EP4416232A1 - Schmelzklebstoffzusammensetzung - Google Patents

Schmelzklebstoffzusammensetzung

Info

Publication number
EP4416232A1
EP4416232A1 EP22801844.6A EP22801844A EP4416232A1 EP 4416232 A1 EP4416232 A1 EP 4416232A1 EP 22801844 A EP22801844 A EP 22801844A EP 4416232 A1 EP4416232 A1 EP 4416232A1
Authority
EP
European Patent Office
Prior art keywords
composition
composition according
diamine
filler
advantageously
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22801844.6A
Other languages
English (en)
French (fr)
Inventor
Thomas PRENVEILLE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bostik SA
Original Assignee
Bostik SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bostik SA filed Critical Bostik SA
Publication of EP4416232A1 publication Critical patent/EP4416232A1/de
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06Polyamides derived from polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/34Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids using polymerised unsaturated fatty acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/40Polyamides containing oxygen in the form of ether groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2296Oxides; Hydroxides of metals of zinc
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polyamides (AREA)
  • Adhesives Or Adhesive Processes (AREA)
EP22801844.6A 2021-10-14 2022-10-13 Schmelzklebstoffzusammensetzung Pending EP4416232A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2110895A FR3128224A1 (fr) 2021-10-14 2021-10-14 Composition Adhésive thermofusible
PCT/FR2022/051930 WO2023062324A1 (fr) 2021-10-14 2022-10-13 Composition adhésive thermofusible

Publications (1)

Publication Number Publication Date
EP4416232A1 true EP4416232A1 (de) 2024-08-21

Family

ID=78770796

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22801844.6A Pending EP4416232A1 (de) 2021-10-14 2022-10-13 Schmelzklebstoffzusammensetzung

Country Status (4)

Country Link
EP (1) EP4416232A1 (de)
CN (1) CN118103473A (de)
FR (1) FR3128224A1 (de)
WO (1) WO2023062324A1 (de)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2671011A1 (en) * 2006-11-29 2008-06-05 Henkel Ag & Co. Kgaa Molded parts from hot melt adhesives
US8552101B2 (en) * 2011-02-25 2013-10-08 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
CN104356998A (zh) * 2014-09-23 2015-02-18 苏州雷立特新材料科技有限公司 一种用于电子封装领域的聚酰胺热熔胶
CN107880264B (zh) * 2017-12-06 2020-12-01 华南协同创新研究院 一种石墨烯改性聚酰胺导热热熔胶及其制备方法

Also Published As

Publication number Publication date
FR3128224A1 (fr) 2023-04-21
CN118103473A (zh) 2024-05-28
WO2023062324A1 (fr) 2023-04-20

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