
bridge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES97921498T
Other languages
English (en)
Inventor
Bernardo Martinez-Tovar
John A Montoya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SCB Technologies Inc
Original Assignee
SCB Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SCB Technologies Inc filed Critical SCB Technologies Inc
Application granted granted Critical
Publication of ES2175401T3 publication Critical patent/ES2175401T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F42AMMUNITION; BLASTING
    • F42BEXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
    • F42B3/00Blasting cartridges, i.e. case and explosive
    • F42B3/10Initiators therefor
    • F42B3/12Bridge initiators
    • F42B3/13Bridge initiators with semiconductive bridge

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Die Bonding (AREA)
  • Coating By Spraying Or Casting (AREA)

Abstract

UN DISPOSITIVO, POR EJEMPLO, UN DISPOSITIVO DE CEBADO DE UN EXPLOSIVO (24) INCLUYE UN DISPOSITIVO DE PUENTE SEMICONDUCTOR (10) QUE COMPRENDE UNAS PLACAS SEMICONDUCTORAS (14A, 14B), SEPARADAS POR UN PUENTE INICIADOR (14C) Y QUE TIENE SUPERFICIES METALIZADAS (16A, 16B) DISPUESTAS SOBRE LAS PLACAS (14A, 14B). CADA UNA DE LAS SUPERFICIES METALIZADAS (16A, 16B) COMPRENDE UNA CAPA BASE DE TITANIO (18), UNA CAPA INTERMEDIA DE TITANIO - VOLFRAMIO (20) Y UNA CAPA SUPERIOR DE VOLFRAMIO (22). ESTA CONSTRUCCION DE CAPAS MULTIPLES ES DE SIMPLE APLICACION, PROPORCIONA UNA BUENA ADHERENCIA AL SEMICONDUCTOR (14) Y MEJORES CARACTERISTICAS AL PUENTE SEMICONDUCTOR, EVITANDO LOS PROBLEMAS DE ELECTROMIGRACION QUE SE PRODUCEN CON EL USO DE SUPERFICIES METALIZADAS DE ALUMINIO EN SEVERAS CONDICIONES DE ENSAYOS SIN FUEGO Y NIVELES MUY BAJOS DE CORRIENTE O TENSION DE DISPARO. EL SEMICONDUCTOR (14) PUEDE IR CUBIERTO OPCIONALMENTE POR UNA CAPA O CUBIERTA (117) DE UNA CAPA DE METAL ESTRATIFICADA SIMILAR O IDENTICA A LAS SUPERFICIES METALIZADAS (16A, 16B). UN PROCEDIMIENTO PARA FABRICAR DISPOSITIVOS DE PUENTE DE SEMICONDUCTOR INCLUYE LA PULVERIZACION METALICA DE TITANIO, A CONTINUACION DE TITANIO MAS VOLFRAMIO Y POR ULTIMO DE VOLFRAMIO SOBRE LA SUPERFICIE ADECUADAMENTE ENMASCARADA DEL SEMICONDUCTOR, A FIN DE ALCANZAR LAS SUPERFICIES METALIZADAS DE CAPAS MULTIPLES (16A, 16B) Y/O LA TAPA (117) DE LA INVENCION.
ES97921498T 1996-05-09 1997-05-02 Dispositivo de puente semiconductor y procedimiento de fabricacion. Expired - Lifetime ES2175401T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/644,008 US6133146A (en) 1996-05-09 1996-05-09 Semiconductor bridge device and method of making the same

Publications (1)

Publication Number Publication Date
ES2175401T3 true ES2175401T3 (es) 2002-11-16

Family

ID=24583068

Family Applications (1)

Application Number Title Priority Date Filing Date
ES97921498T Expired - Lifetime ES2175401T3 (es) 1996-05-09 1997-05-02 Dispositivo de puente semiconductor y procedimiento de fabricacion.

Country Status (10)

Country Link
US (1) US6133146A (es)
EP (1) EP0897523B1 (es)
AR (1) AR007028A1 (es)
AT (1) ATE216063T1 (es)
BR (1) BR9710438A (es)
CA (1) CA2253672C (es)
DE (1) DE69711864T2 (es)
ES (1) ES2175401T3 (es)
NO (1) NO985233L (es)
WO (1) WO1997042462A1 (es)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19832449A1 (de) * 1998-07-18 2000-01-20 Dynamit Nobel Ag Zündbrücke für ein elektrisches Anzündelement
JP3175051B2 (ja) * 1999-10-14 2001-06-11 昭和金属工業株式会社 電気発火式イニシエータ
JP2001241896A (ja) * 1999-12-22 2001-09-07 Scb Technologies Inc チタン半導体ブリッジの点火装置
FR2807157B1 (fr) * 2000-04-04 2003-01-31 Vishay Sa Element resistif pour initiateur pyrotechnique
US6772692B2 (en) 2000-05-24 2004-08-10 Lifesparc, Inc. Electro-explosive device with laminate bridge
AU2001292596A1 (en) * 2000-09-07 2002-03-22 Auburn University Electro-explosive device with laminate bridge
US6902656B2 (en) * 2002-05-24 2005-06-07 Dalsa Semiconductor Inc. Fabrication of microstructures with vacuum-sealed cavity
US7951247B2 (en) * 2002-10-01 2011-05-31 Lawrence Livermore National Security, Llc Nano-laminate-based ignitors
DE10241363A1 (de) * 2002-09-06 2004-03-18 Flexiva Automation & Anlagenbau Gmbh Pyrotechnisches Zündsystem
JP2004209342A (ja) * 2002-12-27 2004-07-29 Takata Corp イニシエータ及びガス発生器
US7871912B2 (en) * 2005-12-13 2011-01-18 Versatilis Llc Methods of making semiconductor-based electronic devices by forming freestanding semiconductor structures
US7700471B2 (en) * 2005-12-13 2010-04-20 Versatilis Methods of making semiconductor-based electronic devices on a wire and articles that can be made thereby
US7638416B2 (en) * 2005-12-13 2009-12-29 Versatilis Llc Methods of making semiconductor-based electronic devices on a wire and articles that can be made using such devices
WO2008076756A2 (en) * 2006-12-13 2008-06-26 Versatilis Llc Method of making semiconductor-based electronic devices on a wire and by forming freestanding semiconductor structures, and devices that can be made thereby
US9500448B1 (en) * 2015-06-09 2016-11-22 Reynolds Systems, Inc. Bursting switch
RU2723258C1 (ru) * 2015-06-26 2020-06-09 Недерландсе Органисати Вор Тугепаст-Натюрветенсаппелейк Ондерзук Тно Детонационное устройство в виде интегральной схемы
DK3673225T3 (da) * 2017-08-21 2023-05-30 L Livermore Nat Security Llc Fremgangsmåder til at forbedre eksplosionsensartethed og -effektivitet ved foliedetonatorindretninger
CN108502842B (zh) * 2018-03-26 2019-12-03 北京理工大学 一种应用于引信安保的微机电组合逻辑器件及其制备方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US39542A (en) * 1863-08-18 Improvement in f
US722913A (en) * 1902-02-25 1903-03-17 Nikolaus Schmitt Electric ignition device.
US2942546A (en) * 1950-03-30 1960-06-28 Herman A Liebhafsky Device for actuating explosives by electrical breakdown
US3108905A (en) * 1960-05-16 1963-10-29 Gen Motors Corp Method of making a semiconductive ceramic body and a low voltage sparking device emboying same
US3196041A (en) * 1960-11-25 1965-07-20 Gen Lab Associates Inc Method of making a semiconductor gap for an initiator
GB960186A (en) * 1961-10-19 1964-06-10 Bendix Corp Electrically triggered squib
US3249800A (en) * 1963-08-02 1966-05-03 Henry J Huber Fast acting switch utilizing a vaporizable wire
US3366055A (en) * 1966-11-15 1968-01-30 Green Mansions Inc Semiconductive explosive igniter
US3426682A (en) * 1967-04-27 1969-02-11 Sidney A Corren Exploding fuse
DE2020016C3 (de) * 1970-04-24 1974-12-12 Dynamit Nobel Ag, 5210 Troisdorf Metallschichtzündmittel
US3618523A (en) * 1970-05-06 1971-11-09 Us Navy Stab-electric detonator
US3669022A (en) * 1970-08-05 1972-06-13 Iit Res Inst Thin film device
US3725671A (en) * 1970-11-02 1973-04-03 Us Navy Pyrotechnic eradication of microcircuits
US3882323A (en) * 1973-12-17 1975-05-06 Us Navy Method and apparatus for protecting sensitive information contained in thin-film microelectonic circuitry
US3883762A (en) * 1974-06-17 1975-05-13 Bendix Corp Electrical discharge device comprising an insulator body having an electrically semi-conducting coating formed thereon
US3974424A (en) * 1974-10-07 1976-08-10 Ici United States Inc. Variable resistance bridge element
US4312271A (en) * 1976-07-08 1982-01-26 Systems, Science And Software Delay detonator device
JPS55155092U (es) * 1979-04-23 1980-11-08
US4471697A (en) * 1982-01-28 1984-09-18 The United States Of America As Represented By The United States Department Of Energy Bidirectional slapper detonator
US4708060A (en) * 1985-02-19 1987-11-24 The United States Of America As Represented By The United States Department Of Energy Semiconductor bridge (SCB) igniter
GB2190730B (en) * 1986-05-22 1990-10-24 Detonix Close Corp Detonator firing element
GB8712789D0 (en) * 1986-06-25 1989-10-18 Secr Defence Pyrotechnic train
US4976200A (en) * 1988-12-30 1990-12-11 The United States Of America As Represented By The United States Department Of Energy Tungsten bridge for the low energy ignition of explosive and energetic materials
US5173449A (en) * 1989-06-05 1992-12-22 Motorola, Inc. Metallization process
US5355800A (en) * 1990-02-13 1994-10-18 Dow Robert L Combined EED igniter means and means for protecting the EED from inadvertent extraneous electricity induced firing
US5166468A (en) * 1991-04-05 1992-11-24 Thiokol Corporation Thermocouple-triggered igniter
US5431101A (en) * 1991-04-16 1995-07-11 Thiokol Corporation Low cost hermetically sealed squib
US5309841A (en) * 1991-10-08 1994-05-10 Scb Technologies, Inc. Zener diode for protection of integrated circuit explosive bridge
US5179248A (en) * 1991-10-08 1993-01-12 Scb Technologies, Inc. Zener diode for protection of semiconductor explosive bridge
GB9216517D0 (en) * 1992-08-04 1992-09-23 Ici Plc Pyrotechnic sheet material
US5376585A (en) * 1992-09-25 1994-12-27 Texas Instruments Incorporated Method for forming titanium tungsten local interconnect for integrated circuits
US5370054A (en) * 1992-10-01 1994-12-06 The United States Of America As Represented By The Secretary Of The Army Semiconductor slapper
US5385097A (en) * 1993-07-16 1995-01-31 At&T Corp. Electroexplosive device
US5439847A (en) * 1993-11-05 1995-08-08 At&T Corp. Integrated circuit fabrication with a raised feature as mask
US5503077A (en) * 1994-03-29 1996-04-02 Halliburton Company Explosive detonation apparatus
US5484747A (en) * 1995-05-25 1996-01-16 United Microelectronics Corporation Selective metal wiring and plug process

Also Published As

Publication number Publication date
NO985233D0 (no) 1998-11-09
AR007028A1 (es) 1999-10-13
CA2253672A1 (en) 1997-11-13
EP0897523B1 (en) 2002-04-10
DE69711864T2 (de) 2002-08-29
DE69711864D1 (de) 2002-05-16
BR9710438A (pt) 2000-01-11
WO1997042462A1 (en) 1997-11-13
ATE216063T1 (de) 2002-04-15
US6133146A (en) 2000-10-17
NO985233L (no) 1999-01-08
EP0897523A4 (en) 1999-07-28
EP0897523A1 (en) 1999-02-24
CA2253672C (en) 2002-04-16

Similar Documents

Publication Publication Date Title
ES2175401T3 (es) Dispositivo de puente semiconductor y procedimiento de fabricacion.
ES2094433T3 (es) Dispositivo para evitar descargas en instalaciones de atomizacion en vacio.
BR9305682A (pt) Método de formaçao de camada de ar sobre superficies imersas de estruturas que possuem partes imersas e estruturas de camada de revestimento formadas sobre partes imersas
ES2119290T3 (es) Dispositivo de proteccion para los bordes de aberturas en piezas perfiladas hechas de vitroceramica, vidrio o ceramica.
AR054763A2 (es) Dispositivo optoelectronico organico fotosensible
AR012026A1 (es) Conjunto de circuito de retardo hibrido de detonador electronico
ES543133A0 (es) Construccion de techo y de pared para el revestimiento her- metico a los gases
ES2135671T3 (es) Procedimiento y dispositivo de revestimiento de una de las superficies de un cristal.
SV1994000037A (es) Aplicador termoplastico que se desprende facilmente con agua
ES2122271T3 (es) Composicion de imprimacion y uso de la misma para revestir superficies metalicas con una resina fluorada.
WO2002090923A3 (en) Methods for assembling protein microarrays
DK266786D0 (da) 5-amino-1-pyrazoler, deres fremstilling og anvendelse som herbicider, samt ved fremstillingen anvendelige mellemprodukter og fremstillingen deraf
ES2160799T3 (es) Procedimiento de fabricacion de un contacto ohmico para un dispositivo semiconductor.
ES2158407T3 (es) Pieza de aluminio fundido y procedimiento para su fabricacion.
CO4790122A1 (es) Sistema radiante en acumuladores y producto resultante
ES2135884T3 (es) Procedimiento de aplicacion termica de finas capas ceramicas y dispositivo de aplicacion.
ES2139325T3 (es) Dispositivo de iluminacion en forma de placa.
ES2044714T3 (es) Elemento de limitacion y de disipacion de cargas.
ES2170871T3 (es) Procedimiento de fabricacion de resortes helicoidales curvados, resortes asi obtenidos y dispositivos para la puesta en practica del procedimiento.
IT1299436B1 (it) Procedimento per il rivestimento con nitruro di alluminio delle superfici di scorrimento dei cilindri di un basamento in lega a
AR002321A1 (es) Composicion para ser usada en la remocion de agentes de pegado, metodo para remover pegamentos y una capa de barrera
ES2056575T3 (es) Metodo de fabricar una estructura compuesta por modelado superplastico.
MX9204316A (es) Procedimiento y equipo para el recubrimiento mediante rociado electrostatico.
MX9301819A (es) Un tablero corrugado.
ES2188986T3 (es) Estructura de calzada de tres capas.

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 897523

Country of ref document: ES