ES2132830T3 - Lamina termoplastica adhesiva. - Google Patents
Lamina termoplastica adhesiva.Info
- Publication number
- ES2132830T3 ES2132830T3 ES96118502T ES96118502T ES2132830T3 ES 2132830 T3 ES2132830 T3 ES 2132830T3 ES 96118502 T ES96118502 T ES 96118502T ES 96118502 T ES96118502 T ES 96118502T ES 2132830 T3 ES2132830 T3 ES 2132830T3
- Authority
- ES
- Spain
- Prior art keywords
- proportion
- adhesive film
- contact surfaces
- weight
- thermoplastic sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Credit Cards Or The Like (AREA)
Abstract
LA INVENCION TRATA DE UNA PELICULA ADHESIVA TERMOPLASTICA PARA IMPLANTAR MODULOS ELECTRICOS EN UNA TARJETA PROVISTA DE UN ESCOTE PRACTICADO PARA COLOCAR UN MODULO ELECTRONICO, QUE EN LA PRIMERA CARA MUESTRA VARIAS SUPERFICIES DE CONTACTO Y EN LA SEGUNDA CARA, SITUADA FRENTE A LA PRIMERA CARA, MUESTRA UN ELEMENTO DE CIRCUITO INTEGRADO, CUYOS PUNTOS DE CONEXION ESTAN CONECTADOS CON LAS SUPERFICIES DE CONTACTO A TRAVES DE CONDUCTORES ELECTRICOS, SIRVIENDO LA PELICULA ADHESIVA PARA UNIR LA SEGUNDA CARA DEL MODULO CON LA TARJETA; LA INVENCION ESTA CARACTERIZADA PORQUE LA PELICULA ADHESIVA MUESTRA LA COMBINACION DE LOS SIGUIENTES COMPONENTES: I) UN POLIMERO TERMOPLASTICO CON UNA PROPORCION DEL 40 AL 100 % EN PESO Y II) UNA O VARIAS RESINAS ADHERENTES CON UNA PROPORCION DEL 5 AL 50 % EN PESO O ALTERNATIVAMENTE III) RESINAS EPOXI CON ENDURECEDORES CON UNA PROPORCION DEL 5 AL 40 % EN PESO.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19519499A DE19519499B4 (de) | 1995-05-27 | 1995-05-27 | Thermoplastische Klebstoffolie und deren Verwendung |
EP96118502A EP0842995B1 (de) | 1995-05-27 | 1996-11-19 | Thermoplastische Klebstofffolie |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2132830T3 true ES2132830T3 (es) | 1999-08-16 |
Family
ID=26015530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES96118502T Expired - Lifetime ES2132830T3 (es) | 1995-05-27 | 1996-11-19 | Lamina termoplastica adhesiva. |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0842995B1 (es) |
DE (2) | DE19519499B4 (es) |
ES (1) | ES2132830T3 (es) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19519499B4 (de) * | 1995-05-27 | 2005-05-25 | Tesa Ag | Thermoplastische Klebstoffolie und deren Verwendung |
DE19700254A1 (de) * | 1996-12-03 | 1998-06-04 | Beiersdorf Ag | Thermoplastische härtbare Selbstklebefolie |
EP0846743A1 (de) * | 1996-12-03 | 1998-06-10 | Beiersdorf Aktiengesellschaft | Thermoplastische härtbare Selbstklebefolie |
DE19708325B4 (de) * | 1997-03-03 | 2007-06-14 | Sokymat Gmbh | Klebeverbindung von elektrisch leitenden Fügeteilen |
JP2002519500A (ja) * | 1998-07-04 | 2002-07-02 | バイヤースドルフ・アクチエンゲゼルシヤフト | 導電性の、熱可塑性のそして熱活性化可能な粘着フィルム |
DE19848712A1 (de) * | 1998-10-22 | 2000-04-27 | Henkel Kgaa | Komponentenschicht für Smart Cards aus Schmelzklebstoffen |
DE19853805B4 (de) | 1998-11-21 | 2005-05-12 | Tesa Ag | Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstofffolie und deren Verwendung |
DE10016135A1 (de) * | 2000-03-31 | 2001-10-18 | Infineon Technologies Ag | Gehäusebaugruppe für ein elektronisches Bauteil |
DE10031139C2 (de) * | 2000-06-27 | 2003-04-17 | Wacker Siltronic Halbleitermat | Verfahren und Stoffmischung zur Montage und Demontage von Halbleiterscheiben |
DE10248382B4 (de) * | 2002-10-17 | 2010-09-30 | Giesecke & Devrient Gmbh | Verfahren zum Laminieren von Folien und Folienanordnung |
EP1658346B1 (de) | 2003-08-22 | 2009-04-15 | Tesa AG | Verwendung einer klebstofffolie zur implantierung von elektrischen modulen in einen kartenkörper |
DE10361538A1 (de) * | 2003-12-23 | 2005-07-28 | Tesa Ag | Schmelzkleber zur Implantierung von elektrischen Modulen in einen Kartenkörper |
JP2011207086A (ja) * | 2010-03-30 | 2011-10-20 | Three M Innovative Properties Co | 複合部品、複合部品前駆体、及び接着剤 |
DE102016207540A1 (de) | 2016-05-02 | 2017-11-02 | Tesa Se | Wasserdampfsperrende Klebemasse mit hochfunktionalisiertem Poly(meth)acrylat |
DE102016207550A1 (de) | 2016-05-02 | 2017-11-02 | Tesa Se | Funktionalisierte (Co)Polymere für Klebesysteme und Klebebänder |
DE102016207548A1 (de) | 2016-05-02 | 2017-11-02 | Tesa Se | Härtbare Klebemasse und darauf basierende Reaktivklebebänder |
DE102016220237A1 (de) | 2016-10-17 | 2018-04-19 | Tesa Se | Verfahren zur Herstellung einer versiegelten Falzverbindung |
DE102018213824A1 (de) | 2018-08-16 | 2020-02-20 | Tesa Se | Verfahren zur Herstellung einer versiegelten Falzverbindung |
DE102022113506A1 (de) | 2022-05-30 | 2023-11-30 | Tesa Se | Verfahren zum Verbinden, Ablösen und Wiederverbinden von Substraten |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2629236B1 (fr) * | 1988-03-22 | 1991-09-27 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede |
DE4040770C2 (de) | 1990-12-19 | 1999-11-11 | Gao Ges Automation Org | Datenträger mit integriertem Schaltkreis |
DE4122049A1 (de) * | 1991-07-03 | 1993-01-07 | Gao Ges Automation Org | Verfahren zum einbau eines traegerelements |
JPH05144855A (ja) * | 1991-11-22 | 1993-06-11 | Toshiba Chem Corp | 半導体装置 |
JPH08250522A (ja) * | 1995-03-10 | 1996-09-27 | Toshiba Chem Corp | 半導体装置 |
DE19519499B4 (de) * | 1995-05-27 | 2005-05-25 | Tesa Ag | Thermoplastische Klebstoffolie und deren Verwendung |
-
1995
- 1995-05-27 DE DE19519499A patent/DE19519499B4/de not_active Expired - Lifetime
-
1996
- 1996-11-19 EP EP96118502A patent/EP0842995B1/de not_active Revoked
- 1996-11-19 ES ES96118502T patent/ES2132830T3/es not_active Expired - Lifetime
- 1996-11-19 DE DE59601784T patent/DE59601784D1/de not_active Revoked
Also Published As
Publication number | Publication date |
---|---|
DE59601784D1 (de) | 1999-06-02 |
DE19519499A1 (de) | 1996-11-28 |
EP0842995B1 (de) | 1999-04-28 |
EP0842995A1 (de) | 1998-05-20 |
DE19519499B4 (de) | 2005-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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