ES2084200T3 - Hidroprimer para el metalizado de superficies de substratos. - Google Patents
Hidroprimer para el metalizado de superficies de substratos.Info
- Publication number
- ES2084200T3 ES2084200T3 ES92103114T ES92103114T ES2084200T3 ES 2084200 T3 ES2084200 T3 ES 2084200T3 ES 92103114 T ES92103114 T ES 92103114T ES 92103114 T ES92103114 T ES 92103114T ES 2084200 T3 ES2084200 T3 ES 2084200T3
- Authority
- ES
- Spain
- Prior art keywords
- substrate surfaces
- hydroprimer
- metallisation
- metallizing substrate
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
Abstract
PARA EL TRATAMIENTO PREVIO DE DIVERSAS SUPERFICIES DE SUSTRATOS CON EL OBJETIVO DE LA METALIZACION SUBSIGUIENTE EN UN BAÑO DE METALIZADO SIN CORRIENTE, SON EXTRAORDINARIAMENTE APROPIADAS LOS PREPARADOS QUE CONTIENEN UN POLIMERO DISPERSABLE EN AGUA, UN CATALIZADOR DE METALIZACION, DADO EL CASO SUSTANCIAS DE RELLENO, DADO EL CASO, OTROS COMPONENTES Y AGUA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4107644A DE4107644A1 (de) | 1991-03-09 | 1991-03-09 | Hydroprimer zum metallisieren von substratoberflaechen |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2084200T3 true ES2084200T3 (es) | 1996-05-01 |
Family
ID=6426907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES92103114T Expired - Lifetime ES2084200T3 (es) | 1991-03-09 | 1992-02-25 | Hidroprimer para el metalizado de superficies de substratos. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5300140A (es) |
EP (1) | EP0503351B1 (es) |
JP (1) | JP2894527B2 (es) |
AT (1) | ATE136064T1 (es) |
CA (1) | CA2062461C (es) |
DE (2) | DE4107644A1 (es) |
ES (1) | ES2084200T3 (es) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6071621A (en) * | 1993-06-11 | 2000-06-06 | 3M Innovative Properties Company | Metallized film and decorative articles made therewith |
DE4319759A1 (de) * | 1993-06-15 | 1994-12-22 | Bayer Ag | Pulvermischungen zum Metallisieren von Substratoberflächen |
TW557248B (en) * | 1996-10-28 | 2003-10-11 | Nissha Printing | Transparent shielding material for electromagnetic interference |
DE19736093A1 (de) * | 1997-08-20 | 1999-02-25 | Bayer Ag | Herstellung dreidimensionaler Leiterplatten |
DE19812880A1 (de) | 1998-03-24 | 1999-09-30 | Bayer Ag | Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung |
GB0422386D0 (en) * | 2004-10-08 | 2004-11-10 | Qinetiq Ltd | Active filler particles in inks |
WO2006103720A1 (ja) * | 2005-03-25 | 2006-10-05 | Mitsubishi Denki Kabushiki Kaisha | 無電解メッキ用前処理液及びそれを用いた金属導体層の形成方法 |
WO2006111451A1 (en) * | 2005-04-20 | 2006-10-26 | Agfa-Gevaert | Process for contact printing of pattern of electroless deposition catalyst. |
BRPI0620727A2 (pt) * | 2005-12-27 | 2011-11-22 | Bayer Healthcare Llc | processo de circuitos de autocalibração laminados por deposição autocatalìtica para sensores de teste |
TWI361208B (en) * | 2007-08-07 | 2012-04-01 | Univ Nat Defense | Process for forming a metal pattern on a substrate |
TWI433957B (zh) * | 2008-09-23 | 2014-04-11 | Univ Nat Defense | 基材表面及通孔的金屬化方法及其所使用的觸媒 |
FR2958940B1 (fr) * | 2010-04-14 | 2012-06-08 | Seawax Marine Coatings | Composition de primaire d'accrochage, utilisation et procede de traitement de supports |
US8591636B2 (en) * | 2010-12-14 | 2013-11-26 | Rohm And Haas Electronics Materials Llc | Plating catalyst and method |
US8591637B2 (en) * | 2010-12-14 | 2013-11-26 | Rohm And Haas Electronic Materials Llc | Plating catalyst and method |
EP2610366A3 (en) | 2011-12-31 | 2014-07-30 | Rohm and Haas Electronic Materials LLC | Plating catalyst and method |
JP6785686B2 (ja) * | 2017-03-02 | 2020-11-18 | 三菱製紙株式会社 | 金属調に加飾されたプラスチック成形品 |
CN109880499B (zh) * | 2017-12-06 | 2020-11-20 | 比亚迪股份有限公司 | 可金属化的防爆涂料及制备与应用、具有天线的防爆层及制备、以及3d玻璃或陶瓷机盖 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3930109A (en) * | 1971-03-09 | 1975-12-30 | Hoechst Ag | Process for the manufacture of metallized shaped bodies of macromolecular material |
US3900320A (en) * | 1971-09-30 | 1975-08-19 | Bell & Howell Co | Activation method for electroless plating |
DE2635457C2 (de) * | 1976-08-04 | 1985-06-05 | Schering AG, 1000 Berlin und 4709 Bergkamen | Katalytischer Lack und seine Verwendung zur Herstellung von gedruckten Schaltungen |
JPS61147882A (ja) * | 1984-12-19 | 1986-07-05 | Sakai Seni Kogyo Kk | 繊維材料に金属被覆を施す無電解メツキの前処理法 |
JPS61199071A (ja) * | 1985-02-28 | 1986-09-03 | Hitachi Chem Co Ltd | 繊維状物、織布、不織布の無電解めつき法 |
DE3627256A1 (de) * | 1986-08-12 | 1988-02-18 | Bayer Ag | Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf kunststoffoberflaechen |
IT1217328B (it) * | 1988-02-01 | 1990-03-22 | Donegani Guido Ist | Processo per la metallizzazione di materiali fibrosi |
DE3814506A1 (de) * | 1988-04-29 | 1989-11-09 | Bayer Ag | Verfahren zum metallisieren von substratoberflaechen |
-
1991
- 1991-03-09 DE DE4107644A patent/DE4107644A1/de not_active Withdrawn
-
1992
- 1992-02-25 EP EP92103114A patent/EP0503351B1/de not_active Expired - Lifetime
- 1992-02-25 AT AT92103114T patent/ATE136064T1/de not_active IP Right Cessation
- 1992-02-25 ES ES92103114T patent/ES2084200T3/es not_active Expired - Lifetime
- 1992-02-25 DE DE59205808T patent/DE59205808D1/de not_active Expired - Fee Related
- 1992-02-27 US US07/842,715 patent/US5300140A/en not_active Expired - Fee Related
- 1992-03-04 JP JP4081435A patent/JP2894527B2/ja not_active Expired - Fee Related
- 1992-03-06 CA CA002062461A patent/CA2062461C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE4107644A1 (de) | 1992-09-10 |
JPH05140756A (ja) | 1993-06-08 |
ATE136064T1 (de) | 1996-04-15 |
EP0503351A3 (es) | 1994-03-30 |
CA2062461A1 (en) | 1992-09-10 |
DE59205808D1 (de) | 1996-05-02 |
EP0503351A2 (de) | 1992-09-16 |
CA2062461C (en) | 1999-09-14 |
EP0503351B1 (de) | 1996-03-27 |
US5300140A (en) | 1994-04-05 |
JP2894527B2 (ja) | 1999-05-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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