ES2091418T3 - Dispositivo optoelectronico montado sobre substrato y conectado por fibra optica, y su procedimiento de fabricacion. - Google Patents

Dispositivo optoelectronico montado sobre substrato y conectado por fibra optica, y su procedimiento de fabricacion.

Info

Publication number
ES2091418T3
ES2091418T3 ES92400248T ES92400248T ES2091418T3 ES 2091418 T3 ES2091418 T3 ES 2091418T3 ES 92400248 T ES92400248 T ES 92400248T ES 92400248 T ES92400248 T ES 92400248T ES 2091418 T3 ES2091418 T3 ES 2091418T3
Authority
ES
Spain
Prior art keywords
substrate
device mounted
optoelectronic device
fiber optics
manufacturing procedure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92400248T
Other languages
English (en)
Inventor
Michel Maignan
Jean Ducate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent NV
Original Assignee
Alcatel NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel NV filed Critical Alcatel NV
Application granted granted Critical
Publication of ES2091418T3 publication Critical patent/ES2091418T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/25—Arrangements specific to fibre transmission
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Abstract

LA CONEXION OPTICA DE UN COMPONENTE OPTOELECTRONICO (8) FIJADO SOBRE UN SUSTRATO (2) ESTA ASEGURADA POR UNA FIBRA OPTICA (28). ESTA FIBRA ESTA INSERTADA EN UN AGUJERO (32) QUE ATRAVIESA ESTE SUSTRATO (2) ENFRENTE DE ESTE COMPONENTE (8). LAS PAREDES DE ESTE AGUJERO ASEGURA LA ALINEACION Y LA SUJECCION DE ESTA FIBRA. LA INVENCION SE APLICA EN PARTICULAR A LA REALIZACION DE UN RECEPTOR OPTOELECTRONICO EQUILIBRADO PARA UN SISTEMA DE TRANSMISION DE FIBRAS OPTICAS CON DETECCION COHERENTE.
ES92400248T 1991-02-08 1992-01-30 Dispositivo optoelectronico montado sobre substrato y conectado por fibra optica, y su procedimiento de fabricacion. Expired - Lifetime ES2091418T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9101469A FR2672697B1 (fr) 1991-02-08 1991-02-08 Dispositif optoelectronique monte sur substrat et connecte par fibre optique, et son procede de fabrication.

Publications (1)

Publication Number Publication Date
ES2091418T3 true ES2091418T3 (es) 1996-11-01

Family

ID=9409516

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92400248T Expired - Lifetime ES2091418T3 (es) 1991-02-08 1992-01-30 Dispositivo optoelectronico montado sobre substrato y conectado por fibra optica, y su procedimiento de fabricacion.

Country Status (6)

Country Link
US (1) US5247596A (es)
EP (1) EP0498700B1 (es)
JP (1) JPH04361211A (es)
DE (1) DE69213778T2 (es)
ES (1) ES2091418T3 (es)
FR (1) FR2672697B1 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5416872A (en) * 1993-07-06 1995-05-16 At&T Corp. Arrangement for interconnecting an optical fiber an optoelectronic component
US5452387A (en) * 1994-10-21 1995-09-19 Motorola, Inc. Coaxial optoelectronic mount and method of making same
JPH10319278A (ja) * 1997-05-16 1998-12-04 Nec Corp 光結合回路
JP2000081524A (ja) * 1998-09-07 2000-03-21 Sony Corp 光送受信システム
JP2002250846A (ja) * 2001-02-26 2002-09-06 Seiko Epson Corp 光モジュール及びその製造方法並びに光伝達装置
DE10209047A1 (de) * 2002-03-01 2003-12-18 Siemens Ag Faseroptisches Kommunikationsmodul und Verfahren zum Betreiben eines solchen Moduls
US7130498B2 (en) * 2003-10-16 2006-10-31 3M Innovative Properties Company Multi-layer optical circuit and method for making
US7635904B2 (en) * 2005-03-21 2009-12-22 International Business Machines Corporation Apparatus and methods for packaging electronic devices for optical testing
JP2009047937A (ja) * 2007-08-20 2009-03-05 Sony Corp 光送信／光受信モジュール及び光モジュールの製造方法並びに光通信モジュール
JP5996215B2 (ja) * 2012-02-28 2016-09-21 オリンパス株式会社 光電変換モジュールおよび光伝送ユニット
JP6230388B2 (ja) * 2013-11-28 2017-11-15 オリンパス株式会社 内視鏡
JP6485840B2 (ja) * 2015-01-23 2019-03-20 オリンパス株式会社 光伝送モジュールおよび内視鏡

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2440563A1 (fr) * 1978-11-02 1980-05-30 Labo Electronique Physique Dispositif de liaison entre fibres optiques et/ou dispositifs electro-optiques, et procede pour assurer leur positionnement optimal
US4268113A (en) * 1979-04-16 1981-05-19 International Business Machines Corporation Signal coupling element for substrate-mounted optical transducers
US4373778A (en) * 1980-12-30 1983-02-15 International Business Machines Corporation Connector implemented with fiber optic means and site therein for integrated circuit chips
US4690492A (en) * 1984-09-04 1987-09-01 Oximetrix, Inc. Optical coupling
GB8522316D0 (en) * 1985-09-09 1985-10-16 British Telecomm Optical fibre termination
EP0241669A1 (de) * 1986-03-12 1987-10-21 Siemens Aktiengesellschaft Verfahren zum Befestigen und Justieren eines Endabschnittes einer Glasfaser
US5101465A (en) * 1990-08-07 1992-03-31 At&T Bell Laboratories Leadframe-based optical assembly

Also Published As

Publication number Publication date
DE69213778T2 (de) 1997-01-30
DE69213778D1 (de) 1996-10-24
EP0498700A1 (fr) 1992-08-12
US5247596A (en) 1993-09-21
JPH04361211A (ja) 1992-12-14
FR2672697B1 (fr) 1994-06-03
EP0498700B1 (fr) 1996-09-18
FR2672697A1 (fr) 1992-08-14

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