ES2121107T3 - Metodo de hacer blancos catodicos que comprenden silicio. - Google Patents

Metodo de hacer blancos catodicos que comprenden silicio.

Info

Publication number
ES2121107T3
ES2121107T3 ES94104644T ES94104644T ES2121107T3 ES 2121107 T3 ES2121107 T3 ES 2121107T3 ES 94104644 T ES94104644 T ES 94104644T ES 94104644 T ES94104644 T ES 94104644T ES 2121107 T3 ES2121107 T3 ES 2121107T3
Authority
ES
Spain
Prior art keywords
whites
include silicon
silicone
cathodic
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94104644T
Other languages
English (en)
Inventor
James Joseph Finley
Thomas Joseph Waynar
Larry Allen Miller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PPG Industries Inc
Original Assignee
PPG Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PPG Industries Inc filed Critical PPG Industries Inc
Application granted granted Critical
Publication of ES2121107T3 publication Critical patent/ES2121107T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K2035/008—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of silicium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/002—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of light metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/005—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a refractory metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/937—Sprayed metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12674—Ge- or Si-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Prevention Of Electric Corrosion (AREA)

Abstract

SE DESCUBRE UN METODO DE UNIR COMPOSICIONES QUE CONTIENEN SILICONA A SUPERFICIES METALICAS EN EL QUE UNA SUPERFICIE GRUESA QUE CONTIENE SILICONA SE PULVERIZA EN ARCO CON UNA PRIMERA CAPA ADHESIVA (12), UNA SEGUNDA CAPA SOLDABLE (14) Y UNA TERCERA CAPA SOLDADORA (16), Y ENTONCES SE SUELDA LA SUPERFICIE PULVERIZADA EN ARCO A LA SUPERFICIE METALICA. EL METODO ES PARTICULARMENTE UTIL PARA PRODUCIR FOCOS DE EMISION QUE CONTIENEN SILICONA PARA EL BOMBARDEO DE CATODOS.
ES94104644T 1993-04-02 1994-03-24 Metodo de hacer blancos catodicos que comprenden silicio. Expired - Lifetime ES2121107T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/042,185 US5965278A (en) 1993-04-02 1993-04-02 Method of making cathode targets comprising silicon

Publications (1)

Publication Number Publication Date
ES2121107T3 true ES2121107T3 (es) 1998-11-16

Family

ID=21920509

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94104644T Expired - Lifetime ES2121107T3 (es) 1993-04-02 1994-03-24 Metodo de hacer blancos catodicos que comprenden silicio.

Country Status (6)

Country Link
US (1) US5965278A (es)
EP (1) EP0623415B1 (es)
JP (1) JP3548221B2 (es)
KR (1) KR0160169B1 (es)
DE (1) DE69411448T2 (es)
ES (1) ES2121107T3 (es)

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JP3311282B2 (ja) * 1997-10-13 2002-08-05 株式会社東芝 金属部材の接合方法及び接合体
SE512906C2 (sv) * 1998-10-02 2000-06-05 Ericsson Telefon Ab L M Förfarande vid lödning av ett halvledarchip samt RF-power transistor för genomförande därav
US6517908B1 (en) * 2000-01-10 2003-02-11 Nec Electronics, Inc. Method for making a test wafer from a substrate
US6619537B1 (en) * 2000-06-12 2003-09-16 Tosoh Smd, Inc. Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers
KR100631275B1 (ko) * 2000-11-17 2006-10-02 닛코킨조쿠 가부시키가이샤 파티클 발생이 적은 스퍼터링 타겟트 또는 배킹 플레이트 및 파티클 발생이 적은 스퍼터링 방법
US6608432B2 (en) * 2001-04-03 2003-08-19 General Electric Company Cathode target mounting for cathodic arc cathodes
US6673220B2 (en) * 2001-05-21 2004-01-06 Sharp Laboratories Of America, Inc. System and method for fabricating silicon targets
WO2003084709A1 (de) * 2002-04-11 2003-10-16 Grillo-Werke Ag Verfahren zum verbinden von teilen
TWI269815B (en) * 2002-05-20 2007-01-01 Tosoh Smd Inc Replaceable target sidewall insert with texturing
WO2004065046A2 (en) * 2003-01-22 2004-08-05 Tosoh Smd, Inc. Brittle material sputtering target assembly and method of making same
US20090078570A1 (en) * 2003-08-11 2009-03-26 Wuwen Yi Target/backing plate constructions, and methods of forming target/backing plate constructions
US20080220558A1 (en) * 2007-03-08 2008-09-11 Integrated Photovoltaics, Inc. Plasma spraying for semiconductor grade silicon
US8498127B2 (en) * 2010-09-10 2013-07-30 Ge Intelligent Platforms, Inc. Thermal interface material for reducing thermal resistance and method of making the same
DE102011083791A1 (de) * 2011-09-29 2013-04-04 Robert Bosch Gmbh Verfahren zur Herstellung einer Lötverbindung
JP2015504479A (ja) * 2011-11-08 2015-02-12 トーソー エスエムディー，インク． 特別な表面処理及び優れた粒子性能を有するシリコンスパッターターゲット及びその製造方法
KR20140129018A (ko) 2012-02-14 2014-11-06 토소우 에스엠디, 인크 저편향 스퍼터링 타겟 조립체 및 그 제조 방법
JP5799154B2 (ja) * 2013-12-13 2015-10-21 Jx日鉱日石金属株式会社 スパッタリングターゲット及びその製造方法
CN113458523A (zh) * 2021-07-05 2021-10-01 宁波江丰电子材料股份有限公司 一种钽靶材组件的焊接方法

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US3922385A (en) * 1973-07-02 1975-11-25 Gen Motors Corp Solderable multilayer contact for silicon semiconductor
US4035526A (en) * 1975-08-20 1977-07-12 General Motors Corporation Evaporated solderable multilayer contact for silicon semiconductor
US4297391A (en) * 1979-01-16 1981-10-27 Solarex Corporation Method of applying electrical contacts to a photovoltaic cell
US4209375A (en) * 1979-08-02 1980-06-24 The United States Of America As Represented By The United States Department Of Energy Sputter target
DE2933835C2 (de) * 1979-08-21 1987-02-19 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Befestigen von in Scheiben- oder Plattenform vorliegenden Targetmaterialien auf Kühlteller für Aufstäubanlagen
US4320251A (en) * 1980-07-28 1982-03-16 Solamat Inc. Ohmic contacts for solar cells by arc plasma spraying
DE3039821A1 (de) * 1980-10-22 1982-06-03 Robert Bosch Gmbh, 7000 Stuttgart Mehrschichtsystem fuer waermeschutzanwendung
US4492812A (en) * 1981-07-08 1985-01-08 Solarex Corporation Electrical contacts for a solar cell
US4564743A (en) * 1982-01-20 1986-01-14 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Fusion welding of aluminum alloys
DE3318828C2 (de) * 1983-05-24 1986-01-02 Interpane Entwicklungs- und Beratungsgesellschaft mbH & Co. KG, 3471 Lauenförde Verfahren zum Aufbonden von Targetmaterial
US4511600A (en) * 1984-02-10 1985-04-16 Solarex Corporation Solar cell metal spray process
DE3417732A1 (de) * 1984-05-12 1986-07-10 Leybold-Heraeus GmbH, 5000 Köln Verfahren zum aufbringen von siliziumhaltigen schichten auf substraten durch katodenzerstaeubung und zerstaeubungskatode zur durchfuehrung des verfahrens
US5215639A (en) * 1984-10-09 1993-06-01 Genus, Inc. Composite sputtering target structures and process for producing such structures
US4716086A (en) * 1984-12-19 1987-12-29 Ppg Industries, Inc. Protective overcoat for low emissivity coated article
US4690871A (en) * 1986-03-10 1987-09-01 Gordon Roy G Protective overcoat of titanium nitride films
US4847157A (en) * 1986-08-28 1989-07-11 Libbey-Owens-Ford Co. Glass coating method and resulting article
US4769291A (en) * 1987-02-02 1988-09-06 The Boc Group, Inc. Transparent coatings by reactive sputtering
DE3716860A1 (de) * 1987-03-13 1988-09-22 Flachglas Ag Verfahren zum herstellen einer vorgespannten und/oder gebogenen glasscheibe mit silberschicht, danach hergestellte glasscheibe sowie deren verwendung
JPS63242948A (ja) * 1987-03-31 1988-10-07 Asahi Glass Co Ltd 熱線反射ガラス
GB8717959D0 (en) * 1987-07-29 1987-09-03 Pilkington Brothers Plc Coated glass
DE3902596A1 (de) * 1989-01-28 1990-08-02 Flachglas Ag Verfahren zum herstellen einer vorgespannten oder gebogenen glasscheibe mit rueckseitiger beschichtung, danach hergestellte glasscheibe sowie deren verwendung
DE3906453A1 (de) * 1989-03-01 1990-09-06 Leybold Ag Verfahren zum beschichten von substraten aus durchscheinendem werkstoff, beispielsweise aus floatglas
US5170291A (en) * 1989-12-19 1992-12-08 Leybold Aktiengesellschaft Coating, composed of an optically effective layer system, for substrates, whereby the layer system has a high anti-reflective effect, and method for manufacturing the coating
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US5185183A (en) * 1992-01-10 1993-02-09 Westinghouse Electric Corp. Apparatus and method for blasting and metal spraying a cylindrical surface

Also Published As

Publication number Publication date
JP3548221B2 (ja) 2004-07-28
JPH06346215A (ja) 1994-12-20
EP0623415B1 (en) 1998-07-08
DE69411448D1 (de) 1998-08-13
US5965278A (en) 1999-10-12
KR0160169B1 (ko) 1999-01-15
DE69411448T2 (de) 1999-01-28
EP0623415A1 (en) 1994-11-09

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