ES2099696T3 - Metodo para procesar dispositivos electronicos encapsulados en plastico. - Google Patents
Metodo para procesar dispositivos electronicos encapsulados en plastico.Info
- Publication number
- ES2099696T3 ES2099696T3 ES89313408T ES89313408T ES2099696T3 ES 2099696 T3 ES2099696 T3 ES 2099696T3 ES 89313408 T ES89313408 T ES 89313408T ES 89313408 T ES89313408 T ES 89313408T ES 2099696 T3 ES2099696 T3 ES 2099696T3
- Authority
- ES
- Spain
- Prior art keywords
- plastic
- oven
- electronic devices
- temperature
- processing plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title abstract 3
- 239000004020 conductor Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
EL INVENTO SE REFIERE A UN METODO PARA PROCESAMIENTO DE UN DISPOSITIVO ELECTRONICO EMBALADO EN PLASTICO ANTES DE CONECTAR DICHO DISPOSITIVO MEDIANTE SOLDEO A UN TARJETA DE CIRCUITO IMPRESO. EL DISPOSITIVO TIENE CONDUCTORES SOLDADOS PARA CONEXION A LA TARJETA DE CIRCUITO IMPRESO, LA SUELDA DE LOS CONDUCTORES TIENE UN TEMPERATURA CRITICA DE APROXIMADAMENTE 60 GRADOS CENTIGRADOS QUE SI SE EXCEDE PRODUCE QUE LA SUELDA ESTE EXPUESTA A OXIDACION. EL METODO INCLUYE LAS FASES DE COLOCACION DEL DISPOSITIVO EN UN HORNO, REDUCIENDO LA TEMPERATURA EN EL HORNO A MENOS DQUE 35 TORR, Y CALENTANDO EL DISPOSITIVO A UNA TEMPERATURA ENTRE LOS 30 Y 35 GRADOS CENTIGRADOS PARA EXPELER LA HUMEDAD ABSORBIDA POR EL MATERIAL DE ENCAPSULAMIENTO DEL DISPOSITIVO. EL DISPOSITIVO SE TRANSPORTA MEDIANTE UNA PORTADORA PLASTICA CUANDO SE COLOCA EN EL HORNO, LA PORTADORA ES UN TUBO DE PLASTICO EN EL QUE SE INSTALA EL DISPOSITIVO, O UNA CINTA PLASTICA A LA QUE SE ADHIERE EL DISPOSITIVO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/289,858 US4951400A (en) | 1988-12-27 | 1988-12-27 | Method for processing plastic packaged electronic devices |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2099696T3 true ES2099696T3 (es) | 1997-06-01 |
Family
ID=23113417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES89313408T Expired - Lifetime ES2099696T3 (es) | 1988-12-27 | 1989-12-21 | Metodo para procesar dispositivos electronicos encapsulados en plastico. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4951400A (es) |
EP (1) | EP0376620B1 (es) |
JP (1) | JP2747931B2 (es) |
CA (1) | CA1297209C (es) |
DE (1) | DE68927977T2 (es) |
ES (1) | ES2099696T3 (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5262594A (en) * | 1990-10-12 | 1993-11-16 | Compaq Computer Corporation | Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same |
US6202917B1 (en) * | 1998-08-19 | 2001-03-20 | Hughes Electronics Corporation | Co-processing of adhesive curing and solder reflow in an electronic assembly operation |
JP3714088B2 (ja) * | 1999-02-18 | 2005-11-09 | 株式会社村田製作所 | 電子部品及びその製造方法 |
US6054682A (en) * | 1999-03-11 | 2000-04-25 | Micron Electronics, Inc. | Method and system for reducing water vapor in integrated circuit packages prior to reflow |
JP2001237585A (ja) * | 2000-02-22 | 2001-08-31 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
JP3598255B2 (ja) * | 2000-03-17 | 2004-12-08 | シャープ株式会社 | 半導体装置のベーク方法 |
JP4105409B2 (ja) * | 2001-06-22 | 2008-06-25 | 株式会社ルネサステクノロジ | マルチチップモジュールの製造方法 |
JP2007027623A (ja) * | 2005-07-21 | 2007-02-01 | Fuji Electric Device Technology Co Ltd | 基板吸着水分の除去方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3815251A (en) * | 1972-03-10 | 1974-06-11 | Gelder A Van | Method for vacuum dehydration |
US4239485A (en) * | 1979-02-16 | 1980-12-16 | Raychem Corporation | Taped products processor |
US4612710A (en) * | 1984-09-20 | 1986-09-23 | Bio-Rad Laboratories, Inc. | Method and apparatus for drying gel slabs |
US4777520A (en) * | 1986-03-27 | 1988-10-11 | Oki Electric Industry Co. Ltd. | Heat-resistant plastic semiconductor device |
JPH02137393A (ja) * | 1988-11-18 | 1990-05-25 | Nec Corp | 半導体装置の実装方法 |
-
1988
- 1988-12-27 US US07/289,858 patent/US4951400A/en not_active Expired - Lifetime
-
1989
- 1989-09-21 CA CA000612259A patent/CA1297209C/en not_active Expired - Lifetime
- 1989-12-21 DE DE68927977T patent/DE68927977T2/de not_active Expired - Fee Related
- 1989-12-21 EP EP89313408A patent/EP0376620B1/en not_active Expired - Lifetime
- 1989-12-21 ES ES89313408T patent/ES2099696T3/es not_active Expired - Lifetime
- 1989-12-26 JP JP1335268A patent/JP2747931B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4951400A (en) | 1990-08-28 |
DE68927977T2 (de) | 1997-11-27 |
JP2747931B2 (ja) | 1998-05-06 |
CA1297209C (en) | 1992-03-10 |
EP0376620A2 (en) | 1990-07-04 |
DE68927977D1 (de) | 1997-05-28 |
EP0376620A3 (en) | 1991-07-31 |
JPH02226794A (ja) | 1990-09-10 |
EP0376620B1 (en) | 1997-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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