DE3781232D1 - Verbindungsvorrichtung fuer einen statischen leistungsschalter, der mit biegsamen leitenden anschluessen versehen ist. - Google Patents

Verbindungsvorrichtung fuer einen statischen leistungsschalter, der mit biegsamen leitenden anschluessen versehen ist.

Info

Publication number
DE3781232D1
DE3781232D1 DE8787401999T DE3781232T DE3781232D1 DE 3781232 D1 DE3781232 D1 DE 3781232D1 DE 8787401999 T DE8787401999 T DE 8787401999T DE 3781232 T DE3781232 T DE 3781232T DE 3781232 D1 DE3781232 D1 DE 3781232D1
Authority
DE
Germany
Prior art keywords
circuit breaker
connecting device
conductive connections
breaker provided
static circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787401999T
Other languages
English (en)
Other versions
DE3781232T2 (de
Inventor
Paillier Patrick Le
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renault SAS
Regie Nationale des Usines Renault
Original Assignee
Renault SAS
Regie Nationale des Usines Renault
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renault SAS, Regie Nationale des Usines Renault filed Critical Renault SAS
Application granted granted Critical
Publication of DE3781232D1 publication Critical patent/DE3781232D1/de
Publication of DE3781232T2 publication Critical patent/DE3781232T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Multi-Conductor Connections (AREA)
  • Wire Bonding (AREA)
DE8787401999T 1986-09-09 1987-09-08 Verbindungsvorrichtung fuer einen statischen leistungsschalter, der mit biegsamen leitenden anschluessen versehen ist. Expired - Fee Related DE3781232T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8612597A FR2603763B1 (fr) 1986-09-09 1986-09-09 Dispositif de connexion d'un commutateur statique de puissance precable de pattes conductrices souples

Publications (2)

Publication Number Publication Date
DE3781232D1 true DE3781232D1 (de) 1992-09-24
DE3781232T2 DE3781232T2 (de) 1993-04-15

Family

ID=9338794

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787401999T Expired - Fee Related DE3781232T2 (de) 1986-09-09 1987-09-08 Verbindungsvorrichtung fuer einen statischen leistungsschalter, der mit biegsamen leitenden anschluessen versehen ist.

Country Status (4)

Country Link
EP (1) EP0263729B1 (de)
DE (1) DE3781232T2 (de)
ES (1) ES2033902T3 (de)
FR (1) FR2603763B1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2629665B1 (fr) * 1988-03-30 1991-01-11 Bendix Electronics Sa Boitier pour circuit electronique
FR2663185B1 (fr) * 1990-06-12 1992-09-18 Tonna Electronique Dispositif utilisant des composants electroniques montes en surface et comprenant un dispositif de refroidissement perfectionne.
FR2671260B1 (fr) * 1990-12-27 1996-08-30 Telecommunications Sa Support de circuit imprime electrique a moyens de drainage thermique.

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2529385B1 (fr) * 1982-06-29 1985-12-13 Thomson Csf Microboitier d'encapsulation de circuits integres logiques fonctionnant en tres haute frequence
JPS6142928A (ja) * 1984-07-31 1986-03-01 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体パワ−・デバイス・パツケ−ジ

Also Published As

Publication number Publication date
ES2033902T3 (es) 1993-04-01
FR2603763B1 (fr) 1993-05-21
DE3781232T2 (de) 1993-04-15
EP0263729A1 (de) 1988-04-13
EP0263729B1 (de) 1992-08-19
FR2603763A1 (fr) 1988-03-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee