ES2080889T3 - Metodo para sellar hermeticamente dispositivos electronicos. - Google Patents

Metodo para sellar hermeticamente dispositivos electronicos.

Info

Publication number
ES2080889T3
ES2080889T3 ES91302304T ES91302304T ES2080889T3 ES 2080889 T3 ES2080889 T3 ES 2080889T3 ES 91302304 T ES91302304 T ES 91302304T ES 91302304 T ES91302304 T ES 91302304T ES 2080889 T3 ES2080889 T3 ES 2080889T3
Authority
ES
Spain
Prior art keywords
substrate
glass
opening
electronic device
closed curve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91302304T
Other languages
English (en)
Inventor
Ram J Arvikar
John Warren Benko
Alexander Coucoulas
Thaddeus Wojcik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of ES2080889T3 publication Critical patent/ES2080889T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

UN EMPAQUETADO DE DISPOSITIVO ELECTRONICO SE REALIZA HACIENDO PRIMERO EN UN ELEMENTO ESTARCIDOR (11) UNA ABERTURA (12) EN FORMA DE CURVA CERRADA QUE RODEA UNA PARTE INTERIOR (13) DEL ELEMENTO ESTARCIDOR. LA CURVA CERRADA ES UNA ABERTURA CONTINUA EXCEPTO EN VARIOS ELEMENTOS INTERMEDIOS (15), CADA UNO DE LOS CUALES SE EXTIENDE CRUZANDO LA ABERTURA PARA ASEGURAR LA ZONA ESTARCIDORA INTERIOR AL RESTO DEL ELEMENTO ESTARCIDOR. UNA MEZCLA DE CRISTAL (17) SE EMPUJA A TRAVES DE LA ABERTURA DEL ELEMENTO ESTARCIDOR SOBRE UN PRIMER SUSTRATO (18) PARA FORMAR EN EL SUSTRATO UNA CURVA CERRADA DE MEZCLA DE CRISTAL, QUE DESPUES SE HACE VIDRIO PARA FORMAR UNA CURVA CERRADA (32) UNIDA AL PRIMER SUSTRATO. EL PRIMER SUSTRATO SE UTILIZA COMO PLACA DE CUBIERTA Y SE COLOCA SOBRE UN SEGUNDO SUSTRATO (24) QUE CONTIENE UN DISPOSITIVO ELECTRONICO (23) DE TAL FORMA QUE EL CIRCULO CERRADO DE VIDRIO RODEA EL DISPOSITIVO ELECTRONICO Y PONE EN CONTACTO EL SEGUNDO SUSTRATO EN TODA SU LONGITUD. EL VIDRIO SE CALIENTA LO SUFICIENTE PARA ABLANDARLO Y HACE QUE SE UNA AL SEGUNDO SUSTRATO ASI COMO EL PRIMER SUSTRATO. EL ENFRIAMIENTO DEL CIRCULO CERRADO DE CRISTAL DESARROLLA CIERRES HERMETICOS CONTINUOS TANTO AL PRIMER COMO AL SEGUNDO SUSTRATO, DE ESTA MANERA SE AISLA EL DISPOSITIVO ELECTRONICO DEL AMBIENTE EXTERNO
ES91302304T 1990-03-26 1991-03-18 Metodo para sellar hermeticamente dispositivos electronicos. Expired - Lifetime ES2080889T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/498,789 US4995149A (en) 1990-03-26 1990-03-26 Method for hermetically sealing electronic devices

Publications (1)

Publication Number Publication Date
ES2080889T3 true ES2080889T3 (es) 1996-02-16

Family

ID=23982503

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91302304T Expired - Lifetime ES2080889T3 (es) 1990-03-26 1991-03-18 Metodo para sellar hermeticamente dispositivos electronicos.

Country Status (6)

Country Link
US (1) US4995149A (es)
EP (1) EP0449473B1 (es)
JP (1) JP2530064B2 (es)
DE (1) DE69115321T2 (es)
ES (1) ES2080889T3 (es)
HK (1) HK119296A (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5253435A (en) 1989-03-17 1993-10-19 Nike, Inc. Pressure-adjustable shoe bladder assembly
US6127629A (en) * 1994-10-03 2000-10-03 Ford Global Technologies, Inc. Hermetically sealed microelectronic device and method of forming same
DK128095A (da) * 1995-11-16 1997-05-17 Amp Danmark Af Amp Holland B V Fremgangsmåde til hermetisk tæt sammenføjning af oxidmaterialer ved relativt lave temperaturer
US6045747A (en) * 1996-03-22 2000-04-04 The Whitaker Corporation Method of producing an LC-circuit
WO2011100068A2 (en) * 2010-02-12 2011-08-18 Eigenlight Corporation Hermetic package with leaded feedthroughs for in-line fiber optic devices and method of making

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3573908A (en) * 1969-06-06 1971-04-06 Bell Telephone Labor Inc Photographic technique for the selective deposition of a ceramic substrate glaze
GB1389610A (en) * 1972-10-11 1975-04-03 Marconi Co Ltd Surfacewave devices
JPS5310462A (en) * 1976-07-16 1978-01-30 Seiko Instr & Electronics Ltd Method of manufacturing noble metal-plated watch case
US4571921A (en) * 1981-09-02 1986-02-25 Burr-Brown Corporation Expendable heater sealing process
US4507907A (en) * 1981-09-02 1985-04-02 Burr-Brown Corporation Expendable heater sealing process
US4560084A (en) * 1981-09-02 1985-12-24 Burr-Brown Corporation Heater preform for sealing a closure
JPS59204590A (ja) * 1983-05-06 1984-11-19 Shoichi Yamada 静電気および電磁波捕捉機能を有する転写材

Also Published As

Publication number Publication date
JPH04227308A (ja) 1992-08-17
DE69115321D1 (de) 1996-01-25
JP2530064B2 (ja) 1996-09-04
DE69115321T2 (de) 1996-05-02
EP0449473B1 (en) 1995-12-13
US4995149A (en) 1991-02-26
EP0449473A2 (en) 1991-10-02
EP0449473A3 (en) 1992-03-04
HK119296A (en) 1996-07-12

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