EP4317536A4 - Matériau plaqué argent et son procédé de fabrication - Google Patents

Matériau plaqué argent et son procédé de fabrication

Info

Publication number
EP4317536A4
EP4317536A4 EP22832665.8A EP22832665A EP4317536A4 EP 4317536 A4 EP4317536 A4 EP 4317536A4 EP 22832665 A EP22832665 A EP 22832665A EP 4317536 A4 EP4317536 A4 EP 4317536A4
Authority
EP
European Patent Office
Prior art keywords
silver
manufacturing same
plated material
plated
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP22832665.8A
Other languages
German (de)
English (en)
Other versions
EP4317536A1 (fr
EP4317536B1 (fr
Inventor
Yutaro HIRAI
Kentaro Arai
Yosuke Sato
Eri FUNADA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Metaltech Co Ltd
Original Assignee
Dowa Metaltech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Metaltech Co Ltd filed Critical Dowa Metaltech Co Ltd
Publication of EP4317536A1 publication Critical patent/EP4317536A1/fr
Publication of EP4317536A4 publication Critical patent/EP4317536A4/fr
Application granted granted Critical
Publication of EP4317536B1 publication Critical patent/EP4317536B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
EP22832665.8A 2021-06-29 2022-05-27 Matériau plaqué argent et son procédé de fabrication Active EP4317536B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021107489A JP7749358B2 (ja) 2021-06-29 2021-06-29 銀めっき材およびその製造方法
PCT/JP2022/021697 WO2023276507A1 (fr) 2021-06-29 2022-05-27 Matériau plaqué argent et son procédé de fabrication

Publications (3)

Publication Number Publication Date
EP4317536A1 EP4317536A1 (fr) 2024-02-07
EP4317536A4 true EP4317536A4 (fr) 2025-04-23
EP4317536B1 EP4317536B1 (fr) 2026-02-25

Family

ID=84691269

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22832665.8A Active EP4317536B1 (fr) 2021-06-29 2022-05-27 Matériau plaqué argent et son procédé de fabrication

Country Status (6)

Country Link
US (1) US20240287697A1 (fr)
EP (1) EP4317536B1 (fr)
JP (1) JP7749358B2 (fr)
CN (1) CN117529581A (fr)
MX (1) MX2023015085A (fr)
WO (1) WO2023276507A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117512725B (zh) * 2023-11-07 2024-06-25 东莞市贝沃金属有限公司 用于大电流保险管的锡锌线镀银工艺

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2429970A (en) * 1944-01-11 1947-10-28 Du Pont Silver plating

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4247372A (en) * 1978-08-29 1981-01-27 Learonal, Inc. Silver plating
JPS5743995A (en) * 1980-08-27 1982-03-12 Sumitomo Electric Ind Ltd Silver plating liquid and silver plating method
US7402232B2 (en) * 2002-11-28 2008-07-22 Shinko Electric Industries, Co., Ltd. Silver electroplating solution
JP2009079250A (ja) 2007-09-26 2009-04-16 Dowa Metaltech Kk 最表層として銀合金層が形成された銅または銅合金部材およびその製造方法
EP2431501B1 (fr) * 2010-09-21 2013-11-20 Rohm and Haas Electronic Materials LLC Procédé de dépôt électrique d'argent sur du nickel
US8980077B2 (en) * 2012-03-30 2015-03-17 Rohm And Haas Electronic Materials Llc Plating bath and method
WO2016121312A1 (fr) * 2015-01-30 2016-08-04 Ｄｏｗａメタルテック株式会社 Élément plaqué d'argent et procédé pour la fabrication de ce dernier
US12297556B2 (en) * 2020-02-25 2025-05-13 Dowa Metaltech Co., Ltd. Silver-plated product and method for producing same
JP6916971B1 (ja) * 2020-09-15 2021-08-11 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2429970A (en) * 1944-01-11 1947-10-28 Du Pont Silver plating

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
AUGUSTIN ARUN ET AL: "Effect of current density during electrodeposition on microstructure and hardness of textured Cu coating in the application of antimicrobial Al touch surface", JOURNAL OF THE MECHANICAL BEHAVIOR OF BIOMEDICAL MATERIALS, ELSEVIER, AMSTERDAM, NL, vol. 63, 15 July 2016 (2016-07-15), pages 352 - 360, XP029680237, ISSN: 1751-6161, DOI: 10.1016/J.JMBBM.2016.07.013 *
See also references of WO2023276507A1 *

Also Published As

Publication number Publication date
MX2023015085A (es) 2024-01-18
JP7749358B2 (ja) 2025-10-06
US20240287697A1 (en) 2024-08-29
CN117529581A (zh) 2024-02-06
JP2023005513A (ja) 2023-01-18
EP4317536A1 (fr) 2024-02-07
EP4317536B1 (fr) 2026-02-25
WO2023276507A1 (fr) 2023-01-05

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