ES2075718T3 - Metodo y sistema para separar contaminantes. - Google Patents

Metodo y sistema para separar contaminantes.

Info

Publication number
ES2075718T3
ES2075718T3 ES92921198T ES92921198T ES2075718T3 ES 2075718 T3 ES2075718 T3 ES 2075718T3 ES 92921198 T ES92921198 T ES 92921198T ES 92921198 T ES92921198 T ES 92921198T ES 2075718 T3 ES2075718 T3 ES 2075718T3
Authority
ES
Spain
Prior art keywords
hydrogen peroxide
final reaction
reaction bath
initial
contaminants
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92921198T
Other languages
English (en)
Inventor
Thomas B Stanford
Richard C George Jr
Jennifer I Shinno
Dhiren C Mehta
Gifford W Rodine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Application granted granted Critical
Publication of ES2075718T3 publication Critical patent/ES2075718T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Detergent Compositions (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Treatment Of Water By Oxidation Or Reduction (AREA)

Abstract

UN METODO PARA ELIMINAR CONTAMINANTES DE UN SUSTRATO SOLIDO COMPRENDE,DE FORMA PREFERENTE:(A) UN BAÑO DE REACCION INICIAL (10) QUE CONTIENE:(1) UN COMPUESTO ALCALINO EN CANTIDAD SUFICIENTE PARA OFRECER UN PH DE 10.5 A 14.0 EN EL BAÑO DE REACCION FINAL;(2) UN AGENTE HUMECTANTE ESTABLE EN PRESENCIA DE UN COMPUESTO ALCALINO Y DE UN PEROXIDO DE HIDROGENO;Y (3) AGUA DESIONIZADA;(B) INTRODUCIR EL PEROXIDO DE HIDROGENO (DESDE UN CONTENEDOR 14) EN LOS BAÑOS DE REACCION INICIAL Y FINAL EN UN INDICE DE APROX 0.004 MILIGRAMOS DE PEROXIDO DE HIDROGENO POR MINUTO,POR GALON DE FLUIDO EN EL BAÑO;(C) ESPARCIR (POR MEDIOS 20) LOS BAÑOS DE RACION INICIAL Y FINAL CON AIRE U OXIGENO EN UN INDICE DE 0.001 A 1 PIE CUBICO ESTANDAR POR MINUTO;Y (D) EXPONER EL SUSTRATO CON CONTAMINANTES AL BAÑO DE REACCION FINAL QUE CONTIENE EL PEROXIDO DE HIDROGENO Y EL AIRE U OXIGENO.EL PEROXIDO DE HIDROGENO EN EL BAÑO FINAL SE MANTIENE A UN NIVEL EFECTIVO POR UN PERIODO DE TIEMPO EXTENSO PARA ELIMINAR LOS CONTAMINANTES DEL SUSTRATO DE UNA FORMA UNIFORME Y CONTROLADA.ALTERNATIVAMENTE, SE PUEDEN UTILIZAR OTROS OXIDANTES.SE DESCRIBE TAMBIEN UN SISTEMA QUE ACOMPAÑA ESTE METODO.
ES92921198T 1991-11-13 1992-09-28 Metodo y sistema para separar contaminantes. Expired - Lifetime ES2075718T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US79181991A 1991-11-13 1991-11-13

Publications (1)

Publication Number Publication Date
ES2075718T3 true ES2075718T3 (es) 1995-10-01

Family

ID=25154884

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92921198T Expired - Lifetime ES2075718T3 (es) 1991-11-13 1992-09-28 Metodo y sistema para separar contaminantes.

Country Status (15)

Country Link
EP (1) EP0566712B1 (es)
JP (1) JPH06504817A (es)
KR (1) KR960002638B1 (es)
AT (1) ATE125885T1 (es)
AU (1) AU651253B2 (es)
BR (1) BR9205457A (es)
CA (1) CA2096546A1 (es)
DE (1) DE69203851T2 (es)
DK (1) DK0566712T3 (es)
ES (1) ES2075718T3 (es)
GR (1) GR3017956T3 (es)
MX (1) MX9206559A (es)
MY (1) MY129926A (es)
WO (1) WO1993010280A1 (es)
ZA (1) ZA928056B (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2096452A1 (en) * 1992-06-19 1993-12-20 William E. Elias Inorganic oxidant compositions for removing contaminants
FR2736936B1 (fr) * 1995-07-19 1997-08-14 Air Liquide Procede de degraissage a base de peroxyde d'hydrogene et applications a des articles metalliques
GB2349892A (en) * 1999-05-13 2000-11-15 Warwick Internat Group Ltd Metal cleaning
CN115338181A (zh) * 2022-07-26 2022-11-15 泸州龙芯微科技有限公司 芯片划片后表面清洗装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3046477A1 (de) * 1980-12-10 1982-07-08 Gebr. Schmid Maschinenfabrik GmbH & Co, 7290 Freudenstadt "verfahren zum aetzen von metalloberflaechen"
US4578162A (en) * 1984-05-29 1986-03-25 The Dow Chemical Company Method for dissolving copper in the presence of iron
HU198096B (en) * 1987-05-19 1989-07-28 Gyoergy Schamschula Composition for cleaning furnaces from the combustion side
EP0458948B1 (en) * 1989-12-20 1994-08-31 Hughes Aircraft Company Peroxide composition for removing flux residue and method of using same
US5968039A (en) * 1991-10-03 1999-10-19 Essential Dental Systems, Inc. Laser device for performing canal surgery in narrow channels

Also Published As

Publication number Publication date
MX9206559A (es) 1993-05-01
BR9205457A (pt) 1994-06-21
MY129926A (en) 2007-05-31
AU651253B2 (en) 1994-07-14
JPH06504817A (ja) 1994-06-02
DE69203851T2 (de) 1995-12-07
KR960002638B1 (ko) 1996-02-24
EP0566712A1 (en) 1993-10-27
CA2096546A1 (en) 1993-05-14
GR3017956T3 (en) 1996-02-29
ATE125885T1 (de) 1995-08-15
WO1993010280A1 (en) 1993-05-27
ZA928056B (en) 1993-05-07
DK0566712T3 (da) 1995-12-18
DE69203851D1 (de) 1995-09-07
AU2753792A (en) 1993-06-15
EP0566712B1 (en) 1995-08-02

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