EP4381908A1 - Boîtier électronique destiné à être monté sur un rail de support, et système - Google Patents

Boîtier électronique destiné à être monté sur un rail de support, et système

Info

Publication number
EP4381908A1
EP4381908A1 EP22748003.5A EP22748003A EP4381908A1 EP 4381908 A1 EP4381908 A1 EP 4381908A1 EP 22748003 A EP22748003 A EP 22748003A EP 4381908 A1 EP4381908 A1 EP 4381908A1
Authority
EP
European Patent Office
Prior art keywords
electronics housing
thermally conductive
conductive device
segment
sections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22748003.5A
Other languages
German (de)
English (en)
Inventor
Ingo Tasche
Elmar Schaper
Hans-Peter Hudetz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Phoenix Contact GmbH and Co KG
Original Assignee
Phoenix Contact GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Contact GmbH and Co KG filed Critical Phoenix Contact GmbH and Co KG
Publication of EP4381908A1 publication Critical patent/EP4381908A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1462—Mounting supporting structure in casing or on frame or rack for programmable logic controllers [PLC] for automation or industrial process control
    • H05K7/1474—Mounting of modules, e.g. on a base or rail or wall
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/015—Boards, panels, desks; Parts thereof or accessories therefor
    • H02B1/04—Mounting thereon of switches or of other devices in general, the switch or device having, or being without, casing
    • H02B1/052—Mounting on rails
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/56—Cooling; Ventilation

Definitions

  • the invention relates to an electronics housing for mounting on a mounting rail and a system which includes at least one such electronics housing.
  • Electronics housings are preferably made of plastic and designed to house electronic and/or electrical devices, such as printed circuit boards, passive or active electrical components or electronic circuits.
  • a challenge in a plastic housing mounted on a mounting rail, in which electrical and/or electronic devices are implemented, is to be seen in transporting the heat loss that occurs in the interior out of the plastic housing.
  • the heat loss occurring inside the housing is dissipated through openings in the housing, such as bores or slots, and via convection.
  • a heat sink is known from DE 102015 111 277 B4, which is provided for a device that generates heat loss and is to be attached to a mounting rail.
  • the well-known heat sink has cooling ribs with dissipation elements that rest against the mounting rail in order to dissipate heat towards the mounting rail.
  • An electronic device with a housing is known from DE 102018 124 186 B4, in the interior of which a printed circuit board with a heat-generating electronic component is arranged, the housing being mounted on a mounting rail.
  • the electronic device has a cooling element, which is arranged on the housing, and a receptacle for receiving a mounting rail.
  • the cooling element extends into the interior and is in thermal contact with the circuit board.
  • the cooling element can be thermally connected to the support rail and has a bulge in the area where the housing is seated, which is connected to a the housing facing side of the mounting rail can be brought into thermal contact.
  • the cooling element has a further bulge which can be brought into thermal contact with a side of the support rail which is remote from the housing, the bulge and the further bulge being realized by a curved shape of the cooling element.
  • a mounting rail on which electrical devices are arranged is known from EP 2 961 013 B1. Furthermore, at least one heat sink is provided, which is in thermal contact with an electrical device when the electrical device is arranged as intended on the mounting rail.
  • the invention is based on the object of creating an electronics housing for mounting on a mounting rail and a system which enable heat generated in the interior of the electronics housing to be dissipated to the outside in an efficient and cost-effective manner, in particular to a mounting rail.
  • a core idea of the invention can be seen in providing an electronics housing, which can be a plastic housing, for example.
  • the electronics housing has a thermally conductive device arranged at least in sections in the interior of the electronics housing, with the help of which the heat generated in the interior of the electronics housing can be dissipated in the installed state, preferably to a mounting rail and/or, if present, to a rear wall of the control cabinet.
  • In the mounted state means that the electronics housing is mounted on the mounting rail, preferably snapped on.
  • the thermally conductive device is preferably a one-piece stamped and bent part that can be produced from a thermally conductive material, such as metal.
  • the electronics housing is made of a plastic material, for example.
  • the thermally conductive device can preferably be embodied as a multifunctional device that i) can dissipate heat from the interior of the electronics housing and, according to an exemplary embodiment, optionally ii) can also function as a mounting device with the aid of which the electronics housing can be mounted on a mounting rail, and/ or iii) can function as a support device in order to absorb and/or transmit external forces acting on the electronics housing.
  • FIG. 1 shows an exemplary electronics housing with the cover removed
  • FIG. 2 shows the exemplary thermally conductive device shown in FIG. 1, which rests on a support rail with a hat profile
  • FIG. 3 shows the thermally conductive device shown in FIG. 2 with an optional third profiled web-shaped segment, but without a mounting rail, and
  • FIG. 4a shows the electronics housing shown in FIG. 1 with a partially removed cover, but without a heat source and without a mounting rail
  • FIG. 4b shows the electronics housing shown in FIG. 1 with an alternatively shaped insulation device.
  • FIG. 1 shows an exemplary electronics housing 10, which can be a plastic housing, for example.
  • the exemplary electronics housing 10 can also be designed, for example, as a stackable terminal housing. In this way, several electronic housings of this type can be arranged in a row next to one another on a mounting rail 20 .
  • the electronics housing 10 can accommodate at least one heat source 30 in its interior.
  • the at least one heat source 30 is preferably heat-generating electrical and/or electronic devices, such as electrical, active and/or active components and/or electronic circuits and/or a circuit with, for example, electrical passive and/or active components and/or or printed circuit board equipped with electronic circuits.
  • the electronics housing 10 can have at least one thermally conductive device 40 which can be arranged at least in sections in the interior of the electronics housing 10 .
  • the thermally conductive device 40 is designed and designed in particular to dissipate the heat generated by the at least one heat source 30 from the interior of the electronics housing 10 , specifically preferably towards the mounting rail 20 .
  • the exemplary thermally conductive device 40 can have a profiled structure, which can preferably be made of metal and can be formed as a one-piece stamped and bent part.
  • the thermally conductive device 40 has a base segment 50 which, when the electronics housing 10 is mounted on the mounting rail 20 , extends transversely to the longitudinal axis of the mounting rail 20 and touches the mounting rail 40 at a first section 21 and at a second section 22 .
  • the term “touch” is to be understood in particular to mean that the base segment 50 can touch the sections 21 and 22 at points or over an area.
  • the two sections 21 and 22 are opposite one another and each form a free end of the mounting rail 20.
  • the two sections 21 and 22 also extend parallel to the longitudinal axis of the mounting rail 20. In this way, the thermally conductive device 40 can remove heat from the interior of the electronics housing 20 Absorb heat and dissipate it to the two sections 21 and 22 of the mounting rail 20.
  • the longitudinal axis of the support rail 20 and thus also the sections 21 and 22 run in their longitudinal extent in the x-direction.
  • the exemplary support rail 20 can have a hat profile. However, this is merely an exemplary configuration of the support rail 20. It can also have a U-profile, for example.
  • the two sections 21 and 22 each form an edge section of the support rail 20, which extend transversely to the longitudinal axis or x-axis, namely in the y-direction and in the -y-direction.
  • the base segment 50 has, for example, a strip-shaped, rectangular surface, specifically with a width that extends parallel to the x-axis, ie parallel to the longitudinal axis of the support rail 20, and a width that extends parallel to the y-axis. the length.
  • the length of the base segment 50 can be selected in such a way that the base segment 50 lies flat on the section 21 in the assembled state and at least partially touches the section 22 . In this way, the area of the hat-shaped support rail 20 lying between the two sections 21 and 22 is completely covered.
  • a thermal short circuit occurs thanks to the base segment 50 of the thermally conductive device 40 , as a result of which additional radiant heat can be emitted to the mounting rail 20 .
  • the electronics housing 10 can have a first side wall 11 and a second side wall 13 (shown only partially in FIG. 2).
  • the two side walls 11 and 13 are arranged opposite and preferably congruent to each other.
  • the electronics housing 10 can have a peripheral wall 12 at least in sections, which connects the side walls 11 and 13 at least in sections.
  • the interior of the electronics housing 10 is defined by the two side walls 11 and 13 and the wall 12 .
  • the thermally conductive device 40 can be designed so that it can be fastened to the electronics housing 20, with the electronics housing 10 being designed for mounting on the mounting rail 20 with the aid of the thermally conductive device 40.
  • the thermally conductive device 40 can have a mounting element 60 which, for example, can form a pivoting lug that makes it possible to latch the electronics housing 10 on the mounting rail 20 in a non-positive manner.
  • This locking or clamping mechanism is shown in particular in FIGS.
  • the mounting element 60 is designed to grasp one of the two sections, in the present example the section 22 of the mounting rail 20, when the electronics housing 10 is in the mounted state on the mounting rail 20.
  • the mounting element 60 of the thermally conductive device 40 advantageously has a section, for example the pivoting-in nose already mentioned, which in the mounted state can engage behind or around the section 22 .
  • the thermally conductive device 40 can have a base surface 70 which has a section 71 which adjoins the base segment 50 and preferably encloses a right angle with it.
  • the base area 70 or the section 71 preferably lies completely in the yz plane of the coordinate system shown in FIG.
  • the base surface 70 or the section 71 can have the shape of a band, strip or bar, for example, in which at least one opening 80 is made, through which, for example, a mounting pin 90 formed on the side surface 11 can be mushroom-shaped can, can be plugged through in order to be able to detachably attach the thermally conductive device 40 to the electronics housing 10 .
  • the base area 70 or the section 71 can have the same length as the base segment 50 . In the exemplary embodiment shown, the base segment 50 and the section 71 of the thermally conductive device 40 run parallel to one another.
  • the thermally conductive device 40 can have, for example, a first profiled, bar-shaped segment 100 which, for example, runs transversely to the base segment 50 in its longitudinal extension.
  • the longitudinal extension of segment 100 thus lies in the plane in which base 70 or section 71 is located, i.e. in the y-z plane of the coordinate system shown in FIG.
  • the longitudinal extent of segment 100 is parallel to the z-axis.
  • the first profiled bar-shaped segment 100 borders, for example, on an outer, right-hand end of the base segment 50 and, in the installed state, extends at least in sections into the interior of the electronics housing 10.
  • section 71 of base area 70 can preferably be adjoined by a strip-shaped section 72 whose longitudinal extension lies in the plane of section 71 .
  • the sections 71 and 72 form an angle - an acute or obtuse angle - which can preferably be 90°.
  • the section 72 can be considered a part of the bar-shaped segment 100 .
  • a leg 101 can be formed, which can enclose an acute or obtuse angle, for example an angle of 90°, with the section 72. In this special case, the leg 101 lies in the xz plane.
  • Leg 101 and/or section 72 form if present, the web-shaped, profiled segment 100. As can be seen in FIG.
  • the segment 100 shown by way of example in FIGS. 1-3 has an L-profile.
  • the exemplary web-shaped, profiled segment 100 can also have a U- or hollow profile.
  • FIG. 3 also shows by way of example, further openings 80 can be provided in section 72 of base surface 70, through which mounting pins formed on side surface 11 can be inserted in order to be able to fasten thermally conductive device 40 to electronics housing 10, for example in a detachable manner.
  • the thermally conductive device 40 can have, for example, a second profiled, bar-shaped segment 110 in order to improve heat dissipation.
  • segment 110 extends longitudinally transversely to base segment 50.
  • the longitudinal extent of segment 110 thus lies in the plane in which base 70 or portion 71 is located, i.e., in the y-z plane of that shown in FIG coordinate system.
  • the longitudinal extent of segment 110 is parallel to the z-axis.
  • the segment 110 borders, for example, on an outer left end of the base segment 50 and, in the assembled state, extends at least in sections into the interior of the electronics housing 10.
  • the section 71 of the base area 70 can preferably be adjoined by a further strip-shaped section 73 whose longitudinal extent lies in the plane of the section 71 .
  • Sections 71 and 73 form an acute or obtuse angle, which can be, for example, an angle of 90°.
  • Section 73 can be considered part of segment 110 .
  • a leg 112 can be formed, which can enclose an acute or obtuse angle, for example an angle of 90°, with the section 73.
  • the leg 101 lies in the xz plane.
  • the leg 112 can end in a support area 111 on its underside, which lies in the plane of the base segment 50, ie in a plane parallel to the xy plane, and is laterally adjacent to the base segment 50.
  • the support area 111 thus forms an extension of the base segment 50 transversely to the longitudinal axis of the support rail 20, ie in the y-direction. In the mounted state, the support area 111 lies on the section 21 of the support rail 20 on.
  • the support area 111 ensures better heat dissipation towards the mounting rail 20 and stable and robust mounting of the electronics housing 10 on the mounting rail 20.
  • another Legs 113 may be formed, which may enclose an acute or obtuse angle, for example an angle of 90°, with section 73 .
  • the leg 101 lies in the xz plane.
  • the legs 112 and 113 and the strip-shaped section 73 together form the bar-shaped, profiled segment 110, if present.
  • the second profiled, bar-shaped segment 110 can have a U-profile.
  • thermally conductive device 40 designed in this way, by way of example and shown in FIGS. 1 and 2, has a U-shaped profile when viewed in the x-direction.
  • the thermally conductive device 40 can preferably be a multifunctional device which on the one hand serves to dissipate heat generated in the interior of the electronics housing 10 from the interior to the outside and preferably to the mounting rail 20 . Furthermore, the thermally conductive device 40 can preferably also be used to fasten the electronics housing 10 to the mounting rail 20, for example to be able to snap it on.
  • the thermally conductive device 40 can, for example, have at least one further profiled, bar-shaped segment 120, which is only shown in FIG. 3 by way of example.
  • segment 120 runs, for example, transversely to base segment 50.
  • the longitudinal extent of segment 120 thus lies in the plane in which base surface 70 or section 71 is located, ie in the yz plane of that shown in FIG coordinate system.
  • the longitudinal extension of the bar-shaped segment 120 runs parallel to the z-axis.
  • the segment 120 extends between the two web-shaped, profiled segments 100 and 110 in the assembled state, at least in sections, into the interior of electronics housing 10.
  • Sections 71 and 74 form an acute or obtuse angle, which can preferably be 90°.
  • Section 74 can be considered part of segment 120 .
  • a leg 122 can be integrally formed on the edge of section 74 pointing towards segment 110, which can enclose an acute or obtuse angle, for example an angle of 90°, with section 74.
  • leg 1122 lies in the x-z plane.
  • a further leg 121 can be formed on the edge of section 74 pointing towards segment 100, which can enclose an acute or obtuse angle, for example an angle of 90°, with section 74.
  • leg 121 lies in the x-z plane.
  • the legs 121 and 122 and the strip-shaped section 74 together form the bar-shaped, profiled segment 120, if present.
  • the second profiled, bar-shaped segment 120 can have a U-profile.
  • the segment 120 can have a T, L or hollow profile.
  • the thermally conductive device 40 designed in this way has an E-shaped course rotated by ⁇ 90° when viewed in the x-direction.
  • the two outer profiled bar-shaped segments 100 and 110 can have the same lengthwise extent in the x-direction, while the middle profiled bar-shaped segment 120 can have a shorter lengthwise extent in the x-direction. With this exemplary dimensioning, the middle segment 120 would extend up to or almost up to the heat source 30 .
  • Each of the profiled, bar-shaped segments 100, 110, 120 supports the heat dissipation from the interior of the electronics housing 10 to the outside and in particular to the mounting rail 20 thanks to its channel-shaped design.
  • the two outer segments 100 and 110 and the section 71 or the base segment can at least partially surround the heat source 30 .
  • the thermally conductive device 40 having a plurality of web-shaped, profiled segments can be regarded as a type of fan cooler.
  • the exemplary multifunctionality of the thermally conductive device 40 can be further expanded by, if present, the leg 101 of the bar-shaped, profiled segment 100 and/or at least one of the two legs 112 and 113 of the bar-shaped, profiled segment 110 and/or at least one of the Both legs 121 and 122 of the web-shaped, profiled segment 120 have an extension in the -x- direction in such a way that they can absorb and/or pass on forces acting on the electronics housing 10 from the outside. In this case, the corresponding legs act as supporting elements of the electronics housing 10.
  • the legs 101, 112, 113, 121 and 122 run obliquely, preferably perpendicularly, between the side surfaces 11 and 13, with the legs 61, 112 and 113 in the closed state of the housing 10, the two opposite side surfaces 11 and 13 can touch.
  • an insulating device 130 or 130′ can be provided in the interior of the electronics housing 10 and is designed for this purpose to electrically insulate the thermally conductive device 40 at least in sections from the at least one heat source 30 .
  • the electronics housing 10 shown in FIG. 1 is shown in FIGS. 4a and 4b without a heat source 30, without a thermally conductive device 40 and without the mounting rail 20.
  • the side surface 11 and part of the side surface 13, the wall 12 and the insulation device 130 or 130' can be seen.
  • the insulation devices 130 and 130' can each have a plurality of sections 131, 132, 133, 134 or 134', 135, 136 and 137, preferably in the form of bands or strips, which preferably run transversely between the side surfaces 11 13 and the outer contour of the thermally conductive device 40 can follow such that the insulation device is able to position the inserted thermally conductive device 40 and/or to hold. Consequently, as shown by way of example in FIG.
  • the insulation device 130 can have a U-shaped contour, for example, corresponding to the thermally conductive device 40 shown by way of example in FIG.
  • the insulation device 130′ can have an E-shaped contour rotated by ⁇ 90° with respect to the longitudinal axis of the support rail 20, corresponding to the thermally conductive device 40 shown by way of example in FIG.
  • the insulation device 130 or 130′ can, for example, be molded onto one of the side walls 11, 13 or connected to one of the side walls in some other way.
  • the electronics housing 10 shown as an example in FIG. 1 can have a width of less than 10 mm and in particular a width of between 2.5 mm and 4 mm when closed.
  • the width of the base segment 50 can essentially correspond to the width of the electronics housing 10 .
  • the total length of the base segment 50 and the bearing surface 111, which runs parallel to the y-axis corresponds approximately to the width of the hat-shaped support rail 20. It should be noted that the width is measured parallel to the x-direction with respect to the coordinate system shown in Figure 3, while the length of the base segment is measured parallel to the y-axis.
  • thermally conductive device 40 can function as a protective earth connection or functional earth connection, for example by means of the bearing surface 111 or the mounting device 60 .
  • a plurality of heat dissipation elements 140 can be arranged on the base segment 50 and extend away from the interior of the electronics housing 10 in the direction of the mounting rail 20 . This is shown by way of example in FIG. 2 and FIG.
  • the heat dissipation elements 140 can be designed as lamellar projections which touch the mounting rail 20 between the sections 21 and 22 .
  • the thermally conductive device 40 can be in direct thermal contact with the at least one heat source 30 at least in sections. This can be achieved in that, for example, the bar-shaped segment 120 shown in FIG. 3 touches the heat source 30. However, the two web-shaped segments 100 and 110 can also extend as far as the at least one heat source 30 .
  • the mounting rail 20 and the electronics housing 10 that can be mounted on it can be viewed as a system that is provided, for example, for mounting in a switch cabinet. As already mentioned above, the electronics housing 10 can be a stackable terminal housing, so that a number of such electronics housings can be mounted in a row on the mounting rail 20 next to one another.
  • the electronics housing 10 is preferably a plastic housing.
  • an electronics housing 10 is created for mounting on a mounting rail 20, with the electronics housing 10 defining an interior space and having the following features: at least one heat source 30, which is arranged in the interior space of the electronics housing 10, at least one heat source 30, which is located at least in sections in the interior space of the electronics housing 10 arranged thermally conductive device 40, which is designed to dissipate heat from the interior of the electronics housing 10 and has a base segment 50, which when the electronics housing 10 is mounted on a mounting rail 20 extends transversely to the longitudinal axis of the mounting rail 20 and the mounting rail 20 on a first and second portion 21 and 22, which are opposite and each form a free end of the support rail 20 touches.
  • touch is intended in particular to also include the exemplary configurations in which the base segment touches the section 21 and/or 22 at a point or over an area.
  • the thermally conductive device 40 can be fastened to the electronics housing 10, with the electronics housing 10 being able to be embodied on the mounting rail with the aid of the thermally conductive device 40 for mounting--snapping or clamping.
  • the thermally conductive device 40 can have at least one mounting element 60 which is designed to the first section 21 of the Detect mounting rail 20 when the electronics housing 10 is mounted on the mounting rail 20.
  • the thermally conductive device 40 can have a base area 70 which adjoins the base segment 50 and encloses an angle therewith.
  • the electronics housing 10 can expediently have two opposite side walls 11 and 13 and a wall 12 that is circumferential at least in sections and connects the two side walls, with the two side walls 11 and 13 and the wall 12 defining the interior, and with the base area 70 of the thermally conductive device 40 on the inside of one of the two side walls 11 is preferably detachably fastened.
  • thermally conductive device 40 can have a first profiled, web-like segment 100, which runs transversely to base segment 50, adjoins an outer end of base segment 50, and extends at least in sections into the interior.
  • the at least one mounting element 60 can be formed on the first web-shaped, profiled segment 100 and can be designed, for example, as a pivoting lug.
  • the heat dissipation can be further increased if the thermally conductive device 40 can have a second profiled, web-shaped segment 110, which runs transversely to the base segment 50, adjoins another outer end of the base segment 50 and extends at least in sections into the interior, with the both outer ends of the base segment 50 opposite.
  • the second bar-shaped segment 110 can have a bearing surface 111 which, when the electronics housing 10 is mounted on the mounting rail 20, on the second section 22 of the mounting rail 20 applied. Heat dissipation can be increased even further if the thermally conductive device 40 can have at least a third profiled, bar-shaped segment 120, which is arranged between the first and second bar-shaped segments 100 and 110, runs transversely to the base segment 50 and extends at least in sections into the interior extends.
  • a multifunctional thermally conductive device 40 can be created, for example, in that the first and/or second and/or third web-shaped, profiled segment 100, 110, 120 has at least one support area, for example the legs 61, 112, 113, 121, 122 , which are each designed to absorb and/or pass on forces acting on the electronics housing 10 from the outside.
  • the at least one heat source 30 can preferably be a heat-generating electrical and/or electronic device, with an insulation device 130 arranged in the interior being provided, which is designed to electrically insulate the thermally conductive device 40 at least in sections from the at least one heat source 30.
  • the insulation device 130 can have sections 131-137, for example, which are at least partially designed to position and/or hold the thermally conductive device 40 in the housing 10.
  • thermally conductive device 40 is, for example, a stamped and bent part that can be made of metal.
  • the electronics housing 10 can preferably have a width of less than 10 mm and in particular a width between 2.5 mm and 4 mm, and/or the electronics housing 10 can be designed as a stackable terminal housing, and/or the base segment 50 of the thermally conductive device 40 can have a width have, which essentially corresponds to the width of the electronics housing 10, and / or the electronics housing 10 may be a plastic housing.
  • the thermally conductive device 40 can advantageously be in the form of a protective earth connection or a functional earth connection.
  • a plurality of heat dissipation elements 140 which extend away from the interior of the electronics housing 10 can advantageously be arranged on the base segment 50 .
  • the thermally conductive device 40 can be in direct thermal contact with the at least one heat source 30 .
  • a system which can include the following features: a support rail 20 with a longitudinal axis and two opposite sections 21 and 22 which extend along the longitudinal axis of the support rail 20 and each form a free end of the support rail 20, and an electronics housing 10 that can be mounted on the mounting rail 20 according to the exemplary description above.
  • the mounting rail 20 preferably has a hat profile, with the two opposing sections 21 and 22 each forming an edge region extending transversely to the longitudinal axis of the mounting rail 20, with the base segment 50 of the thermally conductive device 40 spanning the mounting rail 20 and the two opposite sections 21 and 22 touches.
  • the heat dissipation elements 130 arranged on the base segment 50 can expediently touch the mounting rail 20 in particular between the two opposite sections 21 and 22 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un boîtier électronique (10) destiné à être monté sur un rail de support (20), le boîtier électronique (10) formant un espace interne et comprenant les éléments suivants : au moins une source de chaleur (30) qui est disposée dans l'espace interne du boîtier électronique (10) ; et un élément thermoconducteur (40) qui est disposé au moins partiellement dans l'espace interne du boîtier électronique (10), est conçu pour évacuer la chaleur de l'espace interne du boîtier électronique (10) et comprend un segment de base (50) qui, à l'état monté du boîtier électronique (10) sur un rail de support (20), s'étend perpendiculairement à l'axe longitudinal du rail de support (20) et est en contact avec le rail de support (20) au niveau d'une première et d'une seconde section (21, 22) qui sont opposées l'une à l'autre et forment chacune une extrémité libre du rail de support (20).
EP22748003.5A 2021-08-06 2022-07-07 Boîtier électronique destiné à être monté sur un rail de support, et système Pending EP4381908A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021120493.3A DE102021120493A1 (de) 2021-08-06 2021-08-06 Elektronikgehäuse zur Montage an einer Tragschiene sowie ein System
PCT/EP2022/068905 WO2023011844A1 (fr) 2021-08-06 2022-07-07 Boîtier électronique destiné à être monté sur un rail de support, et système

Publications (1)

Publication Number Publication Date
EP4381908A1 true EP4381908A1 (fr) 2024-06-12

Family

ID=82742957

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22748003.5A Pending EP4381908A1 (fr) 2021-08-06 2022-07-07 Boîtier électronique destiné à être monté sur un rail de support, et système

Country Status (3)

Country Link
EP (1) EP4381908A1 (fr)
DE (1) DE102021120493A1 (fr)
WO (1) WO2023011844A1 (fr)

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