ES2040439T3 - Procedimiento para la fabricacion de circuitos impresos provistos de superficies de contacto. - Google Patents
Procedimiento para la fabricacion de circuitos impresos provistos de superficies de contacto.Info
- Publication number
- ES2040439T3 ES2040439T3 ES198989121279T ES89121279T ES2040439T3 ES 2040439 T3 ES2040439 T3 ES 2040439T3 ES 198989121279 T ES198989121279 T ES 198989121279T ES 89121279 T ES89121279 T ES 89121279T ES 2040439 T3 ES2040439 T3 ES 2040439T3
- Authority
- ES
- Spain
- Prior art keywords
- printed circuits
- procedure
- manufacture
- contact surfaces
- circuits provided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 3
- 229910052802 copper Inorganic materials 0.000 abstract 3
- 239000010949 copper Substances 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3843528A DE3843528C1 (enExample) | 1988-12-23 | 1988-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2040439T3 true ES2040439T3 (es) | 1993-10-16 |
Family
ID=6370040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES198989121279T Expired - Lifetime ES2040439T3 (es) | 1988-12-23 | 1989-11-17 | Procedimiento para la fabricacion de circuitos impresos provistos de superficies de contacto. |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0374483B1 (enExample) |
| AT (1) | ATE89976T1 (enExample) |
| AU (1) | AU614455B2 (enExample) |
| DE (2) | DE3843528C1 (enExample) |
| ES (1) | ES2040439T3 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE9407103U1 (de) * | 1994-04-28 | 1994-09-08 | Andus Electronic GmbH Leiterplattentechnik, 10997 Berlin | Verbindungsanordnung für Multilayer-Schaltungen |
| DE4418679A1 (de) * | 1994-05-28 | 1995-11-30 | Telefunken Microelectron | Vorrichtung zur Kontaktierung zweier Schaltungsteile |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1182319B (de) * | 1954-07-12 | 1964-11-26 | Beck S Inc | Verfahren zur Herstellung eines Leitungsmusters auf einer Kunststofftraegerplatte |
| AU417989B2 (en) * | 1968-07-12 | 1971-10-12 | William Edwards George | Improvements relating to the manufacture of circuit boards |
| US4125310A (en) * | 1975-12-01 | 1978-11-14 | Hughes Aircraft Co | Electrical connector assembly utilizing wafers for connecting electrical cables |
| DE3235212A1 (de) * | 1982-09-23 | 1984-03-29 | Schoeller & Co Elektronik Gmbh, 3552 Wetter | Kontaktierungselement fuer gedruckte schaltungen |
| DE3610036A1 (de) * | 1986-03-21 | 1987-09-24 | Schering Ag | Kontaktieren von mikroelektronischen schaltungen |
| NL8601567A (nl) * | 1986-06-17 | 1988-01-18 | Du Pont Nederland | Werkwijze voor het aanbrengen van veredelde contactvlakken op een substraat, en aldus van contactvlakken voorzien substraat. |
-
1988
- 1988-12-23 DE DE3843528A patent/DE3843528C1/de not_active Expired - Lifetime
-
1989
- 1989-11-17 EP EP89121279A patent/EP0374483B1/de not_active Expired - Lifetime
- 1989-11-17 DE DE8989121279T patent/DE58904499D1/de not_active Expired - Fee Related
- 1989-11-17 AT AT89121279T patent/ATE89976T1/de active
- 1989-11-17 ES ES198989121279T patent/ES2040439T3/es not_active Expired - Lifetime
- 1989-12-19 AU AU47008/89A patent/AU614455B2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| AU4700889A (en) | 1990-06-28 |
| EP0374483B1 (de) | 1993-05-26 |
| EP0374483A2 (de) | 1990-06-27 |
| AU614455B2 (en) | 1991-08-29 |
| EP0374483A3 (de) | 1991-01-02 |
| DE58904499D1 (de) | 1993-07-01 |
| DE3843528C1 (enExample) | 1990-05-23 |
| ATE89976T1 (de) | 1993-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG2A | Definitive protection |
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