GB2076141B - A cooling device for discrete electronic components and/or circuit boards on which components are mounted - Google Patents

A cooling device for discrete electronic components and/or circuit boards on which components are mounted

Info

Publication number
GB2076141B
GB2076141B GB8113327A GB8113327A GB2076141B GB 2076141 B GB2076141 B GB 2076141B GB 8113327 A GB8113327 A GB 8113327A GB 8113327 A GB8113327 A GB 8113327A GB 2076141 B GB2076141 B GB 2076141B
Authority
GB
United Kingdom
Prior art keywords
components
cooling device
circuit boards
discrete electronic
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8113327A
Other versions
GB2076141A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of GB2076141A publication Critical patent/GB2076141A/en
Application granted granted Critical
Publication of GB2076141B publication Critical patent/GB2076141B/en
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB8113327A 1980-05-13 1981-04-30 A cooling device for discrete electronic components and/or circuit boards on which components are mounted Expired GB2076141B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8003579A SE8003579L (en) 1980-05-13 1980-05-13 COOLING DEVICE FOR DISCRETE OR PCB MOUNTED ELECTRONIC COMPONENTS

Publications (2)

Publication Number Publication Date
GB2076141A GB2076141A (en) 1981-11-25
GB2076141B true GB2076141B (en) 1984-03-07

Family

ID=20340958

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8113327A Expired GB2076141B (en) 1980-05-13 1981-04-30 A cooling device for discrete electronic components and/or circuit boards on which components are mounted

Country Status (4)

Country Link
DE (1) DE3117758A1 (en)
GB (1) GB2076141B (en)
IT (1) IT1137472B (en)
SE (1) SE8003579L (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2151769B (en) * 1983-12-21 1987-11-04 Marconi Electronic Devices Heat sink arrangement
WO1989002569A1 (en) * 1987-09-09 1989-03-23 Hasler Ag Thermosiphon
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
DE4121534C2 (en) * 1990-06-30 1998-10-08 Toshiba Kawasaki Kk Cooler
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
FI110030B (en) * 1998-02-19 2002-11-15 Nokia Corp A heat exchanger based on thermal energy binding to a working material and a process for producing a heat exchanger based on thermal energy binding to a working material
US6935409B1 (en) 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
US6981322B2 (en) 1999-06-08 2006-01-03 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
FR2796518B1 (en) * 1999-07-15 2001-11-23 Henri Maurice Benmussa SELF-CONTAINED ELECTRONIC ASSEMBLY INCLUDING ELECTRONIC CARDS SUBJECT TO A FRAME
DE19960840A1 (en) * 1999-12-16 2001-07-05 Siemens Ag Electronic power circuit with flat heat sink device
GB0014809D0 (en) * 2000-06-19 2000-08-09 Black & Decker Inc Belt sander
FR2827115B1 (en) 2001-07-06 2003-09-05 Alstom BOX FOR POWER CONVERTER
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
US7857037B2 (en) 2001-11-27 2010-12-28 Thermotek, Inc. Geometrically reoriented low-profile phase plane heat pipes
US7198096B2 (en) 2002-11-26 2007-04-03 Thermotek, Inc. Stacked low profile cooling system and method for making same
JP4371210B2 (en) 2003-12-05 2009-11-25 日本電気株式会社 Electronic unit and heat dissipation structure
IT1404289B1 (en) 2010-12-27 2013-11-15 Itaco S R L Ora Reel S R L COOLING DEVICE FOR ELECTRONIC COMPONENTS AS WELL AS THE CONTROL DEVICE INCORPORATING SUCH DEVICE
CN102984922B (en) * 2012-11-12 2016-01-20 中国航空工业集团公司第六三一研究所 Module heat dissipation structure
CN104334005B (en) * 2014-11-28 2017-01-25 成都泰格微波技术股份有限公司 Totally-sealed cooling chamber

Also Published As

Publication number Publication date
SE8003579L (en) 1981-11-14
DE3117758A1 (en) 1982-01-21
GB2076141A (en) 1981-11-25
IT1137472B (en) 1986-09-10
IT8121675A0 (en) 1981-05-13

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Effective date: 20010429