ES2101074T3 - Diodo emisor de luz encapsulado y metodo para encapsular el mismo. - Google Patents

Diodo emisor de luz encapsulado y metodo para encapsular el mismo.

Info

Publication number
ES2101074T3
ES2101074T3 ES92810786T ES92810786T ES2101074T3 ES 2101074 T3 ES2101074 T3 ES 2101074T3 ES 92810786 T ES92810786 T ES 92810786T ES 92810786 T ES92810786 T ES 92810786T ES 2101074 T3 ES2101074 T3 ES 2101074T3
Authority
ES
Spain
Prior art keywords
light emitting
encapsulating
same
emitting diode
encapsulated light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92810786T
Other languages
English (en)
Inventor
Ronald F Dr Broom
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of ES2101074T3 publication Critical patent/ES2101074T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Lasers (AREA)
  • Led Device Packages (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Devices (AREA)

Abstract

ENCAPSULAMIENTO DE DIODOS (40) SEMICONDUCTORES QUE EMITEN LUZ, EN PARTICULAR DIODOS LASER, CARACTERIZADOS POR QUE UNA DISCONTINUIDAD (47) ESTA FORMADA EN UN ENCAPSULANTE (45), EL CUAL ESTA SITUADO DELANTE DE LA FACETA EMISORA DE LUZ DEL DIODO (40), EVITANDO DICHA DISCONTINUIDAD QUE EL ENCAPSULANTE (45) SE ADHIERA A ESTA FACETA.
ES92810786T 1992-10-14 1992-10-14 Diodo emisor de luz encapsulado y metodo para encapsular el mismo. Expired - Lifetime ES2101074T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP92810786A EP0592746B1 (en) 1992-10-14 1992-10-14 Encapsulated light emitting diode and method for encapsulating the same

Publications (1)

Publication Number Publication Date
ES2101074T3 true ES2101074T3 (es) 1997-07-01

Family

ID=8212005

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92810786T Expired - Lifetime ES2101074T3 (es) 1992-10-14 1992-10-14 Diodo emisor de luz encapsulado y metodo para encapsular el mismo.

Country Status (5)

Country Link
EP (1) EP0592746B1 (es)
JP (1) JP2501004B2 (es)
AT (1) ATE150593T1 (es)
DE (1) DE69218431T2 (es)
ES (1) ES2101074T3 (es)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07170019A (ja) * 1993-12-14 1995-07-04 Fuji Electric Co Ltd 半導体レーザ装置
US5488623A (en) * 1990-11-07 1996-01-30 Fuji Electric Co., Ltd. Mold-type semiconductor laser device with reduced light-emitting point displacement during operation
US5485479A (en) * 1990-11-07 1996-01-16 Fuji Electric Co., Ltd. Semiconductor laser device encapsulated in a transparent resin layer
DE19841204A1 (de) * 1998-09-09 2000-03-23 Siemens Ag Anordnung mit lichtemittierendem Leistungshalbleiterbauelement sowie Verfahren zur Herstellung derselben
DE19939364B4 (de) * 1999-08-19 2005-02-03 Tyco Electronics Logistics Ag Verfahren und Gießform zum Herstellen eines elektrooptischen Bauteils
US20050179041A1 (en) * 2004-02-18 2005-08-18 Lumileds Lighting U.S., Llc Illumination system with LEDs
DE102012103633B4 (de) * 2012-04-25 2020-08-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierende Vorrichtung und Verfahren zum Herstellen einer derartigen Vorrichtung
US9976710B2 (en) 2013-10-30 2018-05-22 Lilibrand Llc Flexible strip lighting apparatus and methods
US10132476B2 (en) 2016-03-08 2018-11-20 Lilibrand Llc Lighting system with lens assembly
WO2018140727A1 (en) 2017-01-27 2018-08-02 Lilibrand Llc Lighting systems with high color rendering index and uniform planar illumination
US20180328552A1 (en) 2017-03-09 2018-11-15 Lilibrand Llc Fixtures and lighting accessories for lighting devices
DE102017105235B4 (de) 2017-03-13 2022-06-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauelement mit Verstärkungsschicht und Verfahren zur Herstellung eines Bauelements
CN114981592B (zh) 2018-05-01 2024-08-09 克鲁斯有限公司 具有中央硅酮模块的照明系统及装置
DE102018117518A1 (de) 2018-07-19 2020-01-23 Osram Opto Semiconductors Gmbh Halbleiterlaser
WO2020131933A1 (en) 2018-12-17 2020-06-25 Lilibrand Llc Strip lighting systems which comply with ac driving power
CN115949922B (zh) * 2022-12-26 2024-03-01 滨海治润电子有限公司 一种新型二极管

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5229749A (en) * 1975-09-02 1977-03-05 Mitsubishi Electric Corp Optical equipment and its manufacturing process
JPS5313885A (en) * 1976-07-23 1978-02-07 Mitsubishi Electric Corp Semiconductor light emitting device
FR2466784A1 (fr) * 1979-10-05 1981-04-10 Thomson Csf Tete de couplage opto-electronique, et procede de montage d'une telle tete
DE3016103A1 (de) * 1980-04-25 1981-10-29 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung transparenter geissharze
JPS57144508A (en) * 1981-02-28 1982-09-07 Matsushita Electric Works Ltd Coupling method between light emitting matter and optical fiber
NL8303316A (nl) * 1983-09-28 1985-04-16 Philips Nv Werkwijze voor het vervaardigen van een inrichting voor het uitzenden van licht.
EP0374121A3 (de) * 1988-12-16 1991-01-16 RSF-Elektronik Gesellschaft m.b.H. Leuchtdiode
JP2792722B2 (ja) * 1990-07-16 1998-09-03 三菱電機株式会社 半導体発光装置

Also Published As

Publication number Publication date
JPH06204622A (ja) 1994-07-22
DE69218431T2 (de) 1997-09-25
ATE150593T1 (de) 1997-04-15
EP0592746A1 (en) 1994-04-20
JP2501004B2 (ja) 1996-05-29
EP0592746B1 (en) 1997-03-19
DE69218431D1 (de) 1997-04-24

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