ES2033902T3 - Dispositivo de conexion de un conmutador estatico de potencia precableado de patillas conductoras flexibles. - Google Patents
Dispositivo de conexion de un conmutador estatico de potencia precableado de patillas conductoras flexibles.Info
- Publication number
- ES2033902T3 ES2033902T3 ES198787401999T ES87401999T ES2033902T3 ES 2033902 T3 ES2033902 T3 ES 2033902T3 ES 198787401999 T ES198787401999 T ES 198787401999T ES 87401999 T ES87401999 T ES 87401999T ES 2033902 T3 ES2033902 T3 ES 2033902T3
- Authority
- ES
- Spain
- Prior art keywords
- connection device
- tab
- flexible conductive
- conductive pins
- static switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Multi-Conductor Connections (AREA)
Abstract
EL INVENTO CONSISTE EN UN DISPOSITIVO DE CONEXION DE LA PULGA DE UN CIRCUITO INTEGRADO DE POTENCIA, PEGADA A UN ELECTRODO DE ALIMENTACION Y PROVISTO DE PASTILLAS CONDUCTORAS SOLDADAS (6) SEGUN LA TECNICA "TAPE AUTOMATIC BONDING" (T.A.B.), DICHA CONEXION ESTA EFECTUADA DIRECTAMENTE SOBRE LAS PISTAS DE PALASTRO RECORTADO (4 Y 5) DEL CIRCUITO DE POTENCIA Y SOBRE LAS PISTAS DEL SUSTRATO (7) DEL CIRCUITO ELECTRONICO DE CONTROL. LOS DIFERENTES SOPORTES DE INTERCONEXION (4,5,7) ESTAN MECANICAMENTE FIJADOS CERCA DE LA PULGA (2) A FIN DE LIMITAR LAS DILATACIONES DIFERENCIALES ENTRE LOS PUNTOS DE SOLDADURA DEL T.A.B., LA LENGUETA (4) ESTA ADEMAS EN CONTACTO TERMICO CON UN RADIADOR (8).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8612597A FR2603763B1 (fr) | 1986-09-09 | 1986-09-09 | Dispositif de connexion d'un commutateur statique de puissance precable de pattes conductrices souples |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2033902T3 true ES2033902T3 (es) | 1993-04-01 |
Family
ID=9338794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES198787401999T Expired - Lifetime ES2033902T3 (es) | 1986-09-09 | 1987-09-08 | Dispositivo de conexion de un conmutador estatico de potencia precableado de patillas conductoras flexibles. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0263729B1 (es) |
DE (1) | DE3781232T2 (es) |
ES (1) | ES2033902T3 (es) |
FR (1) | FR2603763B1 (es) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2629665B1 (fr) * | 1988-03-30 | 1991-01-11 | Bendix Electronics Sa | Boitier pour circuit electronique |
FR2663185B1 (fr) * | 1990-06-12 | 1992-09-18 | Tonna Electronique | Dispositif utilisant des composants electroniques montes en surface et comprenant un dispositif de refroidissement perfectionne. |
FR2671260B1 (fr) * | 1990-12-27 | 1996-08-30 | Telecommunications Sa | Support de circuit imprime electrique a moyens de drainage thermique. |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2529385B1 (fr) * | 1982-06-29 | 1985-12-13 | Thomson Csf | Microboitier d'encapsulation de circuits integres logiques fonctionnant en tres haute frequence |
JPS6142928A (ja) * | 1984-07-31 | 1986-03-01 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 半導体パワ−・デバイス・パツケ−ジ |
-
1986
- 1986-09-09 FR FR8612597A patent/FR2603763B1/fr not_active Expired - Fee Related
-
1987
- 1987-09-08 EP EP87401999A patent/EP0263729B1/fr not_active Expired - Lifetime
- 1987-09-08 DE DE8787401999T patent/DE3781232T2/de not_active Expired - Fee Related
- 1987-09-08 ES ES198787401999T patent/ES2033902T3/es not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0263729B1 (fr) | 1992-08-19 |
FR2603763B1 (fr) | 1993-05-21 |
FR2603763A1 (fr) | 1988-03-11 |
EP0263729A1 (fr) | 1988-04-13 |
DE3781232T2 (de) | 1993-04-15 |
DE3781232D1 (de) | 1992-09-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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