IT8121675A0 - COOLER FOR ELECTRONIC COMPONENTS AND/OR FOR CIRCUIT PANELS ON WHICH THE COMPONENTS ARE MOUNTED. - Google Patents

COOLER FOR ELECTRONIC COMPONENTS AND/OR FOR CIRCUIT PANELS ON WHICH THE COMPONENTS ARE MOUNTED.

Info

Publication number
IT8121675A0
IT8121675A0 IT8121675A IT2167581A IT8121675A0 IT 8121675 A0 IT8121675 A0 IT 8121675A0 IT 8121675 A IT8121675 A IT 8121675A IT 2167581 A IT2167581 A IT 2167581A IT 8121675 A0 IT8121675 A0 IT 8121675A0
Authority
IT
Italy
Prior art keywords
components
cooler
circuit panels
electronic components
electronic
Prior art date
Application number
IT8121675A
Other languages
Italian (it)
Other versions
IT1137472B (en
Inventor
Folke Andersson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of IT8121675A0 publication Critical patent/IT8121675A0/en
Application granted granted Critical
Publication of IT1137472B publication Critical patent/IT1137472B/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IT21675/81A 1980-05-13 1981-05-13 COOLING DEVICE FOR ELECTRONIC COMPONENTS AND / OR FOR PANELS OF CIRCUITS ON WHICH THE COMPONENTS ARE MOTORIZED IT1137472B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8003579A SE8003579L (en) 1980-05-13 1980-05-13 COOLING DEVICE FOR DISCRETE OR PCB MOUNTED ELECTRONIC COMPONENTS

Publications (2)

Publication Number Publication Date
IT8121675A0 true IT8121675A0 (en) 1981-05-13
IT1137472B IT1137472B (en) 1986-09-10

Family

ID=20340958

Family Applications (1)

Application Number Title Priority Date Filing Date
IT21675/81A IT1137472B (en) 1980-05-13 1981-05-13 COOLING DEVICE FOR ELECTRONIC COMPONENTS AND / OR FOR PANELS OF CIRCUITS ON WHICH THE COMPONENTS ARE MOTORIZED

Country Status (4)

Country Link
DE (1) DE3117758A1 (en)
GB (1) GB2076141B (en)
IT (1) IT1137472B (en)
SE (1) SE8003579L (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2151769B (en) * 1983-12-21 1987-11-04 Marconi Electronic Devices Heat sink arrangement
WO1989002569A1 (en) * 1987-09-09 1989-03-23 Hasler Ag Thermosiphon
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
US5198889A (en) * 1990-06-30 1993-03-30 Kabushiki Kaisha Toshiba Cooling apparatus
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
FI110030B (en) * 1998-02-19 2002-11-15 Nokia Corp A heat exchanger based on thermal energy binding to a working material and a process for producing a heat exchanger based on thermal energy binding to a working material
US6935409B1 (en) 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
US6981322B2 (en) 1999-06-08 2006-01-03 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
FR2796518B1 (en) * 1999-07-15 2001-11-23 Henri Maurice Benmussa SELF-CONTAINED ELECTRONIC ASSEMBLY INCLUDING ELECTRONIC CARDS SUBJECT TO A FRAME
DE19960840A1 (en) * 1999-12-16 2001-07-05 Siemens Ag Electronic power circuit with flat heat sink device
GB0014809D0 (en) * 2000-06-19 2000-08-09 Black & Decker Inc Belt sander
FR2827115B1 (en) * 2001-07-06 2003-09-05 Alstom BOX FOR POWER CONVERTER
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
US7198096B2 (en) 2002-11-26 2007-04-03 Thermotek, Inc. Stacked low profile cooling system and method for making same
US7857037B2 (en) 2001-11-27 2010-12-28 Thermotek, Inc. Geometrically reoriented low-profile phase plane heat pipes
JP4371210B2 (en) 2003-12-05 2009-11-25 日本電気株式会社 Electronic unit and heat dissipation structure
IT1404289B1 (en) 2010-12-27 2013-11-15 Itaco S R L Ora Reel S R L COOLING DEVICE FOR ELECTRONIC COMPONENTS AS WELL AS THE CONTROL DEVICE INCORPORATING SUCH DEVICE
CN102984922B (en) * 2012-11-12 2016-01-20 中国航空工业集团公司第六三一研究所 Module heat dissipation structure
CN104334005B (en) * 2014-11-28 2017-01-25 成都泰格微波技术股份有限公司 Totally-sealed cooling chamber

Also Published As

Publication number Publication date
GB2076141B (en) 1984-03-07
IT1137472B (en) 1986-09-10
GB2076141A (en) 1981-11-25
SE8003579L (en) 1981-11-14
DE3117758A1 (en) 1982-01-21

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Legal Events

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TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970516