EP4374161A1 - Dispositif et procédé de caractérisation électrique de propriétés de matériaux, d'ensembles et/ou de composants dans un environnement à haute température - Google Patents

Dispositif et procédé de caractérisation électrique de propriétés de matériaux, d'ensembles et/ou de composants dans un environnement à haute température

Info

Publication number
EP4374161A1
EP4374161A1 EP22743485.9A EP22743485A EP4374161A1 EP 4374161 A1 EP4374161 A1 EP 4374161A1 EP 22743485 A EP22743485 A EP 22743485A EP 4374161 A1 EP4374161 A1 EP 4374161A1
Authority
EP
European Patent Office
Prior art keywords
temperature
waveguide
dut
components
sample holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22743485.9A
Other languages
German (de)
English (en)
Inventor
Thomas Windisch
Hagen Schmidt
Robert Weser
Uwe Biscop
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leibniz Institut fuer Festkorper und Werkstofforschung Dresden eV
Original Assignee
Leibniz Institut fuer Festkorper und Werkstofforschung Dresden eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leibniz Institut fuer Festkorper und Werkstofforschung Dresden eV filed Critical Leibniz Institut fuer Festkorper und Werkstofforschung Dresden eV
Publication of EP4374161A1 publication Critical patent/EP4374161A1/fr
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N22/00—Investigating or analysing materials by the use of microwaves or radio waves, i.e. electromagnetic waves with a wavelength of one millimetre or more
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references

Definitions

  • the invention relates to a device and method for electrically characterizing properties of materials, assemblies and/or components in a high-temperature environment, for example for characterizing electromechanical SAW components (SAW - surface waves) with regard to their function under the influence of temperature.
  • SAW - surface waves electromechanical SAW components
  • the device is specially designed for use in high temperature environments, for example for use in heating devices with temperatures up to 1800°C under vacuum or gas impingement. It allows the electrical characterization of the properties of materials, assemblies and/or components that are to be tested with direct current or in the low-frequency or high-frequency range.
  • the device and the method can be used, for example, to determine the aging of materials and assemblies under the influence of temperature and/or under specific environmental conditions.
  • a structural component based on a ceramic body that is largely stable at temperatures above 800° C. is known from EP 2 145501 B1, the structural component being in contact with a hot melt or a material to be burned during use.
  • At least one SAW sensor is integrated within the structural component, with which at least one of the following information can be recorded and transmitted to a data processing system during operation of the structural component: identification of the structural component, physical properties of the structural component, movements of the structural component, time of operation of the structural component, Location of the structural component, wherein the SAW sensor is designed with an antenna for wireless reception and wireless transmission of radio signals.
  • SAW chips surface wave chips
  • a ceramic chip carrier is used in this device. On the chip carrier there are contact surfaces glued with ceramic adhesive. The SAW chips are attached and contacted on the contact surfaces by means of directly soldered platinum bonding wires.
  • HF lines for the electrical measurement signals are also clamped to the contact surfaces by means of a clamping mechanism.
  • the HF lines are custom-made and have a steel jacket containing a dielectric made of Si0 2 powder.
  • the HF lines are routed through a flange using vacuum-tight SMA bushings in order to route the electrical measurement signals outside the oven for evaluation, in which the SAW chips are tested at high temperatures.
  • a disadvantage of this known solution is that the SAW chips are irreversibly connected to the glued-on contact surfaces via the bonding wires. This makes changing SAW chips difficult and time-consuming in this device.
  • the Si0 2 powder contained in the HF lines as a dielectric is also disadvantageous.
  • the gas-filled space between the powder particles shows significant disadvantages due to the slow out-diffusion of gas molecules under vacuum. Significant additional time is required until the powder is completely evacuated, which prevents rapid changes in the test atmosphere. There is also the danger that new gas cavities will open in an uncontrolled manner and this will contaminate the vacuum again. In addition, there are problems in handling with regard to the powder escaping unintentionally.
  • Spring elements and in particular the elongate waveguide Because of that length, eg 50 cm, there are considerable length differences, eg 3 mm at 1000 °C temperature difference between installation and test temperature.
  • the connection points, which represent the electrical as well as the mechanical contact at the same time, must be stable enough to withstand the considerable mechanical stresses and forces alone with a non-positive or positive fit.
  • the object of the invention is to develop a device for the electrical characterization of properties of materials, assemblies and/or components under the influence of temperature, which ensures fail-safe positioning of the measurement object even at very high temperatures, also enables quick and easy changing of the measurement objects and a reliable Characterization guaranteed under constant atmospheric conditions. Included in this task is the development of a method for the advantageous use of the device according to the invention.
  • a device for the electrical characterization of properties of test objects in the form of substances, assemblies and/or components (DUT) in a high-temperature environment under vacuum or gas pressure containing a sample holder, which has at least one carrier element for the reversible arrangement and wireless fixation of at least one DUT, the sample holder having means for galvanic or capacitive coupling and/or decoupling of electrical signals into and/or out of the DUTs, at least one high-temperature waveguide and at least one low-temperature waveguide for supplying and/or dissipating HF signals, Operating voltages and/or electrical control signals to or from the DUTs to be characterized, with at least the high-temperature waveguide or high-temperature waveguides used to supply and/or derive HF signals being designed as coaxial conductors with solid dielectric elements made of electrically non-conductive ceramics are, at least one coupling component for electrically connecting and / or fixing the high-temperature waveguide with the low-temperature wave
  • At least some or all of the components of the device are of modular design and are detachably connected to one another.
  • the sample holder, the coupling component and/or the heat shields consist of high-melting metallic materials such as molybdenum, tungsten, tantalum, platinum, iridium or their alloys and/or of zirconium, silicate or aluminum oxide ceramics.
  • the high-temperature waveguide is also advantageously a coaxial conductor with inner and outer conductors made of high-melting metallic materials such as molybdenum, tungsten, tantalum, platinum, iridium or their alloys and with solid dielectric elements made of electrically non-conductive zirconium, silicate or aluminum oxide ceramics.
  • the inner and outer conductor materials and/or the dielectric of the high-temperature waveguide can be exchanged.
  • sample holder and/or the carrier element and/or the DUT have means for antenna-based signal transmission.
  • the temperature sensor is advantageously arranged at a maximum distance of 5 mm from the DUT.
  • the non-positive and/or positive connections in the specimen holder are at least partially implemented by means of sliding blocks.
  • the means for galvanic or capacitive coupling and/or decoupling of electrical signals is at least one exchangeable conducting element, which is at least electrically connected to the inner and/or outer conductor of the high-temperature waveguide.
  • DUT specified using a device according to the preceding claims, wherein the device in a heating device in an environment with is operated at high temperature under vacuum or gas pressure, the sample temperature being measured before and/or during and/or after operation and the measured values being included in the electrical characterization of the DUT and being used to control the heating device and/or a calibration.
  • a high-frequency calibration of the device in particular a TOSM (Through - Open - Short - Match) calibration, is carried out once or several times before or during operation, the high-frequency calibration being carried out up to and including the connection of the high-temperature waveguide to the coupling component , and a separate compensation calibration is performed for the remaining components of the device and the DUT.
  • TOSM Gate - Open - Short - Match
  • a calibration standard is used in its place.
  • test objects in the form of substances, assemblies and/or components are to be understood and named as DUT (Device UnderTest) which are picked up by a carrier element of a sample holder, arranged in it and fixed wirelessly.
  • DUT Device UnderTest
  • the reversible arrangement and wireless fixing of at least one DUT has the technical advantage that the DUTs can be arranged in the carrier element in a cost- and time-saving manner without soldering, bonding or gluing and can be removed again in a reversible manner.
  • the sample holder has means for galvanic or capacitive coupling and/or decoupling of electrical signals into and/or out of the DUT, with which simple and fast communication, testing and characterization can be carried out.
  • the proposed new device also has at least one high-temperature waveguide and at least one low-temperature waveguide for supplying and/or dissipating HF signals, operating voltages and/or electrical control signals to or from the DUTs to be characterized, with at least the one or or derivation of HF signals serving high-temperature waveguide (s) are designed as coaxial conductors with solid dielectric elements made of electrically non-conductive ceramic.
  • a solid dielectric element made of electrically non-conductive ceramic is to be understood as a spacer required for coaxial conductors, in which, in contrast to known ceramic powders, a highly compressed ceramic is understood that produces no or only extremely low outgassing under the influence of high temperatures.
  • the solid dielectric element is temperature-stable and suitable for vacuum and therefore has an extremely small proportion of open or opening gas cavities.
  • the dielectric is advantageously made of zirconium or aluminum oxide ceramic, for example.
  • the massive dielectric elements proposed according to the invention have the significant advantage that a rapid change of atmosphere within the sample holder can be realized due to the fact that undesired gases do not escape from the dielectric element under the influence of high temperature. This avoids prolonged thermal stress on the DUT and the sample holder, which in particular leads to more accurate measurement results and an improved service life of the device.
  • the inner conductor and the solid dielectric of the high-temperature waveguide are used several times, while the outer conductor is varied depending on the operating temperature.
  • the coaxial high-temperature waveguide can be flexibly adapted to the required area of application, which also saves costs.
  • Further components of the device according to the invention are at least one coupling component for electrically connecting the high-temperature waveguide to the low-temperature waveguide and at least one heat shield for thermally shielding temperature-sensitive components of the device, which is arranged between the sample holder and the coupling component.
  • the device has at least one temperature sensor arranged in the carrier element and a flange part for fastening the device in a heating device.
  • the at least one coupling component fulfills the task of electrically connecting the high-temperature waveguide and the low-temperature waveguide with low-loss signal transmission, mechanically stable and safe, and easily detachable. Both lines are designed as coaxial conductors, consisting of an outer conductor, dielectric and inner conductor.
  • At least some or even all of the components of the device are of modular design and are detachably connected to one another, as a result of which the area of use is significantly expanded and flexibility is increased.
  • sample holder and/or the carrier element and/or the DUT advantageously have means for antenna-based signal transmission.
  • this provides fast, secure and wireless transmission of measurement and control signals and reduces costs for the otherwise necessary provision of further coaxial high-temperature and low-temperature waveguides saved.
  • Such a means can, for example, be at least one exchangeable guide element which is at least partially electrically connected to the inner and/or outer conductor of the high-temperature waveguide.
  • the electrical connection can be designed in such a way that at least one exchangeable conducting element at least partially overlaps and/or borders on the inner and/or outer conductor of the high-temperature waveguide and at least partially overlaps and/or borders on the DUT and is connected by means of galvanic and/or or capacitive coupling creates an electrical connection. This allows soldering or bonding processes to be partially or completely dispensed with and leads to time and cost savings.
  • an advantageous embodiment of the device can provide for the temperature sensor to be arranged at a maximum distance of 5 mm from the DUT.
  • the device according to the invention is used in a method for electrically characterizing properties of test objects in the form of materials, assemblies and/or components (DUT).
  • the device is operated in a heating device in a high-temperature environment under vacuum or gas pressure, the sample temperature being measured before and/or during and/or after operation and the measured values being converted into electrical Characterization of the DUT are included and used to control the heater and / or a calibration.
  • a high-frequency calibration of the device is carried out before and/or during operation.
  • a TOSM (Through-Open-Short-Match) calibration can be carried out once or multiple times, with the high-frequency calibration being carried out up to and including the connection of the high-temperature waveguide to the coupling component.
  • a separate compensation calibration is performed for the remaining components of the device and the DUT.
  • a calibration standard is used instead of the DUT in order to improve the functioning of the device and the measurement results when calibrating the device before or after the measurement.
  • a device for the electrical characterization of a DUT specifically an SAW component, is provided, which is designed as a measuring probe.
  • the measuring probe is introduced into the wall of a heating device through a mounting cap and connected to the wall of the heating device in a gas-tight manner by means of a flange part.
  • a sample holder made of tantalum has a temperature sensor, high-temperature and Low-temperature waveguide, a heat shield and a coupling component. Within the coupling component, high-temperature and low-temperature waveguides are connected electrically, with low losses and mechanically stable and detachable via a mechanical clamping device.
  • the high-temperature and low-temperature waveguides are designed as coaxial conductors, consisting of an outer conductor, dielectric and inner conductor.
  • the outer and inner conductors of the high-temperature waveguide and low-temperature waveguide are made of tungsten.
  • the high-temperature waveguide has a length of 50 cm, the low-temperature waveguide has a length of 25 cm.
  • the dielectric is also temperature-stable and is made of solid aluminum oxide ceramic.
  • the coupling component consists of a mount for the outer conductor of the high-temperature waveguide, a mount for the coupling point of the inner conductor and a mount for the outer conductor of the low-temperature waveguide.
  • the receptacles enable the inner and outer conductors to be fixed in a force-fitting and form-fitting manner and the inner and outer conductors of the high-temperature and low-temperature waveguides to be electrically connected at the same time.
  • the sample holder contains a base body and a closure part, the closure part being connected to the base body in a form-fitting manner via a joint.
  • the SAW component and the conductors of the high-temperature waveguide are positively contacted and electrically connected with guide elements using spring and stamp elements.
  • a modular support element positions and insulates the SAW component and the conducting elements.
  • the spring elements are positioned using positive and non-positive connections. All connections consist of fail-safe threaded pins, which are frictionally connected to sliding blocks.
  • the SAW component is electrically contacted by conductive surfaces in the overlaps with the conductive elements in the form of galvanic coupling.

Landscapes

  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

L'invention concerne un dispositif et un procédé de caractérisation électrique de propriétés de matériaux, d'ensembles et/ou de composants dans un environnement à haute température, par exemple pour caractériser la fonction de composants électromécaniques à ondes acoustiques superficielles (SAW) sous l'effet de la température. L'invention vise à développer un dispositif permettant un positionnement à l'épreuve des défaillances d'un objet de mesure, un changement rapide et simple de l'objet de mesure et une caractérisation fiable à hautes températures. À cet effet, l'invention concerne un dispositif contenant : un porte-échantillon doté de moyens de couplage et/ou de découplage galvanique ou capacitif de signaux électriques ; au moins un élément de soutien ; au moins un guide d'ondes à hautes températures et au moins un guide d'ondes à basses températures, au moins un ou des guides d'ondes à hautes températures étant réalisés sous forme de conducteur coaxial à éléments diélectriques solides faits de céramique électriquement non conductrice ; au moins un élément de couplage ; au moins un écran thermique ; au moins un capteur de température, disposé dans l'élément de soutien ; et au moins une partie bride.
EP22743485.9A 2021-07-20 2022-07-11 Dispositif et procédé de caractérisation électrique de propriétés de matériaux, d'ensembles et/ou de composants dans un environnement à haute température Pending EP4374161A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021118719.2A DE102021118719B3 (de) 2021-07-20 2021-07-20 Vorrichtung und verfahren zur elektrischen charakterisierung von eigenschaften von stoffen, baugruppen und/oder bauteilen in einer umgebung mit hoher temperatur
PCT/EP2022/069228 WO2023001608A1 (fr) 2021-07-20 2022-07-11 Dispositif et procédé de caractérisation électrique de propriétés de matériaux, d'ensembles et/ou de composants dans un environnement à haute température

Publications (1)

Publication Number Publication Date
EP4374161A1 true EP4374161A1 (fr) 2024-05-29

Family

ID=82402628

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22743485.9A Pending EP4374161A1 (fr) 2021-07-20 2022-07-11 Dispositif et procédé de caractérisation électrique de propriétés de matériaux, d'ensembles et/ou de composants dans un environnement à haute température

Country Status (3)

Country Link
EP (1) EP4374161A1 (fr)
DE (1) DE102021118719B3 (fr)
WO (1) WO2023001608A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0961292A1 (fr) * 1998-05-26 1999-12-01 Sck.Cen Sonde, électrode de mesure ou de référence, palpeur ou passage pour un environnment à rayonnement intense et méthode de sa fabrication
DE102007021172B4 (de) 2007-05-05 2010-11-18 Refractory Intellectual Property Gmbh & Co. Kg Verwendung eines Sensors
EP2296219B1 (fr) 2009-09-04 2011-08-24 Refractory Intellectual Property GmbH & Co. KG Utilisation d'un guide d'ondes
JP6644683B2 (ja) * 2013-11-07 2020-02-12 フィルター・センシング・テクノロジーズ・インコーポレイテッドＦｉｌｔｅｒ Ｓｅｎｓｉｎｇ Ｔｅｃｈｎｏｌｏｇｉｅｓ，Ｉｎｃ． 高度無線周波数センシングプローブ
US10476142B2 (en) * 2016-12-21 2019-11-12 Cts Corporation Radio frequency antenna with granular or powder insulating material and method of making the same
GB2583361A (en) * 2019-04-25 2020-10-28 Rosemount Measurement Ltd Microwave-based method and apparatus for monitoring a process variable
CN212207518U (zh) 2020-03-27 2020-12-22 山东国瓷功能材料股份有限公司 粉末样品介电性能测试装置

Also Published As

Publication number Publication date
DE102021118719B3 (de) 2022-08-04
WO2023001608A1 (fr) 2023-01-26

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