ES2003233A6 - Un metodo para fabricar una placa de circuito impreso y placa correspondiente - Google Patents
Un metodo para fabricar una placa de circuito impreso y placa correspondienteInfo
- Publication number
- ES2003233A6 ES2003233A6 ES8700476A ES8700476A ES2003233A6 ES 2003233 A6 ES2003233 A6 ES 2003233A6 ES 8700476 A ES8700476 A ES 8700476A ES 8700476 A ES8700476 A ES 8700476A ES 2003233 A6 ES2003233 A6 ES 2003233A6
- Authority
- ES
- Spain
- Prior art keywords
- printed circuit
- commoning
- electroplated
- removable
- commoning bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
SE PROPORCIONA UN METODO PARA SU USO EN LA FABRICACION DE PLACAS (1) DE CIRCUITOS IMPRESOS, EN DONDE EL CIRCUITO CONDUCTOR (3) SITUADO SOBRE UN SUSTRATO DIELECTRICO (2) INCLUYE UNA PARTE (4) DE CONEXION COMUN QUE CONECTA ELECTRICAMENTE PARTES SELECCIONADAS (5) DEL CIRCUITO IMPRESO (3) QUE SERAN ELECTRODEPOSITADAS POSTERIORMENTE. LA PARTE (4) DE CONEXION COMUN DEL CIRCUITO IMPRESO (3) ES DESPRENDIDA DEL SUSTRATO (2) DESPUES DE QUE SON ELECTRODEPOSITADAS LAS PARTES SELECCIONADAS (5) DEL CIRCUITO IMPRESO, DEJANDO LAS PARTES ELECTRODEPOSITADAS (5) SEPARADAS ELECTRICAMENTE, EXCEPTO COMO PODRIAN ESTAR CONECTADAS ELECTRICAMENTE DE OTRO MODO A TRAVES DE OTRAS VIAS EN LA PLACA (1) DE CIRCUITO IMPRESO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US1986/001690 WO1988001314A1 (en) | 1986-08-19 | 1986-08-19 | Removable commoning bar |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2003233A6 true ES2003233A6 (es) | 1988-10-16 |
Family
ID=22195604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES8700476A Expired ES2003233A6 (es) | 1986-08-19 | 1987-02-24 | Un metodo para fabricar una placa de circuito impreso y placa correspondiente |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0277118B1 (es) |
JP (1) | JPS63502630A (es) |
CN (1) | CN1007575B (es) |
BR (1) | BR8607195A (es) |
DE (1) | DE3670101D1 (es) |
ES (1) | ES2003233A6 (es) |
WO (1) | WO1988001314A1 (es) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1088968C (zh) * | 1997-09-26 | 2002-08-07 | 华通电脑股份有限公司 | 芯片尺寸封装电路板制造方法 |
US6383401B1 (en) * | 2000-06-30 | 2002-05-07 | International Flex Technologies, Inc. | Method of producing flex circuit with selectively plated gold |
CN102510680A (zh) * | 2011-10-20 | 2012-06-20 | 深圳市五株电路板有限公司 | 具长短金手指的电路板制作工艺 |
CN104363710B (zh) * | 2014-11-12 | 2017-06-06 | 皆利士多层线路版(中山)有限公司 | 一种线路板的生产方法 |
JP6277342B1 (ja) * | 2016-11-04 | 2018-02-07 | 達也 宮崎 | 電子回路用の金属箔基板とパターンの形成方法およびこれを用いた装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2834723A (en) * | 1953-12-31 | 1958-05-13 | Northern Engraving & Mfg Co | Method of electroplating printed circuits |
US4000045A (en) * | 1975-01-27 | 1976-12-28 | Burroughs Corporation | Electroplating contacts of printed circuits |
JPS54160526A (en) * | 1978-06-09 | 1979-12-19 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of printing distributing board embedded with metal core having contact plug |
JPS5816353A (ja) * | 1981-07-20 | 1983-01-31 | Fuji Facom Corp | 計算機異常監視方式 |
JPS5938314A (ja) * | 1982-08-25 | 1984-03-02 | Nippon Steel Corp | 高炉内融着帯内面位置検出方法 |
-
1986
- 1986-08-19 DE DE8686905127T patent/DE3670101D1/de not_active Expired - Fee Related
- 1986-08-19 WO PCT/US1986/001690 patent/WO1988001314A1/en active IP Right Grant
- 1986-08-19 EP EP19860905127 patent/EP0277118B1/en not_active Expired
- 1986-08-19 BR BR8607195A patent/BR8607195A/pt not_active IP Right Cessation
- 1986-08-19 JP JP50445886A patent/JPS63502630A/ja active Granted
-
1987
- 1987-02-24 ES ES8700476A patent/ES2003233A6/es not_active Expired
- 1987-08-17 CN CN87105669.0A patent/CN1007575B/zh not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0277118A4 (en) | 1988-11-24 |
JPH0312791B2 (es) | 1991-02-21 |
DE3670101D1 (de) | 1990-05-10 |
EP0277118A1 (en) | 1988-08-10 |
WO1988001314A1 (en) | 1988-02-25 |
JPS63502630A (ja) | 1988-09-29 |
CN1007575B (zh) | 1990-04-11 |
CN87105669A (zh) | 1988-06-01 |
EP0277118B1 (en) | 1990-04-04 |
BR8607195A (pt) | 1988-09-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 19990301 |