ES2086017T3 - Aparato para fabricar piezas electronicas envueltas en lamina conductora. - Google Patents

Aparato para fabricar piezas electronicas envueltas en lamina conductora.

Info

Publication number
ES2086017T3
ES2086017T3 ES92104658T ES92104658T ES2086017T3 ES 2086017 T3 ES2086017 T3 ES 2086017T3 ES 92104658 T ES92104658 T ES 92104658T ES 92104658 T ES92104658 T ES 92104658T ES 2086017 T3 ES2086017 T3 ES 2086017T3
Authority
ES
Spain
Prior art keywords
lead
electronic parts
conductive metallic
manufacture
threads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92104658T
Other languages
English (en)
Inventor
Akira Nakao
Toyofusa Endo
Takeshi Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Zosen Corp
Original Assignee
Hitachi Zosen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Zosen Corp filed Critical Hitachi Zosen Corp
Application granted granted Critical
Publication of ES2086017T3 publication Critical patent/ES2086017T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31C—MAKING WOUND ARTICLES, e.g. WOUND TUBES, OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31C11/00—Machinery for winding combined with other machinery
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136—Separate tool stations for selective or successive operation on work
    • Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
    • Y10T29/5143—Separate tool stations for selective or successive operation on work including assembling or disassembling station and means to machine product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Filters And Equalizers (AREA)
  • Packages (AREA)

Abstract

APARATO PARA LA FABRICACION DE PIEZAS ELECTRONICAS RECUBIERTAS CON CINTA METALICA CONDUCTORA. LA INVENCION PROPORCIONA UN APARATO NUEVO PARA LA FABRICACION DE PIEZAS ELECTRONICAS QUE INCORPORAN CADA UNA DE ELLAS UNA PLURALIDAD DE HILOS DE PLOMO TOTALMENTE RECUBIERTOS CON CINTA METALICA CONDUCTORA TALES COMO FILTROS ANTIPARASITARIOS. UN SOPORTE GIRATORIO SE TRASFIERE INTERMITENTEMENTE DE LA PRIMERA ESTACION DE TRABAJO A LA SEPTIMA ESTACION DE TRABAJO EN EL ESTADO EN EL QUE UNA UNIDAD DE SUJECION EN EL SOPORTE GIRATORIO RETIENE UN ELEMENTO DE HILO DE PLOMO DE UNIDAD INDIVIDUAL. LAS ESTACIONES DE TRABAJO RESPECTIVAS ENLAZAN UN HILO DE PLOMO, MIENTRAS QUE LOS RESTANTES HILOS DE PLOMO SE UNEN CON CINTAS METALICAS CONDUCTORAS VIA UN PROCESO DE SOLDADURA ELECTRICA POR PUNTOS Y, A CONTINUACION, SE RECUBREN TOTALMENTE ESTOS HILOS DE PLOMO CON CINTAS METALICAS CONDUCTORAS. DESPUES, SE VUELVE A PONER EL HILO DE PLOMO PREDETERMINADO EN SU POSTURA INICIAL Y, A CONTINUACION, LOS HILOS DE PLOMO SE RECUBREN TOTALMENTE CON CINTAS AISLANTES. DE ESTA FORMA, SE PROCESAN CORRECTAMENTE TODOS LOS HILOS DE PLOMO PARA QUE SE PUEDAN INTEGRAR EN UNA ALINEACION PERFECTA A DISTANCIAS CONSTANTES.
ES92104658T 1991-03-29 1992-03-18 Aparato para fabricar piezas electronicas envueltas en lamina conductora. Expired - Lifetime ES2086017T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3065821A JPH04302125A (ja) 1991-03-29 1991-03-29 箔巻電子部品製造装置

Publications (1)

Publication Number Publication Date
ES2086017T3 true ES2086017T3 (es) 1996-06-16

Family

ID=13298079

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92104658T Expired - Lifetime ES2086017T3 (es) 1991-03-29 1992-03-18 Aparato para fabricar piezas electronicas envueltas en lamina conductora.

Country Status (8)

Country Link
US (1) US5187857A (es)
EP (1) EP0505909B1 (es)
JP (1) JPH04302125A (es)
KR (1) KR960005380B1 (es)
DE (1) DE69207622T2 (es)
ES (1) ES2086017T3 (es)
MY (1) MY108409A (es)
TW (1) TW251408B (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5371650A (en) * 1994-02-15 1994-12-06 Electronic Concepts, Inc. Hermetically sealed capacitor and method for making the same
CN101894691B (zh) * 2010-06-30 2012-02-29 太原风华信息装备股份有限公司 一种应用于壳式电容器的转盘入壳装置
WO2013014241A1 (en) 2011-07-28 2013-01-31 Genective Glyphosate tolerant corn event vco-ø1981-5 and kit and method for detecting the same
CN111014992B (zh) * 2019-12-12 2021-12-21 山东凯斯锐智能装备有限公司 智能紧凑型的自动化电容器焊接机器人及焊接方法
CN111063551B (zh) * 2019-12-25 2021-06-01 荆门欧曼凯机电设备有限公司 一种智能回转式电容器焊接机器人设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB700311A (en) * 1951-01-09 1953-11-25 British Insulated Callenders Improvements in or relating to methods for securing leads to electric capacitors
US3073007A (en) * 1958-09-29 1963-01-15 Sprague Electric Co Method and means for assembling capacitors
JPS5453254A (en) * 1977-10-04 1979-04-26 Chukyo Electric Co Method of takinggup condenser element and device therefor
FR2519799A1 (fr) * 1982-01-12 1983-07-18 Lcc Cice Cie Europ Composan El Procede et dispositif de fabrication de condensateurs meres par enroulement helicoidal
KR900007925B1 (ko) * 1983-05-18 1990-10-23 다게시 이게다 노이즈 필터
SU1252842A1 (ru) * 1984-01-10 1986-08-23 Предприятие П/Я Х-5618 Устройство дл намотки секций рулонных конденсаторов
US4662066A (en) * 1985-10-28 1987-05-05 Herbert Toman Continuously operable tool for use in production line process
US4908586A (en) * 1987-09-30 1990-03-13 Amp Incorporated Compact encapsulated filter assembly for printed circuit boards and method of manufacture thereof

Also Published As

Publication number Publication date
MY108409A (en) 1996-09-30
DE69207622T2 (de) 1996-09-19
KR920019232A (ko) 1992-10-22
TW251408B (es) 1995-07-11
KR960005380B1 (ko) 1996-04-24
JPH04302125A (ja) 1992-10-26
DE69207622D1 (de) 1996-02-29
US5187857A (en) 1993-02-23
EP0505909B1 (en) 1996-01-17
EP0505909A1 (en) 1992-09-30

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