WO2011040737A3 - 고신뢰성의 led 패키지용 리드프레임 - Google Patents

고신뢰성의 led 패키지용 리드프레임 Download PDF

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Publication number
WO2011040737A3
WO2011040737A3 PCT/KR2010/006573 KR2010006573W WO2011040737A3 WO 2011040737 A3 WO2011040737 A3 WO 2011040737A3 KR 2010006573 W KR2010006573 W KR 2010006573W WO 2011040737 A3 WO2011040737 A3 WO 2011040737A3
Authority
WO
WIPO (PCT)
Prior art keywords
lead frame
led chip
highly reliable
reflector
led package
Prior art date
Application number
PCT/KR2010/006573
Other languages
English (en)
French (fr)
Other versions
WO2011040737A2 (ko
Inventor
김경동
장광균
정재현
박시희
Original Assignee
주식회사 드림
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 드림 filed Critical 주식회사 드림
Publication of WO2011040737A2 publication Critical patent/WO2011040737A2/ko
Publication of WO2011040737A3 publication Critical patent/WO2011040737A3/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

본 발명은 고신뢰성의 LED 패키지용 리드프레임에 관한 것으로서, LED칩으로 전원을 공급하기 위한 적어도 한 쌍의 전극판, LED 칩이 본딩될 수 있는 칩 본딩부, LED칩을 둘러싸는 형상으로 구성되고, LED칩으로부터 발산되는 광을 반사하도록 LED칩을 향해 경사진 부분을 포함하는 '구조화된 내열화성 리플렉터'를 포함한다. 이에 의해, 리플렉터의 열화를 방지하여 장시간 사용에도 광도가 보장될 수 있는 고신뢰성의 리드프레임이 제공될 뿐만 아니라, 리플렉터의 반사율을 향상시킬 수 있다.
PCT/KR2010/006573 2009-09-29 2010-09-28 고신뢰성의 led 패키지용 리드프레임 WO2011040737A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0092139 2009-09-29
KR20090092139A KR100965120B1 (ko) 2009-09-29 2009-09-29 고신뢰성의 ｌｅｄ 패키지용 리드프레임

Publications (2)

Publication Number Publication Date
WO2011040737A2 WO2011040737A2 (ko) 2011-04-07
WO2011040737A3 true WO2011040737A3 (ko) 2011-07-07

Family

ID=42370293

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/006573 WO2011040737A2 (ko) 2009-09-29 2010-09-28 고신뢰성의 led 패키지용 리드프레임

Country Status (2)

Country Link
KR (1) KR100965120B1 (ko)
WO (1) WO2011040737A2 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201203627A (en) * 2010-07-15 2012-01-16 Lextar Electronics Corp Light emitting diode and method for forming supporting frame thereof and improved structure of the supporting frame
KR101104253B1 (ko) * 2011-01-27 2012-01-11 (주)창원컴텍 엘이디 패키지 및 엘이디 리드프레임
JP2012238830A (ja) 2011-05-09 2012-12-06 Lumirich Co Ltd 発光ダイオード素子
KR101053937B1 (ko) * 2011-05-09 2011-08-04 루미리치 주식회사 발광다이오드 소자
KR101243638B1 (ko) * 2011-08-31 2013-03-27 우리이앤엘 주식회사 반도체 발광소자
KR101288470B1 (ko) * 2011-10-21 2013-07-26 루미마이크로 주식회사 발광소자 패키지
CN107210352B (zh) 2015-01-19 2020-08-11 Lg 伊诺特有限公司 发光器件
KR102237155B1 (ko) 2015-03-11 2021-04-07 엘지이노텍 주식회사 발광 소자 및 이를 구비한 라이트 유닛
JP7177327B2 (ja) * 2017-04-06 2022-11-24 日亜化学工業株式会社 発光装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030067057A1 (en) * 2001-10-09 2003-04-10 Siliconware Precision Industries Co., Ltd. Lead frame and flip chip semiconductor package with the same
JP2003152228A (ja) * 2001-11-12 2003-05-23 Sumitomo Bakelite Co Ltd Ｌｅｄ用ケース及びｌｅｄ発光体
KR20030053853A (ko) * 2001-12-24 2003-07-02 삼성전기주식회사 발광다이오드 패키지
JP2004158635A (ja) * 2002-11-06 2004-06-03 Stanley Electric Co Ltd 表面実装型チップｌｅｄ及びその製造方法
KR20080023389A (ko) * 2006-09-11 2008-03-14 엘지이노텍 주식회사 발광 장치
JP2009032828A (ja) * 2007-07-25 2009-02-12 Mitsubishi Cable Ind Ltd Ｌｅｄチップ固定用基板およびその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030067057A1 (en) * 2001-10-09 2003-04-10 Siliconware Precision Industries Co., Ltd. Lead frame and flip chip semiconductor package with the same
JP2003152228A (ja) * 2001-11-12 2003-05-23 Sumitomo Bakelite Co Ltd Ｌｅｄ用ケース及びｌｅｄ発光体
KR20030053853A (ko) * 2001-12-24 2003-07-02 삼성전기주식회사 발광다이오드 패키지
JP2004158635A (ja) * 2002-11-06 2004-06-03 Stanley Electric Co Ltd 表面実装型チップｌｅｄ及びその製造方法
KR20080023389A (ko) * 2006-09-11 2008-03-14 엘지이노텍 주식회사 발광 장치
JP2009032828A (ja) * 2007-07-25 2009-02-12 Mitsubishi Cable Ind Ltd Ｌｅｄチップ固定用基板およびその製造方法

Also Published As

Publication number Publication date
WO2011040737A2 (ko) 2011-04-07
KR100965120B1 (ko) 2010-06-23

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