DE69115321D1 - Verfahren zum luftdichten Abschliessen von elektronischen Geräten - Google Patents

Verfahren zum luftdichten Abschliessen von elektronischen Geräten

Info

Publication number
DE69115321D1
DE69115321D1 DE69115321T DE69115321T DE69115321D1 DE 69115321 D1 DE69115321 D1 DE 69115321D1 DE 69115321 T DE69115321 T DE 69115321T DE 69115321 T DE69115321 T DE 69115321T DE 69115321 D1 DE69115321 D1 DE 69115321D1
Authority
DE
Germany
Prior art keywords
electronic devices
airtight sealing
airtight
sealing
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69115321T
Other languages
English (en)
Other versions
DE69115321T2 (de
Inventor
Ram J Arvikar
John Warren Benko
Alexander Coucoulas
Thaddeus Wojcik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of DE69115321D1 publication Critical patent/DE69115321D1/de
Publication of DE69115321T2 publication Critical patent/DE69115321T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Joining Of Glass To Other Materials (AREA)
DE69115321T 1990-03-26 1991-03-18 Verfahren zum luftdichten Abschliessen von elektronischen Geräten Expired - Fee Related DE69115321T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/498,789 US4995149A (en) 1990-03-26 1990-03-26 Method for hermetically sealing electronic devices

Publications (2)

Publication Number Publication Date
DE69115321D1 true DE69115321D1 (de) 1996-01-25
DE69115321T2 DE69115321T2 (de) 1996-05-02

Family

ID=23982503

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69115321T Expired - Fee Related DE69115321T2 (de) 1990-03-26 1991-03-18 Verfahren zum luftdichten Abschliessen von elektronischen Geräten

Country Status (6)

Country Link
US (1) US4995149A (de)
EP (1) EP0449473B1 (de)
JP (1) JP2530064B2 (de)
DE (1) DE69115321T2 (de)
ES (1) ES2080889T3 (de)
HK (1) HK119296A (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5253435A (en) 1989-03-17 1993-10-19 Nike, Inc. Pressure-adjustable shoe bladder assembly
US6127629A (en) * 1994-10-03 2000-10-03 Ford Global Technologies, Inc. Hermetically sealed microelectronic device and method of forming same
DK128095A (da) * 1995-11-16 1997-05-17 Amp Danmark Af Amp Holland B V Fremgangsmåde til hermetisk tæt sammenføjning af oxidmaterialer ved relativt lave temperaturer
US6045747A (en) * 1996-03-22 2000-04-04 The Whitaker Corporation Method of producing an LC-circuit
US20110200288A1 (en) * 2010-02-12 2011-08-18 Eigenlight Corporation Hermetic package with leaded feedthroughs for in-line fiber optic devices and method of making

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3573908A (en) * 1969-06-06 1971-04-06 Bell Telephone Labor Inc Photographic technique for the selective deposition of a ceramic substrate glaze
GB1389610A (en) * 1972-10-11 1975-04-03 Marconi Co Ltd Surfacewave devices
JPS5310462A (en) * 1976-07-16 1978-01-30 Seiko Instr & Electronics Ltd Method of manufacturing noble metal-plated watch case
US4560084A (en) * 1981-09-02 1985-12-24 Burr-Brown Corporation Heater preform for sealing a closure
US4571921A (en) * 1981-09-02 1986-02-25 Burr-Brown Corporation Expendable heater sealing process
US4507907A (en) * 1981-09-02 1985-04-02 Burr-Brown Corporation Expendable heater sealing process
JPS59204590A (ja) * 1983-05-06 1984-11-19 Shoichi Yamada 静電気および電磁波捕捉機能を有する転写材

Also Published As

Publication number Publication date
EP0449473A3 (en) 1992-03-04
HK119296A (en) 1996-07-12
JP2530064B2 (ja) 1996-09-04
EP0449473A2 (de) 1991-10-02
ES2080889T3 (es) 1996-02-16
EP0449473B1 (de) 1995-12-13
JPH04227308A (ja) 1992-08-17
DE69115321T2 (de) 1996-05-02
US4995149A (en) 1991-02-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee