ES2031258T5 - Procedimiento de fabricacion de una tarjeta de microcircuitos electronicos. - Google Patents
Procedimiento de fabricacion de una tarjeta de microcircuitos electronicos.Info
- Publication number
- ES2031258T5 ES2031258T5 ES88401699T ES88401699T ES2031258T5 ES 2031258 T5 ES2031258 T5 ES 2031258T5 ES 88401699 T ES88401699 T ES 88401699T ES 88401699 T ES88401699 T ES 88401699T ES 2031258 T5 ES2031258 T5 ES 2031258T5
- Authority
- ES
- Spain
- Prior art keywords
- manufacturing procedure
- microcircuit card
- electronic microcircuit
- card
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Abstract
LOS CONTACTOS 12 ACCESIBLES A TRAVES DE UNA ABERTURA 26 DE LA TARJETA 10 ESTAN REALZADOS POR UNA PROTUBERANCIA 27 FORMADA BAJO LOS CONTACTOS DE FORMA QUE ALCANCEN APROXIMADAMENTE EL NIVEL DE LA CARA EXTERNA 22A DE LA TARJETA. LA INVENCION SE APLICA MAS PARTICULARMENTE A LAS TARJETAS DE CREDITO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8709380A FR2617666B1 (fr) | 1987-07-02 | 1987-07-02 | Carte a microcircuits electroniques et son procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
ES2031258T3 ES2031258T3 (es) | 1992-12-01 |
ES2031258T5 true ES2031258T5 (es) | 1996-10-01 |
Family
ID=9352792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES88401699T Expired - Lifetime ES2031258T5 (es) | 1987-07-02 | 1988-07-01 | Procedimiento de fabricacion de una tarjeta de microcircuitos electronicos. |
Country Status (9)
Country | Link |
---|---|
US (1) | US5097117A (es) |
EP (1) | EP0297991B2 (es) |
JP (1) | JPH0678038B2 (es) |
CA (1) | CA1303241C (es) |
DE (1) | DE3869492D1 (es) |
ES (1) | ES2031258T5 (es) |
FR (1) | FR2617666B1 (es) |
HK (1) | HK92295A (es) |
WO (1) | WO1989000340A1 (es) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2559834B2 (ja) * | 1989-01-12 | 1996-12-04 | 三菱電機株式会社 | Icカード |
DE3912891A1 (de) * | 1989-04-19 | 1990-11-08 | Siemens Ag | Montagevorrichtung zur kontaktierung und zum einbau eines integrierten schaltkreissystems fuer eine wertkarte |
JP2875562B2 (ja) * | 1989-12-22 | 1999-03-31 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
US5250470A (en) * | 1989-12-22 | 1993-10-05 | Oki Electric Industry Co., Ltd. | Method for manufacturing a semiconductor device with corrosion resistant leads |
FR2662000A1 (fr) * | 1990-05-11 | 1991-11-15 | Philips Composants | Carte a microcircuit. |
JP2560895B2 (ja) * | 1990-07-25 | 1996-12-04 | 三菱電機株式会社 | Icカードの製造方法およびicカード |
DE4038126C2 (de) * | 1990-11-27 | 1993-12-16 | Mannesmann Ag | Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte |
US5861897A (en) * | 1991-01-19 | 1999-01-19 | Canon Kabushiki Kaisha | Inkjet recording apparatus with a memory device disposed substantially within boundaries if a recording head unit |
DE4224103A1 (de) * | 1992-07-22 | 1994-01-27 | Manfred Dr Ing Michalk | Miniaturgehäuse mit elektronischen Bauelementen |
FR2734983B1 (fr) * | 1995-05-29 | 1997-07-04 | Sgs Thomson Microelectronics | Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant |
US6441736B1 (en) | 1999-07-01 | 2002-08-27 | Keith R. Leighton | Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices |
US6036099A (en) | 1995-10-17 | 2000-03-14 | Leighton; Keith | Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
US5817207A (en) | 1995-10-17 | 1998-10-06 | Leighton; Keith R. | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
DE19611237A1 (de) * | 1996-03-21 | 1997-09-25 | Siemens Ag | Multichipkarte |
KR100209259B1 (ko) * | 1996-04-25 | 1999-07-15 | 이해규 | Ic 카드 및 그 제조방법 |
US6124546A (en) * | 1997-12-03 | 2000-09-26 | Advanced Micro Devices, Inc. | Integrated circuit chip package and method of making the same |
DE19959364A1 (de) * | 1999-12-09 | 2001-06-13 | Orga Kartensysteme Gmbh | Chipkarte |
DE102005038132B4 (de) * | 2005-08-11 | 2008-04-03 | Infineon Technologies Ag | Chipmodul und Chipkarte |
US9647997B2 (en) | 2013-03-13 | 2017-05-09 | Nagrastar, Llc | USB interface for performing transport I/O |
US9888283B2 (en) | 2013-03-13 | 2018-02-06 | Nagrastar Llc | Systems and methods for performing transport I/O |
USD759022S1 (en) * | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
USD758372S1 (en) | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
USD729808S1 (en) | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
EP2824704A1 (fr) * | 2013-07-12 | 2015-01-14 | Gemalto SA | Module électronique et son procédé de fabrication |
EP2892012A1 (fr) * | 2014-01-06 | 2015-07-08 | Gemalto SA | Module électronique, son procédé de fabrication, et dispositif électronique comprenant un tel module |
USD780763S1 (en) | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4216577A (en) * | 1975-12-31 | 1980-08-12 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card |
US4222516A (en) * | 1975-12-31 | 1980-09-16 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull | Standardized information card |
US4549247A (en) * | 1980-11-21 | 1985-10-22 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Carrier element for IC-modules |
FR2523335A1 (fr) * | 1982-03-10 | 1983-09-16 | Flonic Sa | Procede pour surelever les plages de contact electrique d'une carte a memoire |
DE3338597A1 (de) * | 1983-10-24 | 1985-05-02 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
JPS61157990A (ja) * | 1984-12-29 | 1986-07-17 | Kyodo Printing Co Ltd | Icカ−ド |
FR2579799B1 (fr) * | 1985-03-28 | 1990-06-22 | Flonic Sa | Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede |
JPH0751390B2 (ja) * | 1985-07-10 | 1995-06-05 | カシオ計算機株式会社 | Icカ−ド |
WO1987000486A1 (en) * | 1985-07-17 | 1987-01-29 | Ibiden Co., Ltd. | Printed wiring board for ic cards |
US4822989A (en) * | 1986-05-21 | 1989-04-18 | Hitachi, Ltd. | Semiconductor device and method of manufacturing thereof |
-
1987
- 1987-07-02 FR FR8709380A patent/FR2617666B1/fr not_active Expired
-
1988
- 1988-06-30 CA CA000570870A patent/CA1303241C/fr not_active Expired - Lifetime
- 1988-07-01 DE DE8888401699T patent/DE3869492D1/de not_active Expired - Lifetime
- 1988-07-01 WO PCT/FR1988/000350 patent/WO1989000340A1/fr unknown
- 1988-07-01 US US07/342,537 patent/US5097117A/en not_active Expired - Lifetime
- 1988-07-01 EP EP88401699A patent/EP0297991B2/fr not_active Expired - Lifetime
- 1988-07-01 ES ES88401699T patent/ES2031258T5/es not_active Expired - Lifetime
- 1988-07-01 JP JP63505881A patent/JPH0678038B2/ja not_active Expired - Lifetime
-
1995
- 1995-06-08 HK HK92295A patent/HK92295A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA1303241C (fr) | 1992-06-09 |
WO1989000340A1 (fr) | 1989-01-12 |
EP0297991A1 (fr) | 1989-01-04 |
HK92295A (en) | 1995-06-16 |
JPH0678038B2 (ja) | 1994-10-05 |
US5097117A (en) | 1992-03-17 |
ES2031258T3 (es) | 1992-12-01 |
EP0297991B1 (fr) | 1992-03-25 |
JPH01502101A (ja) | 1989-07-27 |
DE3869492D1 (de) | 1992-04-30 |
FR2617666A1 (fr) | 1989-01-06 |
EP0297991B2 (fr) | 1995-10-04 |
FR2617666B1 (fr) | 1989-10-27 |
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