ES2104287T3 - Aparato y metodo para aplicar un recubrimiento de flujo de soldador a un tablero de circuito impreso. - Google Patents

Aparato y metodo para aplicar un recubrimiento de flujo de soldador a un tablero de circuito impreso.

Info

Publication number
ES2104287T3
ES2104287T3 ES94307969T ES94307969T ES2104287T3 ES 2104287 T3 ES2104287 T3 ES 2104287T3 ES 94307969 T ES94307969 T ES 94307969T ES 94307969 T ES94307969 T ES 94307969T ES 2104287 T3 ES2104287 T3 ES 2104287T3
Authority
ES
Spain
Prior art keywords
circuit board
applying
printed circuit
flow coating
welding flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94307969T
Other languages
English (en)
Inventor
Patrick T Hogan
Richard G Christyson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nordson Corp
Original Assignee
Nordson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nordson Corp filed Critical Nordson Corp
Application granted granted Critical
Publication of ES2104287T3 publication Critical patent/ES2104287T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/12—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus
    • B05B12/122—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus responsive to presence or shape of target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/02—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery
    • B05B12/06—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery for effecting pulsating flow
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/60—Arrangements for mounting, supporting or holding spraying apparatus
    • B05B15/68—Arrangements for adjusting the position of spray heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Spray Control Apparatus (AREA)

Abstract

APARATO Y METODOS PARA UN SISTEMA Y PROCESO PARA APLICAR UN FLUJO DE CUBIERTA A UNA PLACA DE CIRCUITO PARA IMPULSAR UN PISTOLETE DE PULVERIZACION SIN AIRE SOBRE, Y PARA, CONSEGUIR EXCELENTE PENETRACION DE TALADROS A TRAVES DE PLACA DE CIRCUITO Y ESPESOR UNIFORME DE PELICULA. SE PROPORCIONA UN SISTEMA DE RECOLECCION DEL EXCESO DE PULVERIZADO QUE REDUCE LA SUPERPULVERIZACION E INCREMENTA LA UTILIZACION DEL MATERIAL Y EFICIENCIA DE TRANSFERENCIA. UN MECANISMO DE COLOCACION DEL PISTOLETE, QUE PUEDE SER AUTOMATIZADO, LOCALIZA CON SEGURIDAD EL PISTOLETE EN RELACION A LA PLACA DE CIRCUITO.
ES94307969T 1993-11-04 1994-10-28 Aparato y metodo para aplicar un recubrimiento de flujo de soldador a un tablero de circuito impreso. Expired - Lifetime ES2104287T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/146,924 US5368219A (en) 1993-11-04 1993-11-04 Method and apparatus for applying solder flux to a printed circuit

Publications (1)

Publication Number Publication Date
ES2104287T3 true ES2104287T3 (es) 1997-10-01

Family

ID=22519592

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94307969T Expired - Lifetime ES2104287T3 (es) 1993-11-04 1994-10-28 Aparato y metodo para aplicar un recubrimiento de flujo de soldador a un tablero de circuito impreso.

Country Status (8)

Country Link
US (2) US5368219A (es)
EP (1) EP0652068B1 (es)
JP (1) JPH07176858A (es)
KR (1) KR100259672B1 (es)
CA (1) CA2118206A1 (es)
DE (1) DE69403044T2 (es)
ES (1) ES2104287T3 (es)
TW (1) TW356644B (es)

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US5723796A (en) * 1995-12-06 1998-03-03 Cypress Semiconductor Corp. Atomized flux application to simulate soldering
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DE19928607A1 (de) * 1998-11-24 2000-05-25 Wagner Gmbh J Pulverbeschichtungsanlage
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US6904673B1 (en) * 2002-09-24 2005-06-14 International Business Machines Corporation Control of flux by ink stop line in chip joining
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JP2006269599A (ja) * 2005-03-23 2006-10-05 Sony Corp パターン形成方法、有機電界効果型トランジスタの製造方法、及び、フレキシブルプリント回路板の製造方法
JP2006334614A (ja) * 2005-05-31 2006-12-14 Mitsubishi Alum Co Ltd アルミニウム材塗布方法
DE102006036773A1 (de) * 2006-08-07 2008-02-14 Seho Systemtechnik Gmbh Vorrichtung zum gesteuerten Verschieben einer Spritzdüse zu einzelnen Spritzpunkten, insbesondere zum Aufspritzen von Flussmitteln in Schwalllötanlagen
EP2299501A1 (en) * 2009-09-16 2011-03-23 3S Industries AG Method and apparatus for providing a solar cell with a solder ribbon
CN102489421A (zh) * 2011-10-17 2012-06-13 杜星光 一种选择性喷雾机
CN105032727A (zh) * 2013-05-30 2015-11-11 卢卡斯米尔霍特公司 用于焊剂涂布钎焊预制件和分离式部件的方法
CN203803741U (zh) * 2014-03-04 2014-09-03 华为终端有限公司 辅助点胶装置
CN105171283A (zh) * 2015-09-17 2015-12-23 贵州雅光电子科技股份有限公司 一种助焊剂喷洒装置及其使用方法
KR101593378B1 (ko) * 2015-10-23 2016-02-12 선호경 Pcb 도금액 분사장치
CN106140521B (zh) * 2016-08-29 2018-09-21 浙江富胜达科技有限公司 一种气动旋转式地面环保喷洒装置
CN107694802B (zh) * 2017-10-10 2019-04-26 江苏古柏包装科技有限公司 一种汽水瓶表面包装喷漆装置
US10939600B2 (en) * 2018-11-28 2021-03-02 International Business Machines Corporation Flux residue detection
CN111570126B (zh) * 2020-06-15 2024-02-09 杭州纬昌新材料有限公司 用于瓶口封口垫中环形铝粉涂层的涂覆设备及涂覆方法
CN111957466B (zh) * 2020-08-13 2021-08-27 南京幸庄科技创新产业园管理有限公司 一种不锈钢橱柜台面防腐防锈涂层制作加工工艺

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Also Published As

Publication number Publication date
EP0652068B1 (en) 1997-05-07
DE69403044T2 (de) 1997-10-09
CA2118206A1 (en) 1995-05-05
JPH07176858A (ja) 1995-07-14
EP0652068A1 (en) 1995-05-10
KR100259672B1 (ko) 2000-06-15
TW356644B (en) 1999-04-21
US5415337A (en) 1995-05-16
DE69403044D1 (de) 1997-06-12
US5368219A (en) 1994-11-29
KR950016466A (ko) 1995-06-17

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