ES2113137T3 - Conmutador electronico bajo carga para vehiculos de motor. - Google Patents

Conmutador electronico bajo carga para vehiculos de motor.

Info

Publication number
ES2113137T3
ES2113137T3 ES95107902T ES95107902T ES2113137T3 ES 2113137 T3 ES2113137 T3 ES 2113137T3 ES 95107902 T ES95107902 T ES 95107902T ES 95107902 T ES95107902 T ES 95107902T ES 2113137 T3 ES2113137 T3 ES 2113137T3
Authority
ES
Spain
Prior art keywords
motor vehicles
electronic switch
under load
switch under
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95107902T
Other languages
English (en)
Inventor
Petrik Dr Lange
Volker Jenss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hella GmbH and Co KGaA
Original Assignee
Hella KGaA Huek and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hella KGaA Huek and Co filed Critical Hella KGaA Huek and Co
Application granted granted Critical
Publication of ES2113137T3 publication Critical patent/ES2113137T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/4901—Structure
    • H01L2224/4903—Connectors having different sizes, e.g. different diameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Abstract

SE DESCRIBE UN INTERRUPTOR DE CARGA ELECTRONICO, QUE ES ELABORABLE DE FORMA SENCILLA Y CON COSTE ADECUADO, ASI COMO PUEDE SER UTILIZADO EN BASE A LA DISPOSICION (7) DE CONTACTOS DE ENCHUFE. ES ESPECIALMENTE VENTAJOSO EN PARTICULAR PARA PROBLEMAS DE EVACUACION TERMICA A PARTIR DEL INTERRUPTOR DE POTENCIA ELECTRONICO, EN DONDE SE DISPONE ACOPLADO DE FORMA TERMICA Y ELECTRICA DIRECTAMENTE EN EL SOPORTE (1) DE BOBINADO CONFIGURADO EN LA DISPOSICION (7) DE CONTACTO DE ENCHUFE.
ES95107902T 1994-05-31 1995-05-24 Conmutador electronico bajo carga para vehiculos de motor. Expired - Lifetime ES2113137T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19944419005 DE4419005A1 (de) 1994-05-31 1994-05-31 Elektronischer Lastschalter für Kraftfahrzeuge

Publications (1)

Publication Number Publication Date
ES2113137T3 true ES2113137T3 (es) 1998-04-16

Family

ID=6519442

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95107902T Expired - Lifetime ES2113137T3 (es) 1994-05-31 1995-05-24 Conmutador electronico bajo carga para vehiculos de motor.

Country Status (4)

Country Link
US (1) US5740002A (es)
EP (1) EP0685939B1 (es)
DE (2) DE4419005A1 (es)
ES (1) ES2113137T3 (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19522126C2 (de) * 1995-06-19 1999-01-28 Hella Kg Hueck & Co Elektronischer Lastschalter für ein Kraftfahrzeug, beispielsweise Blinkgeber
DE19733047A1 (de) * 1997-07-31 1999-02-18 Fahrzeugklimaregelung Gmbh Regler für einen Elektromotor mit Regelschaltung und Leistungshalbleiter
DE19943258A1 (de) * 1999-09-10 2001-03-15 Hella Kg Hueck & Co Elektronisches Gerät für ein Kraftfahrzeug
DE10013459A1 (de) * 2000-03-17 2001-09-27 Compact Dynamics Gmbh Schaltungsanordnung zum Betreiben von elektrischen oder elektronischen Komponenten in einem Kraftfahrzeug mit einem Zwei-Spannungs-Bordnetz
US7151353B2 (en) * 2000-09-18 2006-12-19 Abb Ab Switching device
DE10231219C1 (de) * 2002-07-11 2003-05-22 Semikron Elektronik Gmbh Druckkontaktiertes Halbleiterrelais
DE10325371A1 (de) * 2003-05-23 2004-12-16 Alcoa Fujikura Gesellschaft mit beschränkter Haftung Steuereinrichtung
DE102004042488A1 (de) 2004-08-31 2006-03-16 Siemens Ag Elektrische Baugruppe
US7109833B1 (en) * 2005-07-29 2006-09-19 Rockwell Automation Technologies, Inc. Terminal block time delay relay
DE102006061064B4 (de) * 2006-12-22 2012-11-22 Lisa Dräxlmaier GmbH Schaltkreis zur Bordnetzstabilisierung
DE102007056581A1 (de) * 2007-11-23 2009-06-10 Behr-Hella Thermocontrol Gmbh Vorrichtung zur Ansteuerung eines elektrischen Verbrauchers, insbesondere eines Kfz-Gebläsemotors
DE102009029476B4 (de) 2009-09-15 2012-11-08 Lisa Dräxlmaier GmbH Elektronische Vorrichtung zum Schalten von Strömen und Herstellungsverfahren für dieselbe
US9406457B2 (en) 2011-05-19 2016-08-02 Black & Decker Inc. Electronic switching module for a power tool
DE102012216949B4 (de) * 2012-09-21 2023-05-04 Vitesco Technologies GmbH Bauelementträger, elektrotechnische Baueinheit mit Bauelementträger und Verfahren zur Herstellung eines Bauelementträgers
US10608501B2 (en) 2017-05-24 2020-03-31 Black & Decker Inc. Variable-speed input unit having segmented pads for a power tool
TR201709266A2 (tr) 2017-06-21 2019-01-21 Temsa Ulasim Araclari Sanayi Ve Ticaret Anonim Sirketi Elektri̇kli̇ araçlarda bi̇r voltaj kontrol yöntemi̇
DE202018101472U1 (de) 2017-07-17 2018-10-24 Electro Terminal GmbH & Co. KG Leuchtenanschlussklemme mit integrierter Elektronik

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES173736Y (es) * 1971-10-29 1972-12-16 Fagor Electrotecnica, S. C. I. Rectificador perfeccionado.
DE3130324A1 (de) * 1981-07-31 1983-02-17 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
JPS5972757A (ja) * 1982-10-20 1984-04-24 Fujitsu Ltd 半導体装置
DE3306120A1 (de) * 1983-02-19 1984-08-23 Gotthard 1000 Berlin Schulte-Tigges Fertigungsverfahren fuer elektrische schaltungen
JPS6387757A (ja) * 1986-10-01 1988-04-19 Hitachi Ltd 半導体装置
US4879633A (en) * 1988-04-12 1989-11-07 Kaufman Lance R Direct bond circuit assembly with ground plane
DE4005809A1 (de) * 1990-02-23 1991-08-29 Siemens Ag Regler-baustein fuer die ansteuerung von relais
JP2708320B2 (ja) * 1992-04-17 1998-02-04 三菱電機株式会社 マルチチップ型半導体装置及びその製造方法
DE9307386U1 (de) * 1993-05-14 1993-09-02 Siemens Ag Schaltungsanordnung mit einem elektronischen Leistungsschalter

Also Published As

Publication number Publication date
US5740002A (en) 1998-04-14
EP0685939B1 (de) 1998-02-25
DE59501475D1 (de) 1998-04-02
EP0685939A1 (de) 1995-12-06
DE4419005A1 (de) 1995-12-07

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