ES1078480Y - Estructura de paquete de led para mejorar el efecto de luz mixta - Google Patents

Estructura de paquete de led para mejorar el efecto de luz mixta

Info

Publication number
ES1078480Y
ES1078480Y ES201200468U ES201200468U ES1078480Y ES 1078480 Y ES1078480 Y ES 1078480Y ES 201200468 U ES201200468 U ES 201200468U ES 201200468 U ES201200468 U ES 201200468U ES 1078480 Y ES1078480 Y ES 1078480Y
Authority
ES
Spain
Prior art keywords
light
containing portion
led package
package structure
filled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
ES201200468U
Other languages
English (en)
Other versions
ES1078480U (es
Inventor
Chen Wu Ping
ying lu Huang
Chao Shen Shih
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unity Opto Technology Co Ltd
Original Assignee
Unity Opto Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unity Opto Technology Co Ltd filed Critical Unity Opto Technology Co Ltd
Publication of ES1078480U publication Critical patent/ES1078480U/es
Application granted granted Critical
Publication of ES1078480Y publication Critical patent/ES1078480Y/es
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
ES201200468U 2011-11-11 2012-05-17 Estructura de paquete de led para mejorar el efecto de luz mixta Expired - Fee Related ES1078480Y (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW100141242A TW201320406A (zh) 2011-11-11 2011-11-11 提升混光效果之白光二極體封裝改良結構
TW100141242 2011-11-11

Publications (2)

Publication Number Publication Date
ES1078480U ES1078480U (es) 2013-01-28
ES1078480Y true ES1078480Y (es) 2013-04-26

Family

ID=46509169

Family Applications (1)

Application Number Title Priority Date Filing Date
ES201200468U Expired - Fee Related ES1078480Y (es) 2011-11-11 2012-05-17 Estructura de paquete de led para mejorar el efecto de luz mixta

Country Status (6)

Country Link
US (1) US20130119415A1 (es)
JP (1) JP3177113U (es)
CN (1) CN103107168A (es)
DE (1) DE202012101462U1 (es)
ES (1) ES1078480Y (es)
TW (1) TW201320406A (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI523277B (zh) * 2013-07-12 2016-02-21 葳天科技股份有限公司 White light emitting diode module with ultraviolet light
JP6713720B2 (ja) * 2013-08-30 2020-06-24 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及びそれを含む車両用照明装置
CN203536472U (zh) * 2013-11-09 2014-04-09 东莞市永林电子有限公司 一种引脚式封装的led
DE102013114466A1 (de) * 2013-12-19 2015-06-25 Osram Gmbh Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
KR20180032063A (ko) 2016-09-21 2018-03-29 서울반도체 주식회사 발광 다이오드 패키지 및 발광 다이오드 모듈
CN106328642A (zh) * 2016-10-18 2017-01-11 深圳成光兴光电技术股份有限公司 一种混合光源贴片led
CN113140552B (zh) * 2020-01-20 2024-10-18 光宝光电(常州)有限公司 发光二极管封装结构
CN112289913B (zh) * 2020-10-28 2021-09-07 博讯光电科技(合肥)有限公司 一种减少Mini LED混光区域的结构及设计方法
CN113542754A (zh) * 2021-06-23 2021-10-22 浙江谷泓生物技术有限公司 一种有白色背景光的颜色空间内光源颜色编码和解码方法
DE112024001758T5 (de) * 2023-04-18 2026-02-19 Nichia Corporation Fahrzeuglampe

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48102585A (es) * 1972-04-04 1973-12-22
US6577073B2 (en) 2000-05-31 2003-06-10 Matsushita Electric Industrial Co., Ltd. Led lamp
US6686676B2 (en) * 2001-04-30 2004-02-03 General Electric Company UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same
CN1417868A (zh) * 2001-10-29 2003-05-14 银河光电股份有限公司 发光二极管芯片的多芯片封装结构
TWI336962B (en) * 2007-02-08 2011-02-01 Touch Micro System Tech White light emitting diode package structure having silicon substrate and method of making the same
CN101373763B (zh) * 2007-08-24 2010-11-10 富士迈半导体精密工业（上海）有限公司 发光二极管
TWM380580U (en) * 2009-12-28 2010-05-11 Shin Zu Shing Co Ltd White LED device

Also Published As

Publication number Publication date
DE202012101462U1 (de) 2012-05-07
CN103107168A (zh) 2013-05-15
US20130119415A1 (en) 2013-05-16
ES1078480U (es) 2013-01-28
TW201320406A (zh) 2013-05-16
JP3177113U (ja) 2012-07-19

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Legal Events

Date Code Title Description
FD1K Utility model lapsed

Effective date: 20191007