EP4402000A1 - Agencement électronique - Google Patents

Agencement électronique

Info

Publication number
EP4402000A1
EP4402000A1 EP22761101.9A EP22761101A EP4402000A1 EP 4402000 A1 EP4402000 A1 EP 4402000A1 EP 22761101 A EP22761101 A EP 22761101A EP 4402000 A1 EP4402000 A1 EP 4402000A1
Authority
EP
European Patent Office
Prior art keywords
cooler
housing
contact
arrangement according
contact element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22761101.9A
Other languages
German (de)
English (en)
Inventor
Maik Paehrisch
Dennis BURGER
Pascal Barth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP4402000A1 publication Critical patent/EP4402000A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K1/00—Arrangement or mounting of electrical propulsion units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K11/00—Arrangement in connection with cooling of propulsion units
    • B60K11/02—Arrangement in connection with cooling of propulsion units with liquid cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K1/00—Arrangement or mounting of electrical propulsion units
    • B60K2001/003—Arrangement or mounting of electrical propulsion units with means for cooling the electrical propulsion units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2400/00—Special features of vehicle units
    • B60Y2400/61—Arrangements of controllers for electric machines, e.g. inverters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/64—Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
    • H01R4/643—Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail for rigid cylindrical bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Definitions

  • the present invention relates to an electronic arrangement.
  • Electronic arrangements with electronic power components for example for inverters, are known.
  • Capacitors can also be used in electronic circuits.
  • the use of coolers to cool electronic components is also known in high-performance electronic arrangements. For example, coolers are used through which a cooling medium flows. Such coolers are often made of metal. In particular, when the electronic components mounted on the cooler are switched, different electrical potentials can arise between the cooler and, for example, a housing.
  • the electronic arrangement according to the invention with the features of claim 1 is characterized in that it can be provided with optimal electromagnetic compatibility with optimal cooling at the same time.
  • interference voltages and/or capacitive couplings can be avoided particularly reliably in the case of an electronics arrangement provided with a cooler.
  • an electronic arrangement comprising an electronic component, a cooler, which is set up for cooling the electronic component, a housing, and a contact element.
  • the cooler is preferably embodied as a liquid cooler, and in particular a cooling liquid flows through it in order to be able to dissipate heat from the electronic component particularly efficiently.
  • the electronic component and the cooler are arranged inside the housing.
  • the housing can be made of metal in order to shield the electronic component from electromagnetic radiation coming from outside.
  • the cooler has at least one coolant connection, which protrudes through a through-opening in the housing.
  • the coolant connection can be designed in one piece with the cooler, or alternatively be designed as a separate component which is connected to the cooler.
  • a cooling space within the radiator through which the cooling liquid can flow, can be supplied with the cooling liquid.
  • the coolant connection forms a possibility for supplying and/or discharging the coolant from or to the outside of the housing.
  • the contact element connects the cooler and the housing to one another in an electrically conductive manner.
  • the contact element is designed and arranged concentrically to the through-opening.
  • the cooler is preferably designed in the form of a plate, for example with two plates which between them define a coolant space through which the coolant can flow.
  • the coolant connection is preferably arranged perpendicular to the plates.
  • at least a portion of the housing that has the through-opening is arranged essentially parallel to the cooler.
  • the electronics arrangement has a contact element which is arranged particularly close to and surrounding the coolant connection.
  • the electrical potentials of the cooler and the housing can be balanced particularly directly and reliably in the area of the coolant connection.
  • an electrical potential of the cooler, especially of the coolant connection is changed or delayed in relation to the housing and the coolant connection thus emits an electromagnetic field similar to a Hertzian dipole arrangement, or also an electrical near-field coupling to other components.
  • a particularly simple and cost-effective arrangement can thus be provided by means of the contact element, which reliably allows different electrical potentials in the area of the coolant connections and the housing to be avoided.
  • the arrangement of the contact element concentrically to the passage opening and thus close to the coolant connection also allows the electronics arrangement to be designed with regard to an optimal cooling effect for the electronic component. For example, a particularly large proportion of a surface of the cooler can thus be used to dissipate heat from the electronic component.
  • a radial gap is preferably arranged between the coolant connection and the housing.
  • the gap allows, for example, a certain relative mobility between the coolant connection and the housing. For example, this allows different thermal expansions to be compensated for, and in addition, for example, simple assembly of the cooler is made possible.
  • the coolant connection particularly preferably extends, in particular in the form of a tube, along a longitudinal axis.
  • the contact element forms a mechanical contact and at the same time an electrically conductive contact between the cooler and the housing along a direction parallel to the longitudinal axis.
  • the contact element has at least one contact area projecting parallel to the longitudinal axis.
  • a particularly defined electrical contact can be created between the housing and the cooler.
  • the contact element has a plurality of contact areas distributed around the circumference of the through-opening.
  • an equalization of electrical potentials is achieved particularly uniformly around the entire circumference of the coolant connection.
  • an advantageous mechanical connection between the cooler and the housing is simultaneously made possible by only individual, distributed contact areas. For example, an effective seal can also be made possible in the area of the coolant connection.
  • the contact areas are particularly preferably designed in the form of cutting elements or spherical areas or pyramid tips. Elements tapering to a point, for example, are regarded as cutting elements, which produce a substantially linear contact, in particular in a contact plane.
  • Spherical regions can be designed, for example, in the form of hemispheres protruding from a plane.
  • Pyramid tips can be designed, for example, in the form of pyramidal or conical elements which protrude from a plane.
  • the contact area is preferably designed in the form of a cup point.
  • a ring-shaped element protruding from a surface is considered to be a cup cutting edge, which element is designed to taper to a point, in particular conically, in cross-section.
  • a cup cutting edge offers a particularly simple geometry that can be produced at low cost, which brings about linear contact in the form of a circular ring running around the coolant connection.
  • the cooler and the housing are firmly connected to one another along a direction parallel to the longitudinal axis, preferably screwed or clamped to one another.
  • the protruding contact area is designed in such a way that it presses into the opposite component in the direction of the longitudinal axis when the cooler and housing are first connected, in particular screwed together. This means that the protruding contact area brings about a plastic deformation of that component against which the contact area is pressed during connection. It is particularly advantageous if the protruding contact area is formed on the housing and digs into the cooler when the housing and cooler are connected.
  • the protruding contact area can also be formed on the cooler and dig into the case when connecting the case and cooler. As a result, it can be ensured in a particularly reliable manner that a good electrically conductive contact is made after the connection.
  • a larger contact area can be produced by digging in, for example compared to a punctiform or linear ring-shaped contact.
  • the contact element preferably has a contact surface in order to form a surface contact between the cooler and the housing.
  • a particularly large contact area can be available for the electrical contact.
  • the contact surface can be designed in the form of a circular ring, ie an annular surface between two concentric circles, which is arranged concentrically to the through-opening.
  • the contact element is preferably designed as a one-piece component with the housing or with the cooler. As a result, a particularly simple and cost-effective construction of the electronics arrangement can be made possible.
  • a contact element formed in one piece with the housing is particularly advantageous, with the housing preferably being a cast component. In this case, the contact element can preferably be produced for a particularly precise geometry by subsequent machining of the housing.
  • the contact element is designed as a separate component to the housing and to the cooler.
  • the contact element can be embodied as a substantially disc-shaped component, as a result of which it can be attached to the cooler or the housing in a simple and precise manner.
  • the contact element is particularly preferably connected to the housing or to the cooler by means of a form-fitting connection and/or by means of a materially bonded connection if it is designed as a separate component from the housing and cooler.
  • the contact element can be fastened in a form-fitting manner by means of a clip mechanism.
  • a welded connection or an adhesive connection can be provided as an integral connection.
  • the cooler preferably has at least two coolant connections.
  • the electronics arrangement has one contact element for each coolant connection. This means that a contact element is provided in the immediate vicinity of each of the coolant connections in order to obtain optimum electrical application at all of the coolant connections, in order to avoid different electrical potentials of the coolant connections compared to the housing.
  • the electronics arrangement particularly preferably also includes a seal which is arranged in a sealing manner between the cooler and the housing.
  • the seal is preferably arranged radially inside the contact element. This means that the seal is preferably arranged in such a way that it surrounds the coolant connection in order to prevent fluid from entering the housing between the housing and the cooler in the region of the coolant connection.
  • the electronic component is preferably power electronics, preferably an inverter.
  • the inverter can be provided for use in a motor vehicle.
  • FIG. 1 shows a simplified schematic sectional view of an electronics arrangement according to a first exemplary embodiment of the invention
  • FIG. 2 perspective detailed view of the electronic arrangement of FIG. 1,
  • FIG. 3 shows a simplified schematic sectional view of an electronics arrangement according to a second exemplary embodiment of the invention
  • FIG. 4 shows a simplified schematic sectional view of an electronics arrangement according to a third exemplary embodiment of the invention.
  • FIG. 1 shows a simplified schematic sectional view of an electronics arrangement 1 according to a first exemplary embodiment of the invention.
  • the electronics arrangement 1 comprises an electronic component 2 which has power electronics.
  • the electronics arrangement 1 is an inverter of a motor vehicle.
  • the inverter can be provided for providing electrical energy to an electric motor of the motor vehicle, with energy being able to be supplied to the inverter by means of an electrical energy store in the motor vehicle.
  • the electronics arrangement includes a cooler 3 for cooling the electronic component 2. As can be seen in FIG. As a result, heat can be dissipated particularly efficiently from the electronic component 2 .
  • the cooler 3 is plate-shaped, with two mutually connected and parallel cooling plates 3a, 3b, between which a cooling channel 30 is located.
  • a cooling medium such as water or another cooling liquid flows through the cooling channel 30 .
  • the flow can flow through the cooler 3 in the direction indicated by the arrows A.
  • the electronic component 2 and the cooler 3 are arranged inside a housing 4 .
  • the housing 4 serves to protect against environmental influences and preferably also against electromagnetic radiation.
  • the housing 4 is designed in two parts, with a housing base 42 and a housing cover 43.
  • the cooler 3 is screwed to the housing 4 at shoulders 44 of the housing 4 in order to provide a mechanical connection and positioning of the cooler 3 and the electronic component 2 in the housing 4 .
  • the cooler 3 has two coolant connections 31 which are each in fluid communication with the cooling channel 30 .
  • the coolant connections 31 are each designed as tubular sockets, which each extend along a longitudinal axis 50 .
  • the longitudinal axis 50 is perpendicular to the cooling plates 3a, 3b.
  • the coolant connections 31 each protrude through a passage opening 41 of the housing 4 so that the coolant connections 31 can be connected outside of the housing 4 to lines (not shown), for example.
  • the through-openings 41 are each formed in such a way that there is a radial gap 35 between an inner circumference of the through-opening 41 and the respective coolant connection 31 .
  • coolant connections 31 and housing 4 can move at least slightly in relation to one another, for example due to different thermal expansions of housing 4 and cooler 3.
  • the electronics arrangement 1 also includes a contact element 5 for each coolant connection 31.
  • a single contact element 5 is shown in a perspective view in FIG.
  • the contact element 5 comprises a plurality of protruding contact regions 51 arranged on a circular ring concentrically to the through-opening 41 and protruding from a base surface 45 of the housing base 42 facing the cooler 3 in a direction parallel to the longitudinal axis 50 .
  • Each contact area 51 is designed in the form of a cutting element which has a predetermined length 51a in a plane parallel to the base surface 45 and which tapers to a point in cross section (cf. FIG. 1).
  • All contact areas 51 are arranged at a predefined radial distance 75 from an inner circumference of through-opening 41 .
  • the radial distance 75 is preferably a maximum of 50%, preferably a maximum of 30% %, in particular at least 10%, of an inner diameter 47 of the through-opening 41.
  • the cooler 3 and the housing 4 are screwed together in such a way that the contact areas 51 are dug into the underside 36 of the cooler 3 .
  • the contact element 5 forms a mechanical and an electrical contact between the housing 4 and the cooler 3 .
  • potential differences in an electrical potential between the cooler 3 and the housing 4 caused by the electronic component 2 can be equalized via the contact elements 5 .
  • Due to the fact that the contact elements 5 are arranged concentrically to the through-opening 41 and thus particularly close to the coolant connections 31, potential differences at or in the area of the coolant connections 31 can also be compensated particularly reliably and without significant carry-overs. For example, this can prevent the coolant connections 31 from having different potentials in rapid switching operations of the electronic component 2 compared to areas of the cooler 3 close to the shoulders 44, for example if these are also electrically contacted with the housing 4.
  • Such a seal by means of an additional seal 7 is provided in the second exemplary embodiment, which is shown in FIG.
  • the second embodiment essentially corresponds to the first embodiment of Figures 1 and 2, with the difference of the additional seal 7.
  • the seal 7 is made of an elastic material.
  • the seal 7 is arranged in a sealing manner between the cooler 3 and the housing 4 , the seal 7 being arranged radially inside the contact element 5 .
  • the seal 5 is located on a sealing surface 70, which is located radially inside the contact areas 51 and is part of the base surface 45 of the housing bottom 42 (compare FIG. 2).
  • FIG. 4 shows a simplified schematic sectional view of an electronics arrangement 1 according to a third exemplary embodiment of the invention.
  • the third exemplary embodiment essentially corresponds to the first exemplary embodiment in FIGS. 1 and 2, with the difference that the contact element 5 has a single contact surface 53 instead of several contact areas 51 distributed around the circumference, which produces a flat contact between the cooler 3 and the housing 4.
  • a particularly good electrical contact between the cooler 3 and the housing 4 can be established by the contact surface 53 in order to particularly reliably equalize the electrical potentials in the region of the coolant connections 31 between the cooler 3 and the housing 4 .
  • the contact surface 53 is formed close to an inner circumference of the through-opening 41 .
  • the contact surface 53 is formed by an upper side of a region which protrudes in relation to the base surface 45 of the housing bottom 42 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Cooling, Air Intake And Gas Exhaust, And Fuel Tank Arrangements In Propulsion Units (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un dispositif électronique (1) comprenant : un composant électronique (2), un refroidisseur (3) de refroidissement du composant électronique (2), un boîtier (4) et un élément de contact (5) : le composant électronique (2) et le refroidisseur (3) sont disposés à l'intérieur du boîtier (4) ; le refroidisseur (3) présente au moins un raccordement de fluide de refroidissement (31) qui fait saillie à travers une ouverture de passage (41) dans le boîtier (4) ; l'élément de contact (5) interconnecte électriquement le refroidisseur (3) et le boîtier (4) ; et l'élément de contact (5) est conçu et disposé concentriquement par rapport à l'ouverture de passage (41).
EP22761101.9A 2021-09-14 2022-08-02 Agencement électronique Pending EP4402000A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021210153.4A DE102021210153A1 (de) 2021-09-14 2021-09-14 Elektronikanordnung
PCT/EP2022/071651 WO2023041241A1 (fr) 2021-09-14 2022-08-02 Agencement électronique

Publications (1)

Publication Number Publication Date
EP4402000A1 true EP4402000A1 (fr) 2024-07-24

Family

ID=83115610

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22761101.9A Pending EP4402000A1 (fr) 2021-09-14 2022-08-02 Agencement électronique

Country Status (7)

Country Link
US (1) US20240381594A1 (fr)
EP (1) EP4402000A1 (fr)
JP (1) JP2024533491A (fr)
KR (1) KR20240063135A (fr)
CN (1) CN117940298A (fr)
DE (1) DE102021210153A1 (fr)
WO (1) WO2023041241A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023208123A1 (de) * 2023-08-24 2025-02-27 Robert Bosch Gesellschaft mit beschränkter Haftung Elektrische Vorrichtung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6127937B2 (ja) * 2013-11-28 2017-05-17 株式会社デンソー 電力変換装置
JP2015207611A (ja) * 2014-04-18 2015-11-19 トヨタ自動車株式会社 電子機器
JP6296027B2 (ja) * 2015-09-04 2018-03-20 トヨタ自動車株式会社 冷媒通路の連結構造
JP6859918B2 (ja) * 2017-10-17 2021-04-14 株式会社デンソー 電力変換装置
JP7003967B2 (ja) * 2019-04-26 2022-01-21 株式会社デンソー 電力変換装置
JP6981447B2 (ja) * 2019-04-26 2021-12-15 株式会社デンソー 電力変換装置
JP2021016287A (ja) * 2019-07-16 2021-02-12 株式会社デンソー 電力変換装置

Also Published As

Publication number Publication date
JP2024533491A (ja) 2024-09-12
WO2023041241A1 (fr) 2023-03-23
US20240381594A1 (en) 2024-11-14
DE102021210153A1 (de) 2023-03-16
KR20240063135A (ko) 2024-05-09
CN117940298A (zh) 2024-04-26

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