ES2034237T3 - Metodo para alinear fotomascaras. - Google Patents

Metodo para alinear fotomascaras.

Info

Publication number
ES2034237T3
ES2034237T3 ES198888305879T ES88305879T ES2034237T3 ES 2034237 T3 ES2034237 T3 ES 2034237T3 ES 198888305879 T ES198888305879 T ES 198888305879T ES 88305879 T ES88305879 T ES 88305879T ES 2034237 T3 ES2034237 T3 ES 2034237T3
Authority
ES
Spain
Prior art keywords
slots
photomascards
aligning
rays
aligned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198888305879T
Other languages
English (en)
Inventor
George T. Harvey
Laurence S. Watkins
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Application granted granted Critical
Publication of ES2034237T3 publication Critical patent/ES2034237T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

LOS FOTOESTARCIDOS (11,12) SE ALINEAN EN LOS LADOS OPUESTOS DE UNA PLAQUITA DIRIGIENDO RAYOS DE LUZ A TRAVES DE UNAS PLACAS EN LA ZONA (13A-C) EN UN FOTOESTARCIDO Y A TRAVES DE RANURAS ALINEADAS TRANSPARENTES (14A-C) EN EL OTRO ESTARCIDO. LA DETECCION SIMULTANEA DE LOS RAYOS POR UNOS FOTODETECTORES (18A-C) INDICA LA ALINEACION. CON EL METODO SE OBTIENE UN CENTRADO PRECISO EXPLORANDO LAS RANURAS CON LOS RAYOS, MUESTREANDO LO TRANSMITIDO A TRAVES DE LAS RANURAS Y ACOPLANDO LAS MUESTRAS A UNA PARABOLA MEDIANTE UN COMPUTADOR (27).
ES198888305879T 1987-07-06 1988-06-28 Metodo para alinear fotomascaras. Expired - Lifetime ES2034237T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/069,901 US4835078A (en) 1987-07-06 1987-07-06 Method for aligning photomasks

Publications (1)

Publication Number Publication Date
ES2034237T3 true ES2034237T3 (es) 1993-04-01

Family

ID=22091910

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198888305879T Expired - Lifetime ES2034237T3 (es) 1987-07-06 1988-06-28 Metodo para alinear fotomascaras.

Country Status (9)

Country Link
US (1) US4835078A (es)
EP (1) EP0298642B1 (es)
JP (1) JPH0766904B2 (es)
KR (1) KR970004887B1 (es)
CA (1) CA1296180C (es)
DE (1) DE3874028T2 (es)
DK (1) DK373188A (es)
ES (1) ES2034237T3 (es)
SG (1) SG61093G (es)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5325176A (en) * 1988-02-16 1994-06-28 Canon Kabushiki Kaisha Position detecting method and apparatus including Fraunhofer diffraction detector
US5319444A (en) * 1988-02-16 1994-06-07 Canon Kabushiki Kaisha Position detecting method and apparatus
US5262257A (en) * 1989-07-13 1993-11-16 Canon Kabushiki Kaisha Mask for lithography
US5288729A (en) * 1989-10-07 1994-02-22 Kabushiki Kaisha Toshiba Exposing method and apparatus
US5135590A (en) * 1991-05-24 1992-08-04 At&T Bell Laboratories Optical fiber alignment method
US5170058A (en) * 1991-10-30 1992-12-08 International Business Machines Corporation Apparatus and a method for alignment verification having an opaque work piece between two artwork masters
JPH05216209A (ja) * 1992-02-03 1993-08-27 Nikon Corp フォトマスク
US5504596A (en) * 1992-12-21 1996-04-02 Nikon Corporation Exposure method and apparatus using holographic techniques
FR2704660B1 (fr) * 1993-04-27 1995-07-13 Sgs Thomson Microelectronics Masques pour une machine d'insolation double face.
US5346583A (en) * 1993-09-02 1994-09-13 At&T Bell Laboratories Optical fiber alignment techniques
DE69637249T2 (de) * 1995-07-06 2008-06-12 Dai Nippon Printing Co., Ltd. Holographisches Farbfilter und sein Herstellungsverfahren
JPH0961111A (ja) * 1995-08-28 1997-03-07 Nikon Corp パターン座標測定方法および装置
KR0172790B1 (ko) * 1995-09-18 1999-03-20 김영환 위상반전 마스크 및 그 제조방법
JPH09166416A (ja) * 1995-12-13 1997-06-24 Mitsubishi Electric Corp レチクルパターンの相対的位置ずれ量計測方法およびレチクルパターンの相対的位置ずれ量計測装置
US5627378A (en) * 1996-02-28 1997-05-06 Orc Electronic Products, A Divison Of Benson Eyecare Corporation Die set for automatic UV exposure system
US6156220A (en) * 1997-03-10 2000-12-05 Ohlig; Albert H. System and method for optically aligning films and substrates used in printed circuit boards
US6324010B1 (en) 1999-07-19 2001-11-27 Eastman Kodak Company Optical assembly and a method for manufacturing lens systems
US7086134B2 (en) * 2000-08-07 2006-08-08 Shipley Company, L.L.C. Alignment apparatus and method for aligning stacked devices
US6737223B2 (en) * 2000-08-07 2004-05-18 Shipley Company, L.L.C. Fiber optic chip with lenslet array and method of fabrication
US6587618B2 (en) * 2001-03-16 2003-07-01 Corning Incorporated Collimator array and method and system for aligning optical fibers to a lens array
US6621553B2 (en) 2001-03-30 2003-09-16 Perkinelmer, Inc. Apparatus and method for exposing substrates
JP2004253741A (ja) * 2003-02-21 2004-09-09 Sumitomo Eaton Noba Kk 移動装置及び半導体製造装置
CN101452228B (zh) * 2007-11-29 2010-11-17 富葵精密组件(深圳)有限公司 自动对位装置
TWI506313B (zh) * 2011-12-27 2015-11-01 Hon Hai Prec Ind Co Ltd 光纖耦合連接裝置
CN102608877B (zh) * 2012-03-30 2013-09-04 上海华力微电子有限公司 光刻套刻方法以及光刻方法
CN102759865B (zh) * 2012-07-26 2016-02-03 四川聚能核技术工程有限公司 曝光对位系统
GB2563435A (en) * 2017-06-16 2018-12-19 The Univ Court Of The Univ Of St Andrews Three-photon light sheet imaging

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3264105A (en) * 1962-05-31 1966-08-02 Western Electric Co Method of using a master art drawing to produce a two-sided printed circuit board
US3759767A (en) * 1971-10-08 1973-09-18 Western Electric Co Mask alignment methods
US3963489A (en) * 1975-04-30 1976-06-15 Western Electric Company, Inc. Method of precisely aligning pattern-defining masks
US4109158A (en) * 1976-05-27 1978-08-22 Western Electric Company, Inc. Apparatus for positioning a pair of elements into aligned intimate contact
JPS5533146A (en) * 1978-08-30 1980-03-08 Dainippon Screen Mfg Co Ltd Photoelectric element for detecting and positioning register mark for engraving
FR2436967A1 (fr) * 1978-09-19 1980-04-18 Thomson Csf Procede d'alignement optique de motifs dans deux plans rapproches et dispositif d'alignement mettant en oeuvre un tel procede
DE3121666A1 (de) * 1981-05-30 1982-12-16 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren und einrichtung zur gegenseitigen ausrichtung von objekten bei roentgenstrahl- und korpuskularstrahl-belichtungsvorgaengen
JPS58100853A (ja) * 1981-12-11 1983-06-15 Toshiba Corp 板材相互の位置合わせ装置
JPS59139036A (ja) * 1983-01-31 1984-08-09 Toshiba Corp スクリ−ン位置決め方法
US4545683A (en) * 1983-02-28 1985-10-08 The Perkin-Elmer Corporation Wafer alignment device
DE3443178A1 (de) * 1984-11-27 1986-05-28 Hoechst Ag, 6230 Frankfurt Verfahren zum positionieren von druckformen vor dem stanzen von registerlochungen sowie anordnung zum durchfuehren des verfahrens

Also Published As

Publication number Publication date
DE3874028D1 (de) 1992-10-01
US4835078A (en) 1989-05-30
CA1296180C (en) 1992-02-25
JPH0766904B2 (ja) 1995-07-19
DE3874028T2 (de) 1993-01-07
DK373188D0 (da) 1988-07-05
DK373188A (da) 1989-01-07
EP0298642A2 (en) 1989-01-11
KR970004887B1 (ko) 1997-04-08
JPS6424420A (en) 1989-01-26
SG61093G (en) 1993-07-09
KR890002971A (ko) 1989-04-12
EP0298642A3 (en) 1989-04-26
EP0298642B1 (en) 1992-08-26

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