ES2004174A6 - Un objetivo de aparato de revestimiento por deposicion ctodica - Google Patents
Un objetivo de aparato de revestimiento por deposicion ctodicaInfo
- Publication number
- ES2004174A6 ES2004174A6 ES8603636A ES8603636A ES2004174A6 ES 2004174 A6 ES2004174 A6 ES 2004174A6 ES 8603636 A ES8603636 A ES 8603636A ES 8603636 A ES8603636 A ES 8603636A ES 2004174 A6 ES2004174 A6 ES 2004174A6
- Authority
- ES
- Spain
- Prior art keywords
- cathode
- gap
- ground shield
- target
- sputter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004544 sputter deposition Methods 0.000 title 1
- 239000013077 target material Substances 0.000 abstract 3
- 239000011810 insulating material Substances 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21C—NUCLEAR REACTORS
- G21C11/00—Shielding structurally associated with the reactor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3441—Dark space shields
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/30—Nuclear fission reactors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Physical Vapour Deposition (AREA)
Abstract
LA INVENCION SE REFIERE A UN OBJETIVO DE APARATO DE REVESTIMIENTO POR DEPOSICION CATODICA QUE COMPRENDE UN CATODO (56) QUE TIENE UNA SUPERFICIE CON MATERIAL OBJETIVO DE DEPOSICION (58) DISPUESTO SOBRE AQUELLA, Y UNA PROTECCION DE SUELO (84) SEPARADA DEL CATODO POR UN HUECO (96) DEFINIDO ENTRE AMBOS.EL HUECO (96) ESTA COMPLETAMENTE LLENO DE UN MATERIAL QUE AISLA LA ELECTRICIDAD (102) QUE IMPIDE LA FORMACION DE ARCO A TRAVES DEL HUECO, INCLUSO EN CONDICIONES DE ALTA HUMEDAD RELATIVA. ADEMAS, TIRAS (90) MONTADAS SOBRE UNA PORCION DE BORDE (66) DE LA SUPERFICIE DE CATODO QUE TIENE EL MATERIAL OBJETIVO DE REVESTIMIENTO POR DEPOSICION CATODICA DISPUESTO SOBRE ELLA FORMAN UN REBORDE PERIFERICO CONTINUO (94) QUE SOBRESALE SOBRE LA ENTRADA AL HUECO (96) Y EL BORDE ADYACENTE (86) DE LA PROTECCION DE SUELO DE MANERA QUE IMPIDA QUE ESCAMAS SUELTAS DE MATERIAL OBJETIVO DE REVESTIMIENTO POR DEPOSICION CATODICA FORME PUENTE SOBRE EL HUECO Y PRODUZCA UN CORTOCIRCUITO ENTRE EL CATODO Y LA PROTECCION DE SUELO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/858,325 US4661233A (en) | 1985-07-05 | 1986-05-01 | Cathode/ground shield arrangement in a sputter coating apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2004174A6 true ES2004174A6 (es) | 1988-12-16 |
Family
ID=25328045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES8603636A Expired ES2004174A6 (es) | 1986-05-01 | 1986-12-30 | Un objetivo de aparato de revestimiento por deposicion ctodica |
Country Status (7)
Country | Link |
---|---|
US (1) | US4661233A (es) |
EP (1) | EP0243556B1 (es) |
JP (1) | JPS62260057A (es) |
KR (1) | KR940006206B1 (es) |
CN (1) | CN86107820A (es) |
DE (1) | DE3688556T2 (es) |
ES (1) | ES2004174A6 (es) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4802968A (en) * | 1988-01-29 | 1989-02-07 | International Business Machines Corporation | RF plasma processing apparatus |
US5280510A (en) * | 1992-09-25 | 1994-01-18 | Combuation Engineering, Inc. | Microparticle coating on inside of fuel rods and other fuel assembly components |
JP2001509214A (ja) | 1997-01-16 | 2001-07-10 | ボトムフィールド,ロジャー,エル. | 蒸気蒸着構成要素及び対応する方法 |
US20070245553A1 (en) * | 1999-05-27 | 2007-10-25 | Chong Fu C | Fine pitch microfabricated spring contact structure & method |
US7247035B2 (en) * | 2000-06-20 | 2007-07-24 | Nanonexus, Inc. | Enhanced stress metal spring contactor |
US7382142B2 (en) * | 2000-05-23 | 2008-06-03 | Nanonexus, Inc. | High density interconnect system having rapid fabrication cycle |
US6812718B1 (en) * | 1999-05-27 | 2004-11-02 | Nanonexus, Inc. | Massively parallel interface for electronic circuits |
US7349223B2 (en) | 2000-05-23 | 2008-03-25 | Nanonexus, Inc. | Enhanced compliant probe card systems having improved planarity |
US7952373B2 (en) | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US7579848B2 (en) * | 2000-05-23 | 2009-08-25 | Nanonexus, Inc. | High density interconnect system for IC packages and interconnect assemblies |
DE10045544C2 (de) * | 2000-09-07 | 2002-09-12 | Siemens Ag | Verfahren zum Aufbringen einer Beschichtung auf eine Lampe |
WO2003018865A1 (en) * | 2001-08-24 | 2003-03-06 | Nanonexus, Inc. | Method and apparatus for producing uniform isotropic stresses in a sputtered film |
SE527180C2 (sv) | 2003-08-12 | 2006-01-17 | Sandvik Intellectual Property | Rakel- eller schaberblad med nötningsbeständigt skikt samt metod för tillverkning därav |
WO2006083725A2 (en) * | 2005-02-01 | 2006-08-10 | Carlotto John A | Vacuum deposition of coating materials on powders |
US20090194414A1 (en) * | 2008-01-31 | 2009-08-06 | Nolander Ira G | Modified sputtering target and deposition components, methods of production and uses thereof |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3562140A (en) * | 1967-10-23 | 1971-02-09 | Eversharp Inc | Sequential sputtering apparatus |
US3632494A (en) * | 1967-11-06 | 1972-01-04 | Warner Lambert Co | Coating method and apparatus |
US4080281A (en) * | 1976-04-09 | 1978-03-21 | Tsunehiko Endo | Apparatus for making metal films |
US4303489A (en) * | 1978-08-21 | 1981-12-01 | Vac-Tec Systems, Inc. | Method and apparatus for producing a variable intensity pattern of sputtering material on a substrate |
US4312731A (en) * | 1979-04-24 | 1982-01-26 | Vac-Tec Systems, Inc. | Magnetically enhanced sputtering device and method |
US4391697A (en) * | 1982-08-16 | 1983-07-05 | Vac-Tec Systems, Inc. | High rate magnetron sputtering of high permeability materials |
US4520757A (en) * | 1982-10-27 | 1985-06-04 | Energy Conversion Devices, Inc. | Process gas introduction, confinement and evacuation system for glow discharge deposition apparatus |
JPS6092472A (ja) * | 1983-10-24 | 1985-05-24 | Ulvac Corp | 広帯域スパツタ圧力用タ−ゲツト電極 |
JPS60135571A (ja) * | 1983-12-21 | 1985-07-18 | Shimadzu Corp | スパツタリングにおけるタ−ゲツト取付方法 |
DE3404880A1 (de) * | 1984-02-11 | 1985-08-14 | Glyco-Metall-Werke Daelen & Loos Gmbh, 6200 Wiesbaden | Verfahren zum herstellen von schichtwerkstoff oder schichtwerkstuecken |
US4560462A (en) * | 1984-06-22 | 1985-12-24 | Westinghouse Electric Corp. | Apparatus for coating nuclear fuel pellets with a burnable absorber |
EP0173583B1 (en) * | 1984-08-31 | 1990-12-19 | Anelva Corporation | Discharge apparatus |
US4524052A (en) * | 1984-12-24 | 1985-06-18 | The Firestone Tire & Rubber Company | Borate chloride polymerization catalysts |
US4610775A (en) * | 1985-07-26 | 1986-09-09 | Westinghouse Electric Corp. | Method and apparatus for clearing short-circuited, high-voltage cathodes in a sputtering chamber |
-
1986
- 1986-05-01 US US06/858,325 patent/US4661233A/en not_active Expired - Lifetime
- 1986-10-16 KR KR1019860008693A patent/KR940006206B1/ko not_active IP Right Cessation
- 1986-11-14 CN CN198686107820A patent/CN86107820A/zh active Pending
- 1986-11-27 EP EP86309285A patent/EP0243556B1/en not_active Expired - Lifetime
- 1986-11-27 DE DE8686309285T patent/DE3688556T2/de not_active Expired - Fee Related
- 1986-12-25 JP JP61308084A patent/JPS62260057A/ja active Pending
- 1986-12-30 ES ES8603636A patent/ES2004174A6/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
KR940006206B1 (ko) | 1994-07-11 |
JPS62260057A (ja) | 1987-11-12 |
KR870011625A (ko) | 1987-12-24 |
US4661233A (en) | 1987-04-28 |
EP0243556B1 (en) | 1993-06-09 |
CN86107820A (zh) | 1987-11-11 |
DE3688556T2 (de) | 1993-09-16 |
DE3688556D1 (de) | 1993-07-15 |
EP0243556A1 (en) | 1987-11-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
SA6 | Expiration date (snapshot 920101) |
Free format text: 2006-12-30 |