ES2124476T3 - Caja de plastico con alojamiento amortiguador de las vibraciones de un elemento bondable. - Google Patents

Caja de plastico con alojamiento amortiguador de las vibraciones de un elemento bondable.

Info

Publication number
ES2124476T3
ES2124476T3 ES95111825T ES95111825T ES2124476T3 ES 2124476 T3 ES2124476 T3 ES 2124476T3 ES 95111825 T ES95111825 T ES 95111825T ES 95111825 T ES95111825 T ES 95111825T ES 2124476 T3 ES2124476 T3 ES 2124476T3
Authority
ES
Spain
Prior art keywords
kindlable
vibrations
plastic box
cushioning
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95111825T
Other languages
English (en)
Inventor
Andreas Kuhnle
Joachim Ney
Norbert Dr Normann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Doduco Solutions GmbH
Original Assignee
Doduco GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doduco GmbH and Co filed Critical Doduco GmbH and Co
Application granted granted Critical
Publication of ES2124476T3 publication Critical patent/ES2124476T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Combined Devices Of Dampers And Springs (AREA)
  • Vibration Prevention Devices (AREA)

Abstract

SE DESCRIBE UNA CARCASA DE PLASTICO CON UN APOYO AMORTIGUADOR DE VIBRACION DE UN ELEMENTO (6) BONDERIZABLE, QUE ESTA UNIDO DE FORMA FIJA CON UN CUERPO (2) DE LA CARCASA (1) DE PLASTICO. ENTRE EL ELEMENTO (6) BONDERIZABLE Y EL CUERPO (2) DE LA CARCASA (1) DE PLASTICO SE INYECTA, SE DISPENSA O SE IMPRESIONA UN ELEMENTO (8A,8B) DE AMORTIGUACION A BASE DE MATERIAL ELASTICO.
ES95111825T 1994-08-10 1995-07-28 Caja de plastico con alojamiento amortiguador de las vibraciones de un elemento bondable. Expired - Lifetime ES2124476T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4428320A DE4428320A1 (de) 1994-08-10 1994-08-10 Kunststoffgehäuse mit einer schwingungsdämpfenden Lagerung eines bondbaren Elements

Publications (1)

Publication Number Publication Date
ES2124476T3 true ES2124476T3 (es) 1999-02-01

Family

ID=6525359

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95111825T Expired - Lifetime ES2124476T3 (es) 1994-08-10 1995-07-28 Caja de plastico con alojamiento amortiguador de las vibraciones de un elemento bondable.

Country Status (3)

Country Link
EP (1) EP0696880B1 (es)
DE (2) DE4428320A1 (es)
ES (1) ES2124476T3 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR0316301A (pt) * 2002-11-19 2005-09-27 Sony Ericsson Mobile Comm Ab Método para prover suporte para um componente eletrônico em um dispositivo eletrônico, e, dispositivo eletrônico
FR2882495B1 (fr) * 2005-02-22 2007-04-13 Magneti Marelli Systemes Elect Procede d'implantation d'un composant electronique sur un support pour augmenter la tenue de l'ensemble aux chocs et vibrations repetes

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2116353B1 (es) * 1970-10-19 1976-04-16 Ates Componenti Elettron
US3863881A (en) * 1973-09-10 1975-02-04 Nasa Shock absorbing mount for electrical components
US3922712A (en) * 1974-05-01 1975-11-25 Gen Motors Corp Plastic power semiconductor flip chip package
JPS6314473Y2 (es) * 1977-05-25 1988-04-22
DE2725260A1 (de) * 1977-06-03 1978-12-14 Nippon Electric Co Rahmen- und leiter-anordnung fuer ein halbleiterbauelement
DD237399A1 (de) * 1985-05-14 1986-07-09 Erfurt Mikroelektronik Chiptraeger fuer metallische leiterrahmen
JPS62194652A (ja) * 1986-02-21 1987-08-27 Hitachi Ltd 半導体装置
DD250809A1 (de) * 1986-07-01 1987-10-21 Erfurt Mikroelektronik Stabilisierter metallischer leiterrahmen fuer halbleiterbauelemente
US4833570A (en) * 1986-12-16 1989-05-23 Toyota Jidosha Kabushiki Kaisha Electronic circuit assembly
US4872937A (en) * 1988-07-14 1989-10-10 Gte Products Corporation Electrical component and method of mounting same
US5134247A (en) * 1989-02-21 1992-07-28 Cray Research Inc. Reduced capacitance chip carrier
US5227662A (en) * 1990-05-24 1993-07-13 Nippon Steel Corporation Composite lead frame and semiconductor device using the same
DE4041346B4 (de) * 1990-12-21 2005-10-06 Infineon Technologies Ag Standard-Kunststoffgehäuse mit darin verkapselten Halbleiterchips
JPH04282525A (ja) * 1991-03-11 1992-10-07 Toshiba Corp リレー装置
DE59300824D1 (de) * 1992-12-23 1995-11-30 Rheinmetall Ind Gmbh Spannungsfeste Elektronik-Baugruppe.

Also Published As

Publication number Publication date
EP0696880A3 (de) 1997-03-05
DE4428320A1 (de) 1996-02-15
EP0696880A2 (de) 1996-02-14
DE59503321D1 (de) 1998-10-01
EP0696880B1 (de) 1998-08-26

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