SE8003579L - COOLING DEVICE FOR DISCRETE OR PCB MOUNTED ELECTRONIC COMPONENTS - Google Patents

COOLING DEVICE FOR DISCRETE OR PCB MOUNTED ELECTRONIC COMPONENTS

Info

Publication number
SE8003579L
SE8003579L SE8003579A SE8003579A SE8003579L SE 8003579 L SE8003579 L SE 8003579L SE 8003579 A SE8003579 A SE 8003579A SE 8003579 A SE8003579 A SE 8003579A SE 8003579 L SE8003579 L SE 8003579L
Authority
SE
Sweden
Prior art keywords
plate
flanges
channels
cavity
tapering
Prior art date
Application number
SE8003579A
Other languages
Unknown language ( )
Swedish (sv)
Inventor
F Andersson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE8003579A priority Critical patent/SE8003579L/en
Priority to GB8113327A priority patent/GB2076141B/en
Priority to DE19813117758 priority patent/DE3117758A1/en
Priority to IT21675/81A priority patent/IT1137472B/en
Publication of SE8003579L publication Critical patent/SE8003579L/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The device comprises a hermetically sealed space containing a vapourisable medium, the space being provided by a cooling plate with a cooling flange member (5) attached to the upper portion of the plate, the member being provided with tapering flanges (51-54) and having its interior formed with an upwardly tapering cavity (6). The cooling plate, to which the components to be cooled are attached, comprises two mutually parallel flat walls (1, 2) which contain at least one cavity in the form of channels from the upper portion of the plate to its lower portion, and sealing means (7) for the channels at the lower part of the plate, the lower part of the tapering cavity (6) opening out into the channels. The flanges (51- 54) on one side of the tapering cavity (6) are offset from those on the opposite side whereby flanges on each side can partially engage in spaces between flanges of an adjacent cooling device. <IMAGE>
SE8003579A 1980-05-13 1980-05-13 COOLING DEVICE FOR DISCRETE OR PCB MOUNTED ELECTRONIC COMPONENTS SE8003579L (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE8003579A SE8003579L (en) 1980-05-13 1980-05-13 COOLING DEVICE FOR DISCRETE OR PCB MOUNTED ELECTRONIC COMPONENTS
GB8113327A GB2076141B (en) 1980-05-13 1981-04-30 A cooling device for discrete electronic components and/or circuit boards on which components are mounted
DE19813117758 DE3117758A1 (en) 1980-05-13 1981-05-05 COOLING DEVICE FOR DISCRETE ELECTRONIC COMPONENTS AND / OR CIRCUIT BOARDS ON WHICH THE COMPONENTS ARE MOUNTED
IT21675/81A IT1137472B (en) 1980-05-13 1981-05-13 COOLING DEVICE FOR ELECTRONIC COMPONENTS AND / OR FOR PANELS OF CIRCUITS ON WHICH THE COMPONENTS ARE MOTORIZED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8003579A SE8003579L (en) 1980-05-13 1980-05-13 COOLING DEVICE FOR DISCRETE OR PCB MOUNTED ELECTRONIC COMPONENTS

Publications (1)

Publication Number Publication Date
SE8003579L true SE8003579L (en) 1981-11-14

Family

ID=20340958

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8003579A SE8003579L (en) 1980-05-13 1980-05-13 COOLING DEVICE FOR DISCRETE OR PCB MOUNTED ELECTRONIC COMPONENTS

Country Status (4)

Country Link
DE (1) DE3117758A1 (en)
GB (1) GB2076141B (en)
IT (1) IT1137472B (en)
SE (1) SE8003579L (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2151769B (en) * 1983-12-21 1987-11-04 Marconi Electronic Devices Heat sink arrangement
WO1989002569A1 (en) * 1987-09-09 1989-03-23 Hasler Ag Thermosiphon
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
DE4121534C2 (en) * 1990-06-30 1998-10-08 Toshiba Kawasaki Kk Cooler
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
FI110030B (en) * 1998-02-19 2002-11-15 Nokia Corp A heat exchanger based on thermal energy binding to a working material and a process for producing a heat exchanger based on thermal energy binding to a working material
US6935409B1 (en) 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
US6981322B2 (en) 1999-06-08 2006-01-03 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
FR2796518B1 (en) * 1999-07-15 2001-11-23 Henri Maurice Benmussa SELF-CONTAINED ELECTRONIC ASSEMBLY INCLUDING ELECTRONIC CARDS SUBJECT TO A FRAME
DE19960840A1 (en) * 1999-12-16 2001-07-05 Siemens Ag Electronic power circuit with flat heat sink device
GB0014809D0 (en) * 2000-06-19 2000-08-09 Black & Decker Inc Belt sander
FR2827115B1 (en) 2001-07-06 2003-09-05 Alstom BOX FOR POWER CONVERTER
US7198096B2 (en) 2002-11-26 2007-04-03 Thermotek, Inc. Stacked low profile cooling system and method for making same
US7857037B2 (en) 2001-11-27 2010-12-28 Thermotek, Inc. Geometrically reoriented low-profile phase plane heat pipes
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
JP4371210B2 (en) 2003-12-05 2009-11-25 日本電気株式会社 Electronic unit and heat dissipation structure
IT1404289B1 (en) 2010-12-27 2013-11-15 Itaco S R L Ora Reel S R L COOLING DEVICE FOR ELECTRONIC COMPONENTS AS WELL AS THE CONTROL DEVICE INCORPORATING SUCH DEVICE
CN102984922B (en) * 2012-11-12 2016-01-20 中国航空工业集团公司第六三一研究所 Module heat dissipation structure
CN104334005B (en) * 2014-11-28 2017-01-25 成都泰格微波技术股份有限公司 Totally-sealed cooling chamber

Also Published As

Publication number Publication date
GB2076141A (en) 1981-11-25
IT8121675A0 (en) 1981-05-13
GB2076141B (en) 1984-03-07
IT1137472B (en) 1986-09-10
DE3117758A1 (en) 1982-01-21

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