EP4402000A1 - Electronic arrangement - Google Patents

Electronic arrangement

Info

Publication number
EP4402000A1
EP4402000A1 EP22761101.9A EP22761101A EP4402000A1 EP 4402000 A1 EP4402000 A1 EP 4402000A1 EP 22761101 A EP22761101 A EP 22761101A EP 4402000 A1 EP4402000 A1 EP 4402000A1
Authority
EP
European Patent Office
Prior art keywords
cooler
housing
contact
arrangement according
contact element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22761101.9A
Other languages
German (de)
French (fr)
Inventor
Maik Paehrisch
Dennis BURGER
Pascal Barth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP4402000A1 publication Critical patent/EP4402000A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K1/00—Arrangement or mounting of electrical propulsion units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K11/00—Arrangement in connection with cooling of propulsion units
    • B60K11/02—Arrangement in connection with cooling of propulsion units with liquid cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K1/00—Arrangement or mounting of electrical propulsion units
    • B60K2001/003—Arrangement or mounting of electrical propulsion units with means for cooling the electrical propulsion units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2400/00—Special features of vehicle units
    • B60Y2400/61—Arrangements of controllers for electric machines, e.g. inverters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/64—Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
    • H01R4/643—Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail for rigid cylindrical bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Definitions

  • the present invention relates to an electronic arrangement.
  • Electronic arrangements with electronic power components for example for inverters, are known.
  • Capacitors can also be used in electronic circuits.
  • the use of coolers to cool electronic components is also known in high-performance electronic arrangements. For example, coolers are used through which a cooling medium flows. Such coolers are often made of metal. In particular, when the electronic components mounted on the cooler are switched, different electrical potentials can arise between the cooler and, for example, a housing.
  • the electronic arrangement according to the invention with the features of claim 1 is characterized in that it can be provided with optimal electromagnetic compatibility with optimal cooling at the same time.
  • interference voltages and/or capacitive couplings can be avoided particularly reliably in the case of an electronics arrangement provided with a cooler.
  • an electronic arrangement comprising an electronic component, a cooler, which is set up for cooling the electronic component, a housing, and a contact element.
  • the cooler is preferably embodied as a liquid cooler, and in particular a cooling liquid flows through it in order to be able to dissipate heat from the electronic component particularly efficiently.
  • the electronic component and the cooler are arranged inside the housing.
  • the housing can be made of metal in order to shield the electronic component from electromagnetic radiation coming from outside.
  • the cooler has at least one coolant connection, which protrudes through a through-opening in the housing.
  • the coolant connection can be designed in one piece with the cooler, or alternatively be designed as a separate component which is connected to the cooler.
  • a cooling space within the radiator through which the cooling liquid can flow, can be supplied with the cooling liquid.
  • the coolant connection forms a possibility for supplying and/or discharging the coolant from or to the outside of the housing.
  • the contact element connects the cooler and the housing to one another in an electrically conductive manner.
  • the contact element is designed and arranged concentrically to the through-opening.
  • the cooler is preferably designed in the form of a plate, for example with two plates which between them define a coolant space through which the coolant can flow.
  • the coolant connection is preferably arranged perpendicular to the plates.
  • at least a portion of the housing that has the through-opening is arranged essentially parallel to the cooler.
  • the electronics arrangement has a contact element which is arranged particularly close to and surrounding the coolant connection.
  • the electrical potentials of the cooler and the housing can be balanced particularly directly and reliably in the area of the coolant connection.
  • an electrical potential of the cooler, especially of the coolant connection is changed or delayed in relation to the housing and the coolant connection thus emits an electromagnetic field similar to a Hertzian dipole arrangement, or also an electrical near-field coupling to other components.
  • a particularly simple and cost-effective arrangement can thus be provided by means of the contact element, which reliably allows different electrical potentials in the area of the coolant connections and the housing to be avoided.
  • the arrangement of the contact element concentrically to the passage opening and thus close to the coolant connection also allows the electronics arrangement to be designed with regard to an optimal cooling effect for the electronic component. For example, a particularly large proportion of a surface of the cooler can thus be used to dissipate heat from the electronic component.
  • a radial gap is preferably arranged between the coolant connection and the housing.
  • the gap allows, for example, a certain relative mobility between the coolant connection and the housing. For example, this allows different thermal expansions to be compensated for, and in addition, for example, simple assembly of the cooler is made possible.
  • the coolant connection particularly preferably extends, in particular in the form of a tube, along a longitudinal axis.
  • the contact element forms a mechanical contact and at the same time an electrically conductive contact between the cooler and the housing along a direction parallel to the longitudinal axis.
  • the contact element has at least one contact area projecting parallel to the longitudinal axis.
  • a particularly defined electrical contact can be created between the housing and the cooler.
  • the contact element has a plurality of contact areas distributed around the circumference of the through-opening.
  • an equalization of electrical potentials is achieved particularly uniformly around the entire circumference of the coolant connection.
  • an advantageous mechanical connection between the cooler and the housing is simultaneously made possible by only individual, distributed contact areas. For example, an effective seal can also be made possible in the area of the coolant connection.
  • the contact areas are particularly preferably designed in the form of cutting elements or spherical areas or pyramid tips. Elements tapering to a point, for example, are regarded as cutting elements, which produce a substantially linear contact, in particular in a contact plane.
  • Spherical regions can be designed, for example, in the form of hemispheres protruding from a plane.
  • Pyramid tips can be designed, for example, in the form of pyramidal or conical elements which protrude from a plane.
  • the contact area is preferably designed in the form of a cup point.
  • a ring-shaped element protruding from a surface is considered to be a cup cutting edge, which element is designed to taper to a point, in particular conically, in cross-section.
  • a cup cutting edge offers a particularly simple geometry that can be produced at low cost, which brings about linear contact in the form of a circular ring running around the coolant connection.
  • the cooler and the housing are firmly connected to one another along a direction parallel to the longitudinal axis, preferably screwed or clamped to one another.
  • the protruding contact area is designed in such a way that it presses into the opposite component in the direction of the longitudinal axis when the cooler and housing are first connected, in particular screwed together. This means that the protruding contact area brings about a plastic deformation of that component against which the contact area is pressed during connection. It is particularly advantageous if the protruding contact area is formed on the housing and digs into the cooler when the housing and cooler are connected.
  • the protruding contact area can also be formed on the cooler and dig into the case when connecting the case and cooler. As a result, it can be ensured in a particularly reliable manner that a good electrically conductive contact is made after the connection.
  • a larger contact area can be produced by digging in, for example compared to a punctiform or linear ring-shaped contact.
  • the contact element preferably has a contact surface in order to form a surface contact between the cooler and the housing.
  • a particularly large contact area can be available for the electrical contact.
  • the contact surface can be designed in the form of a circular ring, ie an annular surface between two concentric circles, which is arranged concentrically to the through-opening.
  • the contact element is preferably designed as a one-piece component with the housing or with the cooler. As a result, a particularly simple and cost-effective construction of the electronics arrangement can be made possible.
  • a contact element formed in one piece with the housing is particularly advantageous, with the housing preferably being a cast component. In this case, the contact element can preferably be produced for a particularly precise geometry by subsequent machining of the housing.
  • the contact element is designed as a separate component to the housing and to the cooler.
  • the contact element can be embodied as a substantially disc-shaped component, as a result of which it can be attached to the cooler or the housing in a simple and precise manner.
  • the contact element is particularly preferably connected to the housing or to the cooler by means of a form-fitting connection and/or by means of a materially bonded connection if it is designed as a separate component from the housing and cooler.
  • the contact element can be fastened in a form-fitting manner by means of a clip mechanism.
  • a welded connection or an adhesive connection can be provided as an integral connection.
  • the cooler preferably has at least two coolant connections.
  • the electronics arrangement has one contact element for each coolant connection. This means that a contact element is provided in the immediate vicinity of each of the coolant connections in order to obtain optimum electrical application at all of the coolant connections, in order to avoid different electrical potentials of the coolant connections compared to the housing.
  • the electronics arrangement particularly preferably also includes a seal which is arranged in a sealing manner between the cooler and the housing.
  • the seal is preferably arranged radially inside the contact element. This means that the seal is preferably arranged in such a way that it surrounds the coolant connection in order to prevent fluid from entering the housing between the housing and the cooler in the region of the coolant connection.
  • the electronic component is preferably power electronics, preferably an inverter.
  • the inverter can be provided for use in a motor vehicle.
  • FIG. 1 shows a simplified schematic sectional view of an electronics arrangement according to a first exemplary embodiment of the invention
  • FIG. 2 perspective detailed view of the electronic arrangement of FIG. 1,
  • FIG. 3 shows a simplified schematic sectional view of an electronics arrangement according to a second exemplary embodiment of the invention
  • FIG. 4 shows a simplified schematic sectional view of an electronics arrangement according to a third exemplary embodiment of the invention.
  • FIG. 1 shows a simplified schematic sectional view of an electronics arrangement 1 according to a first exemplary embodiment of the invention.
  • the electronics arrangement 1 comprises an electronic component 2 which has power electronics.
  • the electronics arrangement 1 is an inverter of a motor vehicle.
  • the inverter can be provided for providing electrical energy to an electric motor of the motor vehicle, with energy being able to be supplied to the inverter by means of an electrical energy store in the motor vehicle.
  • the electronics arrangement includes a cooler 3 for cooling the electronic component 2. As can be seen in FIG. As a result, heat can be dissipated particularly efficiently from the electronic component 2 .
  • the cooler 3 is plate-shaped, with two mutually connected and parallel cooling plates 3a, 3b, between which a cooling channel 30 is located.
  • a cooling medium such as water or another cooling liquid flows through the cooling channel 30 .
  • the flow can flow through the cooler 3 in the direction indicated by the arrows A.
  • the electronic component 2 and the cooler 3 are arranged inside a housing 4 .
  • the housing 4 serves to protect against environmental influences and preferably also against electromagnetic radiation.
  • the housing 4 is designed in two parts, with a housing base 42 and a housing cover 43.
  • the cooler 3 is screwed to the housing 4 at shoulders 44 of the housing 4 in order to provide a mechanical connection and positioning of the cooler 3 and the electronic component 2 in the housing 4 .
  • the cooler 3 has two coolant connections 31 which are each in fluid communication with the cooling channel 30 .
  • the coolant connections 31 are each designed as tubular sockets, which each extend along a longitudinal axis 50 .
  • the longitudinal axis 50 is perpendicular to the cooling plates 3a, 3b.
  • the coolant connections 31 each protrude through a passage opening 41 of the housing 4 so that the coolant connections 31 can be connected outside of the housing 4 to lines (not shown), for example.
  • the through-openings 41 are each formed in such a way that there is a radial gap 35 between an inner circumference of the through-opening 41 and the respective coolant connection 31 .
  • coolant connections 31 and housing 4 can move at least slightly in relation to one another, for example due to different thermal expansions of housing 4 and cooler 3.
  • the electronics arrangement 1 also includes a contact element 5 for each coolant connection 31.
  • a single contact element 5 is shown in a perspective view in FIG.
  • the contact element 5 comprises a plurality of protruding contact regions 51 arranged on a circular ring concentrically to the through-opening 41 and protruding from a base surface 45 of the housing base 42 facing the cooler 3 in a direction parallel to the longitudinal axis 50 .
  • Each contact area 51 is designed in the form of a cutting element which has a predetermined length 51a in a plane parallel to the base surface 45 and which tapers to a point in cross section (cf. FIG. 1).
  • All contact areas 51 are arranged at a predefined radial distance 75 from an inner circumference of through-opening 41 .
  • the radial distance 75 is preferably a maximum of 50%, preferably a maximum of 30% %, in particular at least 10%, of an inner diameter 47 of the through-opening 41.
  • the cooler 3 and the housing 4 are screwed together in such a way that the contact areas 51 are dug into the underside 36 of the cooler 3 .
  • the contact element 5 forms a mechanical and an electrical contact between the housing 4 and the cooler 3 .
  • potential differences in an electrical potential between the cooler 3 and the housing 4 caused by the electronic component 2 can be equalized via the contact elements 5 .
  • Due to the fact that the contact elements 5 are arranged concentrically to the through-opening 41 and thus particularly close to the coolant connections 31, potential differences at or in the area of the coolant connections 31 can also be compensated particularly reliably and without significant carry-overs. For example, this can prevent the coolant connections 31 from having different potentials in rapid switching operations of the electronic component 2 compared to areas of the cooler 3 close to the shoulders 44, for example if these are also electrically contacted with the housing 4.
  • Such a seal by means of an additional seal 7 is provided in the second exemplary embodiment, which is shown in FIG.
  • the second embodiment essentially corresponds to the first embodiment of Figures 1 and 2, with the difference of the additional seal 7.
  • the seal 7 is made of an elastic material.
  • the seal 7 is arranged in a sealing manner between the cooler 3 and the housing 4 , the seal 7 being arranged radially inside the contact element 5 .
  • the seal 5 is located on a sealing surface 70, which is located radially inside the contact areas 51 and is part of the base surface 45 of the housing bottom 42 (compare FIG. 2).
  • FIG. 4 shows a simplified schematic sectional view of an electronics arrangement 1 according to a third exemplary embodiment of the invention.
  • the third exemplary embodiment essentially corresponds to the first exemplary embodiment in FIGS. 1 and 2, with the difference that the contact element 5 has a single contact surface 53 instead of several contact areas 51 distributed around the circumference, which produces a flat contact between the cooler 3 and the housing 4.
  • a particularly good electrical contact between the cooler 3 and the housing 4 can be established by the contact surface 53 in order to particularly reliably equalize the electrical potentials in the region of the coolant connections 31 between the cooler 3 and the housing 4 .
  • the contact surface 53 is formed close to an inner circumference of the through-opening 41 .
  • the contact surface 53 is formed by an upper side of a region which protrudes in relation to the base surface 45 of the housing bottom 42 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Cooling, Air Intake And Gas Exhaust, And Fuel Tank Arrangements In Propulsion Units (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to an electronic arrangement (1), comprising: an electronic component (2), a cooler (3) for cooling the electronic component (2), a housing (4), and a contact element (5), wherein: the electronic component (2) and the cooler (3) are arranged within the housing (4); the cooler (3) has at least one coolant connection (31) which protrudes through a through-opening (41) in the housing (4); the contact element (5) electrically conductively interconnects the cooler (3) and the housing (4); and the contact element (5) is designed and arranged concentrically with the through-opening (41).

Description

Beschreibung Description

Titel title

Elektronikanordnung electronics arrangement

Stand der Technik State of the art

Die vorliegende Erfindung betrifft eine Elektronikanordnung. The present invention relates to an electronic arrangement.

Bekannt sind Elektronikanordnungen mit leistungselektronischen Bauteilen, beispielsweise für Wechselrichter. Um elektromagnetische Strahlenquellen einzudämmen und Komponenten solcher Elektronikanordnungen vor der elektromagnetischen Strahlung zu schützen, werden diese beispielsweise gefiltert oder geschirmt. Dies erfolgt in Leitern beispielsweise mittels einer Schirmleitung. In elektronischen Schaltungen können außerdem Kondensatoren verwendet werden. Bei leistungsstarken elektronischen Anordnungen ist außerdem die Verwendung von Kühlern bekannt, um elektronische Bauteile zu kühlen. Beispielsweise werden Kühler verwendet, die von einem Kühlmedium durchströmt werden. Derartige Kühler sind häufig aus Metall gebildet. Insbesondere bei Schaltvorgängen der am Kühler montierten elektronischen Bauteile können unterschiedliche elektrische Potenziale zwischen Kühler und beispielsweise einem Gehäuse entstehen. Electronic arrangements with electronic power components, for example for inverters, are known. In order to contain sources of electromagnetic radiation and to protect components of such electronic arrangements from electromagnetic radiation, they are filtered or shielded, for example. This takes place in conductors, for example by means of a shielding line. Capacitors can also be used in electronic circuits. The use of coolers to cool electronic components is also known in high-performance electronic arrangements. For example, coolers are used through which a cooling medium flows. Such coolers are often made of metal. In particular, when the electronic components mounted on the cooler are switched, different electrical potentials can arise between the cooler and, for example, a housing.

Offenbarung der Erfindung Disclosure of Invention

Die erfindungsgemäße Elektronikanordnung mit den Merkmalen des Anspruchs 1 zeichnet sich dadurch aus, dass diese mit einer optimalen elektromagnetischen Verträglichkeit bei gleichzeitig optimaler Kühlung bereitgestellt werden kann. Insbesondere können dabei Störspannungen und/oder kapazitive Kopplungen bei einer mit einem Kühler versehenen Elektronikanordnung besonders zuverlässig vermieden werden. Dies wird erfindungsgemäß erreicht durch eine Elektronikanordnung, umfassend ein elektronisches Bauteil, einen Kühler, welcher eingerichtet ist zum Kühlen des elektronischen Bauteils, ein Gehäuse, und ein Kontaktelement. Der Kühler ist vorzugsweise als Flüssigkeitskühler ausgebildet, und wird insbesondere von einer Kühlflüssigkeit durchströmt, um dadurch besonders effizient Wärme von dem elektronischen Bauteil abführen zu können. Das elektronische Bauteil und der Kühler sind dabei innerhalb des Gehäuses angeordnet. Beispielsweise kann das Gehäuse aus Metall gebildet sein, um das elektronische Bauteil gegen von außen kommender elektromagnetischer Strahlung abzuschirmen. Der Kühler weist zumindest einen Kühlmittelanschluss auf, welcher durch eine Durchgangsöffnung des Gehäuses hindurchragt. Beispielsweise kann der Kühlmittelanschluss einstückig mit dem Kühler ausgebildet sein, oder alternativ als separates Bauteil ausgebildet sein, welches mit dem Kühler verbunden ist. Mittels des Kühlmittelanschlusses kann beispielsweise ein Kühlraum innerhalb des Kühlers, durch welchen die Kühlflüssigkeit strömen kann, mit der Kühlflüssigkeit versorgt werden. Der Kühlmittelanschluss bildet dabei eine Möglichkeit zur Zuführung und/oder Abführung der Kühlflüssigkeit von bzw. nach außerhalb des Gehäuses. Das Kontaktelement verbindet den Kühler und das Gehäuse elektrisch leitend miteinander. Dabei ist das Kontaktelement konzentrisch zur Durchgangsöffnung ausgebildet und angeordnet. The electronic arrangement according to the invention with the features of claim 1 is characterized in that it can be provided with optimal electromagnetic compatibility with optimal cooling at the same time. In particular, interference voltages and/or capacitive couplings can be avoided particularly reliably in the case of an electronics arrangement provided with a cooler. According to the invention, this is achieved by an electronic arrangement comprising an electronic component, a cooler, which is set up for cooling the electronic component, a housing, and a contact element. The cooler is preferably embodied as a liquid cooler, and in particular a cooling liquid flows through it in order to be able to dissipate heat from the electronic component particularly efficiently. The electronic component and the cooler are arranged inside the housing. For example, the housing can be made of metal in order to shield the electronic component from electromagnetic radiation coming from outside. The cooler has at least one coolant connection, which protrudes through a through-opening in the housing. For example, the coolant connection can be designed in one piece with the cooler, or alternatively be designed as a separate component which is connected to the cooler. By means of the coolant connection, for example, a cooling space within the radiator, through which the cooling liquid can flow, can be supplied with the cooling liquid. The coolant connection forms a possibility for supplying and/or discharging the coolant from or to the outside of the housing. The contact element connects the cooler and the housing to one another in an electrically conductive manner. The contact element is designed and arranged concentrically to the through-opening.

Vorzugsweise ist der Kühler plattenförmig ausgestaltet, beispielsweise mit zwei Platten, welche zwischen sich einen Kühlmittelraum definieren, welcher von der Kühlflüssigkeit durchströmt werden kann. Bevorzugt ist der Kühlmittelanschluss senkrecht zu den Platten angeordnet. Vorzugsweise ist zumindest ein Teilbereich des Gehäuses, welcher die Durchgangsöffnung aufweist, im Wesentlichen parallel zum Kühler angeordnet. The cooler is preferably designed in the form of a plate, for example with two plates which between them define a coolant space through which the coolant can flow. The coolant connection is preferably arranged perpendicular to the plates. Preferably, at least a portion of the housing that has the through-opening is arranged essentially parallel to the cooler.

Das heißt, die Elektronikanordnung weist ein Kontaktelement auf, welches besonders nahe am Kühlmittelanschluss und diesen umgebend angeordnet ist. Dadurch kann im Bereich des Kühlmittelanschlusses besonders direkt und zuverlässig ein Ausgleich elektrischer Potenziale von Kühler und Gehäuse erfolgen. Insbesondere kann dadurch vermieden werden, dass sich ein elektrisches Potenzial des Kühlers, vor allem des Kühlmittelanschlusses, gegenüber dem Gehäuse verändert oder verschleppt wird und dadurch der Kühlmittelanschluss ähnlich einer Hertz'schen Dipolanordnung ein elektromagnetisches Feld abstrahlt, oder auch eine elektrische Nahfeldkopplung zu weiteren Bauteilen erfolgt. Somit kann mittels des Kontaktelements eine besonders einfache und kostengünstige Anordnung bereitgestellt werden, welche zuverlässig eine Vermeidung unterschiedlicher elektrischer Potenziale im Bereich der Kühlmittelanschlüsse und des Gehäuses erlaubt. Die Anordnung des Kontaktelements konzentrisch zur Durchgangsöffnung und damit nahe am Kühlmittelanschluss erlaubt zudem eine Auslegung der Elektronikanordnung hinsichtlich einer optimalen Kühlwirkung für das elektronische Bauteil. Beispielsweise kann somit ein besonders großer Anteil einer Oberfläche des Kühlers genutzt werden zur Abfuhr von Wärme vom elektronischen Bauteil. This means that the electronics arrangement has a contact element which is arranged particularly close to and surrounding the coolant connection. As a result, the electrical potentials of the cooler and the housing can be balanced particularly directly and reliably in the area of the coolant connection. In particular, it can be avoided that an electrical potential of the cooler, especially of the coolant connection, is changed or delayed in relation to the housing and the coolant connection thus emits an electromagnetic field similar to a Hertzian dipole arrangement, or also an electrical near-field coupling to other components. A particularly simple and cost-effective arrangement can thus be provided by means of the contact element, which reliably allows different electrical potentials in the area of the coolant connections and the housing to be avoided. The arrangement of the contact element concentrically to the passage opening and thus close to the coolant connection also allows the electronics arrangement to be designed with regard to an optimal cooling effect for the electronic component. For example, a particularly large proportion of a surface of the cooler can thus be used to dissipate heat from the electronic component.

Die Unteransprüche haben bevorzugte Weiterbildungen der Erfindung zum Inhalt. The dependent claims relate to preferred developments of the invention.

Bevorzugt ist zwischen dem Kühlmittelanschluss und dem Gehäuse ein radialer Spalt angeordnet. Der Spalt erlaubt dabei beispielsweise eine gewisse relative Beweglichkeit zwischen Kühlmittelanschluss und Gehäuse. Beispielsweise können dadurch unterschiedliche thermische Ausdehnungen ausgeglichen werden, und zudem wird beispielsweise eine einfache Montage des Kühlers ermöglicht. A radial gap is preferably arranged between the coolant connection and the housing. The gap allows, for example, a certain relative mobility between the coolant connection and the housing. For example, this allows different thermal expansions to be compensated for, and in addition, for example, simple assembly of the cooler is made possible.

Besonders bevorzugt erstreckt sich der Kühlmittelanschluss, insbesondere rohrförmig, entlang einer Längsachse. Das Kontaktelement bildet dabei einen mechanischen Kontakt sowie gleichzeitig einen elektrisch leitenden Kontakt von Kühler und Gehäuse entlang einer Richtung parallel zur Längsachse. Dadurch kann bei Sicherstellung eines guten elektrischen Kontakts zwischen Gehäuse und Kühler möglichst nahe am Kühlmittelanschluss eine vorteilhafte mechanische Verbindung von Kühler und Gehäuse sichergestellt werden, beispielsweise derart, dass unterschiedliche Wärmedehnungen oder relative Verschiebungen von Kühler und Gehäuse möglich und nicht oder nur geringfügig durch das Kontaktelement eingeschränkt sind. The coolant connection particularly preferably extends, in particular in the form of a tube, along a longitudinal axis. The contact element forms a mechanical contact and at the same time an electrically conductive contact between the cooler and the housing along a direction parallel to the longitudinal axis. As a result, while ensuring good electrical contact between the housing and the cooler as close as possible to the coolant connection, an advantageous mechanical connection between the cooler and the housing can be ensured, for example in such a way that different thermal expansions or relative displacements of the cooler and the housing are possible and not or only slightly restricted by the contact element are.

Vorzugsweise weist das Kontaktelement mindestens einen parallel zur Längsachse vorstehenden Kontaktbereich auf. Dadurch kann ein besonders definierter elektrischer Kontakt zwischen Gehäuse und Kühler erzeugt werden. Weiter bevorzugt weist das Kontaktelement mehrere um den Umfang der Durchgangsöffnung verteilte Kontaktbereiche auf. Dadurch kann einerseits erreicht werden, dass ein Ausgleich elektrischer Potenziale besonders gleichmäßig um den gesamten Umfang des Kühlmittelanschlusses erreicht wird. Weiterhin wird durch nur einzelne verteilt angeordnete Kontaktbereiche gleichzeitig eine vorteilhafte mechanische Anbindung zwischen Kühler und Gehäuse ermöglicht. Beispielsweise kann dadurch im Bereich des Kühlmittelanschlusses zusätzlich eine effektive Abdichtung ermöglicht werden. Preferably, the contact element has at least one contact area projecting parallel to the longitudinal axis. As a result, a particularly defined electrical contact can be created between the housing and the cooler. More preferably, the contact element has a plurality of contact areas distributed around the circumference of the through-opening. As a result, on the one hand it can be achieved that an equalization of electrical potentials is achieved particularly uniformly around the entire circumference of the coolant connection. Furthermore, an advantageous mechanical connection between the cooler and the housing is simultaneously made possible by only individual, distributed contact areas. For example, an effective seal can also be made possible in the area of the coolant connection.

Besonders bevorzugt sind die Kontaktbereiche in Form von Schneidelementen oder Kugelbereichen oder Pyramidenspitzen ausgebildet. Als Schneidelemente werden beispielsweise spitz zulaufende Elemente angesehen, welche, insbesondere in einer Kontaktebene, einen im wesentlichen linienförmigen Kontakt herstellen. Kugelbereiche können beispielsweise in Form von von einer Ebene vorstehende Halbkugeln ausgebildet sein. Pyramidenspitzen können beispielsweise in Form von pyramidenförmigen oder konischen Elemente, welche von einer Ebene vorstehen, ausgebildet sein. The contact areas are particularly preferably designed in the form of cutting elements or spherical areas or pyramid tips. Elements tapering to a point, for example, are regarded as cutting elements, which produce a substantially linear contact, in particular in a contact plane. Spherical regions can be designed, for example, in the form of hemispheres protruding from a plane. Pyramid tips can be designed, for example, in the form of pyramidal or conical elements which protrude from a plane.

Bevorzugt ist der Kontaktbereich in Form einer Ringschneide ausgebildet. Als Ringschneide wird ein von einer Oberfläche ringförmiges, vorstehendes Element angesehen, welches im Querschnitt spitz zulaufend, insbesondere konisch, ausgebildet ist. Eine Ringschneide bietet dabei eine besonders einfache und kostengünstig herzustellende Geometrie, welche einen linienförmigen Kontakt in Form eines um den Kühlmittelanschluss umlaufenden Kreisrings bewirkt. The contact area is preferably designed in the form of a cup point. A ring-shaped element protruding from a surface is considered to be a cup cutting edge, which element is designed to taper to a point, in particular conically, in cross-section. A cup cutting edge offers a particularly simple geometry that can be produced at low cost, which brings about linear contact in the form of a circular ring running around the coolant connection.

Weiter bevorzugt sind der Kühler und das Gehäuse entlang einer Richtung parallel zur Längsachse miteinander fest verbunden, vorzugsweise verschraubt oder aneinander geklemmt. Der vorstehende Kontaktbereich ist dabei derart ausgebildet, dass dieser sich bei einem erstmaligen Verbinden, insbesondere Verschrauben, von Kühler und Gehäuse miteinander in das in Richtung der Längsachse gegenüberliegende Bauteile eindrückt. Das heißt, der vorstehende Kontaktbereich bewirkt eine plastische Verformung desjenigen Bauteils, gegen welches der Kontaktbereich beim Verbinden angedrückt wird. Besonders vorteilhaft ist es, wenn der vorstehende Kontaktbereich am Gehäuse ausgebildet ist und sich beim Verbinden von Gehäuse und Kühler in den Kühler eingräbt.More preferably, the cooler and the housing are firmly connected to one another along a direction parallel to the longitudinal axis, preferably screwed or clamped to one another. The protruding contact area is designed in such a way that it presses into the opposite component in the direction of the longitudinal axis when the cooler and housing are first connected, in particular screwed together. This means that the protruding contact area brings about a plastic deformation of that component against which the contact area is pressed during connection. It is particularly advantageous if the protruding contact area is formed on the housing and digs into the cooler when the housing and cooler are connected.

Alternativ kann der vorstehende Kontaktbereich auch am Kühler ausgebildet sein und sich beim Verbinden von Gehäuse und Kühler in das Gehäuse eingraben. Dadurch kann besonders zuverlässig sichergestellt werden, dass nach dem Verbinden ein guter elektrisch leitender Kontakt hergestellt ist. Zudem kann durch das Eingraben eine größere Kontaktfläche hergestellt werden, beispielsweise gegenüber einem punktförmigen oder linienringförmigen Kontakt. Alternatively, the protruding contact area can also be formed on the cooler and dig into the case when connecting the case and cooler. As a result, it can be ensured in a particularly reliable manner that a good electrically conductive contact is made after the connection. In addition, a larger contact area can be produced by digging in, for example compared to a punctiform or linear ring-shaped contact.

Bevorzugt weist das Kontaktelement eine Kontaktfläche auf, um einen flächigen Kontakt zwischen Kühler und Gehäuse zu bilden. Dadurch kann ein besonders großer Kontaktbereich für den elektrischen Kontakt zur Verfügung stehen. Beispielsweise kann die Kontaktfläche in Form eines Kreisrings, das heißt einer ringförmigen Fläche zwischen zwei konzentrischen Kreisen, ausgebildet sein, welche konzentrisch zur Durchgangsöffnung angeordnet ist. The contact element preferably has a contact surface in order to form a surface contact between the cooler and the housing. As a result, a particularly large contact area can be available for the electrical contact. For example, the contact surface can be designed in the form of a circular ring, ie an annular surface between two concentric circles, which is arranged concentrically to the through-opening.

Vorzugsweise ist das Kontaktelement mit dem Gehäuse oder mit dem Kühler als ein einstückiges Bauteil ausgebildet. Dadurch kann eine besonders einfache und kostengünstige Konstruktion der Elektronikanordnung ermöglicht werden. Besonders vorteilhaft ist ein einstückig mit dem Gehäuse ausgebildetes Kontaktelement, wobei das Gehäuse vorzugsweise ein Gussbauteil ist. Vorzugsweise kann das Kontaktelement in diesem Fall für eine besonders präzise Geometrie durch eine nachträgliche spanende Bearbeitung des Gehäuses hergestellt werden. The contact element is preferably designed as a one-piece component with the housing or with the cooler. As a result, a particularly simple and cost-effective construction of the electronics arrangement can be made possible. A contact element formed in one piece with the housing is particularly advantageous, with the housing preferably being a cast component. In this case, the contact element can preferably be produced for a particularly precise geometry by subsequent machining of the housing.

Weiter bevorzugt ist das Kontaktelement als separates Bauteil zu Gehäuse und zu Kühler ausgebildet. Beispielsweise kann das Kontaktelement dabei als im Wesentlichen scheibenförmiges Bauteil ausgebildet sein, wodurch dieses einfach und präzise am Kühler oder am Gehäuse befestigt werden kann. More preferably, the contact element is designed as a separate component to the housing and to the cooler. For example, the contact element can be embodied as a substantially disc-shaped component, as a result of which it can be attached to the cooler or the housing in a simple and precise manner.

Besonders bevorzugt ist das Kontaktelement, wenn dieses als separates Bauteil zu Gehäuse und Kühler ausgebildet ist, mittels einer formschlüssigen Verbindung und/oder mittels einer stoffschlüssigen Verbindung mit dem Gehäuse oder mit dem Kühler verbunden. Beispielsweise kann das Kontaktelement mittels eines Clip-Mechanismus formschlüssig befestigt sein. Weiterhin kann beispielsweise eine Schweißverbindung oder eine Klebeverbindung als stoffschlüssige Verbindung vorgesehen sein. Bevorzugt weist der Kühler mindestens zwei Kühlmittelanschlüsse auf. Die Elektronikanordnung weist dabei pro Kühlmittelanschluss jeweils ein Kontaktelement auf. Das heißt, an jedem der Kühlmittelanschlüsse ist in unmittelbarer Nähe jeweils ein Kontaktelement vorgesehen, um an sämtlichen der Kühlmittelanschlüsse eine optimale elektrische Anwendung zu erhalten, zur Vermeidung unterschiedlicher elektrischer Potenziale der Kühlmittelanschlüsse gegenüber dem Gehäuse. The contact element is particularly preferably connected to the housing or to the cooler by means of a form-fitting connection and/or by means of a materially bonded connection if it is designed as a separate component from the housing and cooler. For example, the contact element can be fastened in a form-fitting manner by means of a clip mechanism. Furthermore, for example, a welded connection or an adhesive connection can be provided as an integral connection. The cooler preferably has at least two coolant connections. The electronics arrangement has one contact element for each coolant connection. This means that a contact element is provided in the immediate vicinity of each of the coolant connections in order to obtain optimum electrical application at all of the coolant connections, in order to avoid different electrical potentials of the coolant connections compared to the housing.

Besonders bevorzugt umfasst die Elektronikanordnung ferner eine Dichtung, welche dichtend zwischen dem Kühler und dem Gehäuse angeordnet ist. Vorzugsweise ist die Dichtung radial innerhalb des Kontaktelements angeordnet. Das heißt, die Dichtung ist bevorzugt so angeordnet, dass diese den Kühlmittelanschluss umgibt, um im Bereich des Kühlmittelanschlusses einen Fluideintritt zwischen Gehäuse und Kühler in das Gehäuse zu verhindern. The electronics arrangement particularly preferably also includes a seal which is arranged in a sealing manner between the cooler and the housing. The seal is preferably arranged radially inside the contact element. This means that the seal is preferably arranged in such a way that it surrounds the coolant connection in order to prevent fluid from entering the housing between the housing and the cooler in the region of the coolant connection.

Bevorzugt ist das elektronische Bauteil eine Leistungselektronik, vorzugsweise eines Wechselrichters. Beispielsweise kann der Wechselrichter vorgesehen sein zur Verwendung in einem Kraftfahrzeug. The electronic component is preferably power electronics, preferably an inverter. For example, the inverter can be provided for use in a motor vehicle.

Kurze Beschreibung der Zeichnungen Brief description of the drawings

Im Folgenden wird die Erfindung anhand von Ausführungsbeispielen in Verbindung mit den Figuren beschrieben. In den Figuren sind funktional gleiche Bauteile jeweils mit gleichen Bezugszeichen gekennzeichnet. Dabei zeigt: The invention is described below using exemplary embodiments in conjunction with the figures. In the figures, components that are functionally the same are each identified by the same reference symbols. It shows:

Figur 1 eine vereinfachte schematische Schnittansicht einer Elektronikanordnung gemäß einem ersten Ausführungsbeispiel der Erfindung, FIG. 1 shows a simplified schematic sectional view of an electronics arrangement according to a first exemplary embodiment of the invention,

Figur 2 perspektivische Detailansicht der Elektronikanordnung der Figur 1 , FIG. 2 perspective detailed view of the electronic arrangement of FIG. 1,

Figur 3 eine vereinfachte schematische Schnittansicht einer Elektronikanordnung gemäß einem zweiten Ausführungsbeispiel der Erfindung, und Figur 4 eine vereinfachte schematische Schnittansicht einer Elektronikanordnung gemäß einem dritten Ausführungsbeispiel der Erfindung. FIG. 3 shows a simplified schematic sectional view of an electronics arrangement according to a second exemplary embodiment of the invention, and FIG. 4 shows a simplified schematic sectional view of an electronics arrangement according to a third exemplary embodiment of the invention.

Bevorzugte Ausführungsformen der Erfindung Preferred Embodiments of the Invention

Figur 1 zeigt eine vereinfachte schematische Schnittansicht einer Elektronikanordnung 1 gemäß einem ersten Ausführungsbeispiel der Erfindung. Die Elektronikanordnung 1 umfasst ein elektronisches Bauteil 2, welches eine Leistungselektronik aufweist. Insbesondere handelt es sich bei der Elektronikanordnung 1 um einen Wechselrichter eines Kraftfahrzeugs. FIG. 1 shows a simplified schematic sectional view of an electronics arrangement 1 according to a first exemplary embodiment of the invention. The electronics arrangement 1 comprises an electronic component 2 which has power electronics. In particular, the electronics arrangement 1 is an inverter of a motor vehicle.

Beispielsweise kann der Wechselrichter vorgesehen sein, zur Bereitstellung von elektrischer Energie an einen Elektromotor des Kraftfahrzeugs, wobei eine Energieversorgung des Wechselrichters mittels eines elektrischen Energiespeichers des Kraftfahrzeugs erfolgen kann. For example, the inverter can be provided for providing electrical energy to an electric motor of the motor vehicle, with energy being able to be supplied to the inverter by means of an electrical energy store in the motor vehicle.

Weiterhin umfasst die Elektronikanordnung einen Kühler 3, zum Kühlen des elektronischen Bauteils 2. Wie in der Figur 1 zu erkennen, sind dabei Teilbereiche des elektronischen Bauteils 2 beidseitig des Kühlers 3 angeordnet. Dadurch kann eine besonders effiziente Wärmeabfuhr von dem elektronischen Bauteil 2 erfolgen. Furthermore, the electronics arrangement includes a cooler 3 for cooling the electronic component 2. As can be seen in FIG. As a result, heat can be dissipated particularly efficiently from the electronic component 2 .

Der Kühler 3 ist plattenförmig ausgebildet, mit zwei miteinander verbundenen und parallel angeordneten Kühlplatten 3a, 3b, zwischen welchen sich ein Kühlkanal 30 befindet. Der Kühlkanal 30 wird im Betrieb der Elektronikanordnung 1 von einem Kühlmedium, wie beispielsweise Wasser, oder einer anderen Kühlflüssigkeit, durchströmt. Beispielsweise kann der Kühler 3 dabei in Richtung der durch die Pfeile A gekennzeichneten Richtung durchströmt werden. The cooler 3 is plate-shaped, with two mutually connected and parallel cooling plates 3a, 3b, between which a cooling channel 30 is located. During operation of the electronics arrangement 1 , a cooling medium such as water or another cooling liquid flows through the cooling channel 30 . For example, the flow can flow through the cooler 3 in the direction indicated by the arrows A.

Das elektronische Bauteil 2 und der Kühler 3 sind innerhalb eines Gehäuses 4 angeordnet. Das Gehäuse 4 dient dem Schutz vor Umwelteinflüssen, sowie vorzugsweise auch vor elektromagnetischer Strahlung. Das Gehäuse 4 ist dabei zweiteilig ausgebildet, mit einem Gehäuseboden 42 und einem Gehäusedeckel 43. Der Kühler 3 ist an Absätzen 44 des Gehäuses 4 mit dem Gehäuse 4 verschraubt, um eine mechanische Verbindung und Positionierung von Kühler 3 und elektronischem Bauteil 2 im Gehäuse 4 bereitzustellen. The electronic component 2 and the cooler 3 are arranged inside a housing 4 . The housing 4 serves to protect against environmental influences and preferably also against electromagnetic radiation. The housing 4 is designed in two parts, with a housing base 42 and a housing cover 43. The cooler 3 is screwed to the housing 4 at shoulders 44 of the housing 4 in order to provide a mechanical connection and positioning of the cooler 3 and the electronic component 2 in the housing 4 .

Um einen Durchlauf des Kühlers 3 mit dem Kühlmedium zu ermöglichen, weist der Kühler 3 zwei Kühlmittelanschlüsse 31 auf, welche jeweils in Fluidverbindung mit dem Kühlkanal 30 stehen. Die Kühlmittelanschlüsse 31 sind jeweils als rohrförmige Stutzen ausgebildet, welche sich jeweils entlang einer Längsachse 50 erstrecken. Die Längsachse 50 ist dabei senkrecht zu den Kühlplatten 3a, 3b. In order to enable the cooling medium to flow through the cooler 3 , the cooler 3 has two coolant connections 31 which are each in fluid communication with the cooling channel 30 . The coolant connections 31 are each designed as tubular sockets, which each extend along a longitudinal axis 50 . The longitudinal axis 50 is perpendicular to the cooling plates 3a, 3b.

Die Kühlmittelanschlüsse 31 ragen dabei durch jeweils eine Durchgangsöffnung 41 des Gehäuses 4 hindurch, sodass die Kühlmittelanschlüsse 31 außerhalb des Gehäuses 4 beispielsweise mit (nicht dargestellten) Leitungen verbunden werden können. Die Durchgangsöffnungen 41 sind dabei jeweils so ausgebildet, dass zwischen einem Innenumfang der Durchgangsöffnung 41 und dem jeweiligen Kühlmittelanschluss 31 ein radialer Spalt 35 vorliegt. Dadurch können sich Kühlmittelanschlüsse 31 und Gehäuse 4 zumindest geringfügig gegeneinander bewegen, beispielsweise durch unterschiedliche Wärmeausdehnungen von Gehäuse 4 und Kühler 3. The coolant connections 31 each protrude through a passage opening 41 of the housing 4 so that the coolant connections 31 can be connected outside of the housing 4 to lines (not shown), for example. The through-openings 41 are each formed in such a way that there is a radial gap 35 between an inner circumference of the through-opening 41 and the respective coolant connection 31 . As a result, coolant connections 31 and housing 4 can move at least slightly in relation to one another, for example due to different thermal expansions of housing 4 and cooler 3.

Die Elektronikanordnung 1 umfasst ferner jeweils ein Kontaktelement 5 pro Kühlmittelanschluss 31. The electronics arrangement 1 also includes a contact element 5 for each coolant connection 31.

Ein einzelnes Kontaktelement 5 ist in perspektivischer Ansicht in der Figur 2 dargestellt. Das Kontaktelement 5 umfasst dabei mehrere auf einem Kreisring konzentrisch zur Durchgangsöffnung 41 angeordnete vorstehende Kontaktbereiche 51, welche von einer dem Kühler 3 zugewandten Grundfläche 45 des Gehäusebodens 42 entlang einer Richtung parallel zur Längsachse 50 vorstehen. Jeder Kontaktbereich 51 ist dabei in Form eines Schneidelements ausgebildet, welches in einer Ebene parallel zur Grundfläche 45 eine vorbestimmte Länge 51a aufweist, und welches im Querschnitt spitz zuläuft (vergleiche Figur 1). A single contact element 5 is shown in a perspective view in FIG. The contact element 5 comprises a plurality of protruding contact regions 51 arranged on a circular ring concentrically to the through-opening 41 and protruding from a base surface 45 of the housing base 42 facing the cooler 3 in a direction parallel to the longitudinal axis 50 . Each contact area 51 is designed in the form of a cutting element which has a predetermined length 51a in a plane parallel to the base surface 45 and which tapers to a point in cross section (cf. FIG. 1).

Sämtliche Kontaktbereiche 51 sind dabei in einem vordefinierten radialen Abstand 75 von einem Innenumfang der Durchgangsöffnung 41 angeordnet. Der radiale Abstand 75 beträgt vorzugsweise maximal 50 %, bevorzugt maximal 30 %, insbesondere mindestens 10 %, eines Innendurchmessers 47 der Durchgangsöffnung 41. All contact areas 51 are arranged at a predefined radial distance 75 from an inner circumference of through-opening 41 . The radial distance 75 is preferably a maximum of 50%, preferably a maximum of 30% %, in particular at least 10%, of an inner diameter 47 of the through-opening 41.

Kühler 3 und Gehäuse 4 sind dabei derart miteinander verschraubt, dass die Kontaktbereiche 51 in die Unterseite 36 des Kühlers 3 eingegraben sind. Dadurch bildet das Kontaktelement 5 einen mechanischen und einen elektrischen Kontakt zwischen Gehäuse 4 und Kühler 3 aus. Somit können durch das elektronische Bauteil 2 verursachte Potenzialunterschiede eines elektrischen Potenzials zwischen Kühler 3 und Gehäuse 4 über die Kontaktelemente 5 ausgeglichen werden. Dadurch, dass die Kontaktelemente 5 konzentrisch zur Durchgangsöffnung 41 und damit besonders nahe an den Kühlmittelanschlüssen 31 angeordnet sind, können insbesondere auch Potenzialunterschiede an den oder im Bereich der Kühlmittelanschlüsse 31 besonders zuverlässig und ohne signifikante Verschleppungen ausgeglichen werden. Beispielsweise kann dadurch vermieden werden, dass bei schnellen Schaltvorgängen des elektronischen Bauteils 2 unterschiedliche Potenziale der Kühlmittelanschlüsse 31 im Vergleich zu Bereichen des Kühlers 3 nahe an den Absätzen 44, beispielsweise wenn diese ebenfalls elektrisch mit dem Gehäuse 4 kontaktiert sind, vorliegen. The cooler 3 and the housing 4 are screwed together in such a way that the contact areas 51 are dug into the underside 36 of the cooler 3 . As a result, the contact element 5 forms a mechanical and an electrical contact between the housing 4 and the cooler 3 . In this way, potential differences in an electrical potential between the cooler 3 and the housing 4 caused by the electronic component 2 can be equalized via the contact elements 5 . Due to the fact that the contact elements 5 are arranged concentrically to the through-opening 41 and thus particularly close to the coolant connections 31, potential differences at or in the area of the coolant connections 31 can also be compensated particularly reliably and without significant carry-overs. For example, this can prevent the coolant connections 31 from having different potentials in rapid switching operations of the electronic component 2 compared to areas of the cooler 3 close to the shoulders 44, for example if these are also electrically contacted with the housing 4.

Dadurch, dass die Kontaktbereiche 51 in Form von Schneidelementen ausgebildet sind, liegt ein im Wesentlichen linienförmiger und dennoch nur punktuell um den Umfang der Durchgangsöffnung 41 verteilter Kontakt zum Kühler 3 vor. Dadurch ergibt sich ein guter Kompromiss zwischen einem möglichst großen Kontakt zum Ausgleich elektrischer Potenziale und andererseits einer ausreichenden Flexibilität des mechanischen Kontakts zwischen Kühler 3 und Gehäuse 4, um zusätzlich eine Abdichtung mittels einer zusätzlichen Dichtung zwischen Kühler 3 und Gehäuse 4 im Bereich der Kühlmittelanschlüsse 31 bereitstellen zu können. Due to the fact that the contact regions 51 are designed in the form of cutting elements, there is essentially linear contact with the cooler 3 which is nevertheless distributed only at certain points around the circumference of the through-opening 41 . This results in a good compromise between the largest possible contact to equalize electrical potentials and, on the other hand, sufficient flexibility of the mechanical contact between the cooler 3 and the housing 4 in order to additionally provide a seal by means of an additional seal between the cooler 3 and the housing 4 in the area of the coolant connections 31 to be able to

Eine derartige Abdichtung mittels einer zusätzlichen Dichtung 7 ist im zweiten Ausführungsbeispiel, welches in der Figur 3 dargestellt ist, vorgesehen. Das zweite Ausführungsbeispiel entspricht dabei im Wesentlichen dem ersten Ausführungsbeispiel der Figuren 1 und 2, mit dem Unterschied der zusätzlichen Dichtung 7. Die Dichtung 7 ist aus einem elastischen Material ausgebildet. Die Dichtung 7 ist dabei dichtend zwischen Kühler 3 und Gehäuse 4 angeordnet, wobei die Dichtung 7 radial innerhalb des Kontaktelements 5 angeordnet ist. Im Detail befindet sich die Dichtung 5 auf einer Dichtfläche 70, welche sich radial innerhalb der Kontaktbereiche 51 befindet und ein Teil der Grundfläche 45 des Gehäusebodens 42 ist (vergleiche Figur 2). Such a seal by means of an additional seal 7 is provided in the second exemplary embodiment, which is shown in FIG. The second embodiment essentially corresponds to the first embodiment of Figures 1 and 2, with the difference of the additional seal 7. The seal 7 is made of an elastic material. The seal 7 is arranged in a sealing manner between the cooler 3 and the housing 4 , the seal 7 being arranged radially inside the contact element 5 . In detail, the seal 5 is located on a sealing surface 70, which is located radially inside the contact areas 51 and is part of the base surface 45 of the housing bottom 42 (compare FIG. 2).

Figur 4 zeigt eine vereinfachte schematische Schnittansicht einer Elektronikanordnung 1 gemäß einem dritten Ausführungsbeispiel der Erfindung. Das dritte Ausführungsbeispiel entspricht im Wesentlichen dem ersten Ausführungsbeispiel der Figuren 1 und 2, mit dem Unterschied, dass das Kontaktelement 5 anstatt mehrerer um den Umfang verteilter Kontaktbereiche 51 eine einzige Kontaktfläche 53 aufweist, welche einen flächigen Kontakt zwischen Kühler 3 und Gehäuse 4 herstellt. Durch die Kontaktfläche 53 kann ein besonders guter elektrischer Kontakt zwischen Kühler 3 und Gehäuse 4 hergestellt werden, um die elektrischen Potenziale im Bereich der Kühlmittelanschlüsse 31 zwischen Kühler 3 und Gehäuse 4 besonders zuverlässig auszugleichen. Die Kontaktfläche 53 ist dabei nahe eines Innenumfangs der Durchgangsöffnung 41 ausgebildet. Die Kontaktfläche 53 wird dabei durch eine Oberseite eines gegenüber der Grundfläche 45 des Gehäusebodens 42 vorstehenden Bereichs gebildet. FIG. 4 shows a simplified schematic sectional view of an electronics arrangement 1 according to a third exemplary embodiment of the invention. The third exemplary embodiment essentially corresponds to the first exemplary embodiment in FIGS. 1 and 2, with the difference that the contact element 5 has a single contact surface 53 instead of several contact areas 51 distributed around the circumference, which produces a flat contact between the cooler 3 and the housing 4. A particularly good electrical contact between the cooler 3 and the housing 4 can be established by the contact surface 53 in order to particularly reliably equalize the electrical potentials in the region of the coolant connections 31 between the cooler 3 and the housing 4 . In this case, the contact surface 53 is formed close to an inner circumference of the through-opening 41 . In this case, the contact surface 53 is formed by an upper side of a region which protrudes in relation to the base surface 45 of the housing bottom 42 .

Claims

Ansprüche Expectations 1. Elektronikanordnung, umfassend: 1. Electronics assembly comprising: - ein elektronisches Bauteil (2), - an electronic component (2), - einen Kühler (3), zum Kühlen des elektronischen Bauteils (2), - a cooler (3) for cooling the electronic component (2), - ein Gehäuse (4), und - a housing (4), and - ein Kontaktelement (5), - a contact element (5), - wobei das elektronische Bauteil (2) und der Kühler (3) innerhalb des Gehäuses (4) angeordnet sind, - wherein the electronic component (2) and the cooler (3) are arranged within the housing (4), - wobei der Kühler (3) zumindest einen Kühlmittelanschluss (31) aufweist, welcher durch eine Durchgangsöffnung (41) des Gehäuses (4) hindurchragt,- wherein the cooler (3) has at least one coolant connection (31) which protrudes through a through-opening (41) of the housing (4), - wobei das Kontaktelement (5) den Kühler (3) und das Gehäuse (4) elektrisch leitend miteinander verbindet, und - wherein the contact element (5) connects the cooler (3) and the housing (4) to one another in an electrically conductive manner, and - wobei das Kontaktelement (5) konzentrisch zur Durchgangsöffnung (41) ausgebildet und angeordnet ist. - Wherein the contact element (5) is formed and arranged concentrically to the through-opening (41). 2. Elektronikanordnung nach Anspruch 1 , wobei zwischen dem Kühlmittelanschluss (31) und dem Gehäuse (4) ein radialer Spalt (35) angeordnet ist. 2. Electronics arrangement according to claim 1, wherein a radial gap (35) is arranged between the coolant connection (31) and the housing (4). 3. Elektronikanordnung nach einem der vorhergehenden Ansprüche, wobei sich der Kühlmittelanschluss (31), insbesondere rohrförmig, entlang einer Längsachse (50) erstreckt, und wobei das Kontaktelement (5) einen mechanischen Kontakt und einen elektrisch leitenden Kontakt von Kühler (3) und Gehäuse (4) in einer Richtung parallel zur Längsachse (50) bildet. 3. Electronics arrangement according to one of the preceding claims, wherein the coolant connection (31), in particular tubular, extends along a longitudinal axis (50), and wherein the contact element (5) has a mechanical contact and an electrically conductive contact of the cooler (3) and housing (4) in a direction parallel to the longitudinal axis (50). 4. Elektronikanordnung nach Anspruch 3, wobei das Kontaktelement (5) zumindest einen parallel zur Längsachse (50) vorstehenden Kontaktbereich (51) aufweist. Elektronikanordnung nach Anspruch 4, wobei das Kontaktelement (5) mehrere um den Umfang der Durchgangsöffnung (41) verteilte Kontaktbereiche (51) aufweist. Elektronikanordnung nach Anspruch 4, wobei die Kontaktbereiche (51) in Form von Schneidelementen oder Kugelbereichen oder Pyramidenspitzen ausgebildet sind. Elektronikanordnung nach Anspruch 4, wobei der Kontaktbereich (51) in Form einer Ringschneide ausgebildet ist. Elektronikanordnung nach einem der Ansprüche 3 bis 7, wobei der Kühler (3) und das Gehäuse (4) in einer Richtung parallel zur Längsachse (50) miteinander fest verbunden sind, und wobei der vorstehende Kontaktbereich (51) derart ausgebildet ist, dass der vorstehende Kontaktbereich (51) sich bei einem erstmaligen Verschrauben von Kühler (3) und Gehäuse (4) miteinander in das in Richtung der Längsachse (50) gegenüberliegende Bauteil eindrückt. Elektronikanordnung nach einem der vorhergehenden Ansprüche, wobei das Kontaktelement (5) eine Kontaktfläche (53) aufweist, um einen flächigen Kontakt zwischen Kühler (3) und Gehäuse (4) zu bilden. Elektronikanordnung nach einem der vorhergehenden Ansprüche, wobei das Kontaktelement (5) mit dem Gehäuse (4) oder mit dem Kühler (3) als einstückiges Bauteil ausgebildet ist. Elektronikanordnung nach einem der Ansprüche 1 bis 9, wobei das Kontaktelement (5) als separates Bauteil zu Gehäuse (4) und Kühler (3) ausgebildet ist. Elektronikanordnung nach Anspruch 11, wobei das Kontaktelement (5) mittels einer formschlüssigen Verbindung und/oder mittels einer stoffschlüssigen Verbindung mit dem Gehäuse (4) oder mit dem Kühler (3) verbunden ist. Elektronikanordnung nach einem der vorhergehenden Ansprüche, wobei der Kühler (3) mindestens zwei Kühlmittelanschlüsse (31) aufweist, und wobei die Elektronikanordnung (1) jeweils ein Kontaktelement (5) pro Kühlmittelanschluss (31) aufweist. Elektronikanordnung nach einem der vorhergehenden Ansprüche, ferner umfassend eine Dichtung (7), welche dichtend zwischen Kühler (3) und Gehäuse (4) angeordnet ist, insbesondere wobei die Dichtung (7) radial innerhalb des Kontaktelements (5) angeordnet ist. Elektronikanordnung nach einem der vorhergehenden Ansprüche, wobei das elektronische Bauteil (2) eine Leistungselektronik, insbesondere eines Wechselrichters, aufweist. 4. Electronics arrangement according to claim 3, wherein the contact element (5) has at least one parallel to the longitudinal axis (50) protruding contact area (51). Electronics arrangement according to Claim 4, in which the contact element (5) has a plurality of contact regions (51) distributed around the circumference of the through-opening (41). Electronics arrangement according to Claim 4, in which the contact areas (51) are designed in the form of cutting elements or spherical areas or pyramid tips. Electronics arrangement according to Claim 4, in which the contact region (51) is in the form of a cup point. Electronics arrangement according to one of Claims 3 to 7, in which the cooler (3) and the housing (4) are firmly connected to one another in a direction parallel to the longitudinal axis (50), and the projecting contact region (51) is designed in such a way that the projecting Contact area (51) is pressed into the opposite component in the direction of the longitudinal axis (50) when the cooler (3) and housing (4) are screwed together for the first time. Electronics arrangement according to one of the preceding claims, in which the contact element (5) has a contact surface (53) in order to form a surface contact between the cooler (3) and the housing (4). Electronics arrangement according to one of the preceding claims, in which the contact element (5) is formed as a one-piece component with the housing (4) or with the cooler (3). Electronics arrangement according to one of Claims 1 to 9, in which the contact element (5) is designed as a separate component from the housing (4) and cooler (3). Electronics arrangement according to Claim 11, in which the contact element (5) is connected to the housing (4) or to the cooler (3) by means of a positive connection and/or by means of a material connection. Electronics arrangement according to one of the preceding claims, wherein the cooler (3) has at least two coolant connections (31), and wherein the electronics arrangement (1) has one contact element (5) per coolant connection (31). Electronics arrangement according to one of the preceding claims, further comprising a seal (7) which is arranged sealingly between the cooler (3) and housing (4), in particular wherein the seal (7) is arranged radially inside the contact element (5). Electronics arrangement according to one of the preceding claims, wherein the electronic component (2) has power electronics, in particular an inverter.
EP22761101.9A 2021-09-14 2022-08-02 Electronic arrangement Pending EP4402000A1 (en)

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DE102021210153.4A DE102021210153A1 (en) 2021-09-14 2021-09-14 electronics arrangement
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JP (1) JP2024533491A (en)
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JP6296027B2 (en) * 2015-09-04 2018-03-20 トヨタ自動車株式会社 Refrigerant passage connection structure
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WO2023041241A1 (en) 2023-03-23
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KR20240063135A (en) 2024-05-09
CN117940298A (en) 2024-04-26

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