EP4273522A3 - Wafer - Google Patents

Wafer Download PDF

Info

Publication number
EP4273522A3
EP4273522A3 EP23196523.7A EP23196523A EP4273522A3 EP 4273522 A3 EP4273522 A3 EP 4273522A3 EP 23196523 A EP23196523 A EP 23196523A EP 4273522 A3 EP4273522 A3 EP 4273522A3
Authority
EP
European Patent Office
Prior art keywords
mirror
filter portions
portions
mirror portion
dummy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23196523.7A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP4273522A2 (en
Inventor
Toshimitsu Kawai
Katsumi Shibayama
Takashi Kasahara
Masaki Hirose
Hiroki Oyama
Yumi KURAMOTO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Publication of EP4273522A2 publication Critical patent/EP4273522A2/en
Publication of EP4273522A3 publication Critical patent/EP4273522A3/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/02—Details
    • G01J3/0202—Mechanical elements; Supports for optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/12—Generating the spectrum; Monochromators
    • G01J3/26—Generating the spectrum; Monochromators using multiple reflection, e.g. Fabry-Perot interferometer, variable interference filters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/28—Interference filters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/12—Generating the spectrum; Monochromators
    • G01J2003/1213—Filters in general, e.g. dichroic, band

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Optical Filters (AREA)
  • Micromachines (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
EP23196523.7A 2017-11-24 2018-11-09 Wafer Pending EP4273522A3 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017226085A JP6526771B1 (ja) 2017-11-24 2017-11-24 ウェハ
EP18880788.7A EP3715932B1 (en) 2017-11-24 2018-11-09 Wafer
PCT/JP2018/041732 WO2019102878A1 (ja) 2017-11-24 2018-11-09 ウェハ

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
EP18880788.7A Division-Into EP3715932B1 (en) 2017-11-24 2018-11-09 Wafer
EP18880788.7A Division EP3715932B1 (en) 2017-11-24 2018-11-09 Wafer

Publications (2)

Publication Number Publication Date
EP4273522A2 EP4273522A2 (en) 2023-11-08
EP4273522A3 true EP4273522A3 (en) 2024-01-31

Family

ID=66630923

Family Applications (2)

Application Number Title Priority Date Filing Date
EP18880788.7A Active EP3715932B1 (en) 2017-11-24 2018-11-09 Wafer
EP23196523.7A Pending EP4273522A3 (en) 2017-11-24 2018-11-09 Wafer

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP18880788.7A Active EP3715932B1 (en) 2017-11-24 2018-11-09 Wafer

Country Status (8)

Country Link
US (2) US11448869B2 (ko)
EP (2) EP3715932B1 (ko)
JP (1) JP6526771B1 (ko)
KR (2) KR102618341B1 (ko)
CN (2) CN111465884B (ko)
FI (1) FI3715932T3 (ko)
TW (2) TWI825876B (ko)
WO (1) WO2019102878A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111880257B (zh) * 2020-09-28 2021-05-07 深圳市海谱纳米光学科技有限公司 一种可调光学滤波器件

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040014300A1 (en) * 2002-07-18 2004-01-22 Fujitsu Limited Method of making device chips collectively from common material substrate
EP1544161A1 (en) * 2002-08-01 2005-06-22 Nikon Corporation Three-dimensional structure element and method of manufacturing the element, optical switch, and micro device
US20060066856A1 (en) * 2004-09-27 2006-03-30 William Cummings Systems and methods for measuring color and contrast in specular reflective devices
JP2009147108A (ja) * 2007-12-14 2009-07-02 Denso Corp 半導体チップ及びその製造方法
EP3018521A1 (en) * 2013-07-02 2016-05-11 Hamamatsu Photonics K.K. Fabry-perot interference filter

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5784507A (en) * 1991-04-05 1998-07-21 Holm-Kennedy; James W. Integrated optical wavelength discrimination devices and methods for fabricating same
JP2003131024A (ja) 2001-10-24 2003-05-08 Seiko Epson Corp カラーフィルタ基板及びその製造方法、液晶表示パネル、液晶表示装置、並びに電子機器
US6691697B2 (en) * 2002-05-03 2004-02-17 Hon Hai Precision Ind. Co., Ltd. Method for cutting thin film filter work pieces
FI20095976A0 (fi) 2009-09-24 2009-09-24 Valtion Teknillinen Mikromekaanisesti säädettävä Fabry-Perot -interferometri ja menetelmä sen tuottamiseksi
JP2012209635A (ja) 2011-03-29 2012-10-25 Seiko Instruments Inc 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計
JP6260080B2 (ja) 2013-01-07 2018-01-17 セイコーエプソン株式会社 波長可変干渉フィルター、波長可変干渉フィルターの製造方法、光学モジュール、及び電子機器
JP2014182170A (ja) 2013-03-18 2014-09-29 Seiko Epson Corp 封止構造、干渉フィルター、光学モジュール、及び電子機器
JP6356427B2 (ja) 2014-02-13 2018-07-11 浜松ホトニクス株式会社 ファブリペロー干渉フィルタ
JP6292055B2 (ja) 2014-06-26 2018-03-14 株式会社デンソー ファブリペロー干渉計の製造方法
JP2016099583A (ja) * 2014-11-26 2016-05-30 セイコーエプソン株式会社 干渉フィルター、光学モジュール、電子機器および構造体の製造方法
JP6671860B2 (ja) 2015-04-28 2020-03-25 浜松ホトニクス株式会社 光検出装置
WO2016176735A1 (en) 2015-05-05 2016-11-10 University Of Western Australia Microelectromechanical systems (mems) and methods
JP2017181814A (ja) * 2016-03-30 2017-10-05 シャープ株式会社 表示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040014300A1 (en) * 2002-07-18 2004-01-22 Fujitsu Limited Method of making device chips collectively from common material substrate
EP1544161A1 (en) * 2002-08-01 2005-06-22 Nikon Corporation Three-dimensional structure element and method of manufacturing the element, optical switch, and micro device
US20060066856A1 (en) * 2004-09-27 2006-03-30 William Cummings Systems and methods for measuring color and contrast in specular reflective devices
JP2009147108A (ja) * 2007-12-14 2009-07-02 Denso Corp 半導体チップ及びその製造方法
EP3018521A1 (en) * 2013-07-02 2016-05-11 Hamamatsu Photonics K.K. Fabry-perot interference filter

Also Published As

Publication number Publication date
KR102618341B1 (ko) 2023-12-28
TW202246840A (zh) 2022-12-01
US20200310105A1 (en) 2020-10-01
FI3715932T3 (fi) 2024-01-30
WO2019102878A1 (ja) 2019-05-31
TWI769343B (zh) 2022-07-01
EP3715932B1 (en) 2023-11-22
KR20200090796A (ko) 2020-07-29
KR20240006076A (ko) 2024-01-12
US20220350131A1 (en) 2022-11-03
TW201935075A (zh) 2019-09-01
CN115291384A (zh) 2022-11-04
CN111465884A (zh) 2020-07-28
TWI825876B (zh) 2023-12-11
EP3715932A4 (en) 2021-08-18
US11609420B2 (en) 2023-03-21
EP4273522A2 (en) 2023-11-08
US11448869B2 (en) 2022-09-20
CN111465884B (zh) 2022-09-30
EP3715932A1 (en) 2020-09-30
JP2019095666A (ja) 2019-06-20
JP6526771B1 (ja) 2019-06-05

Similar Documents

Publication Publication Date Title
EP3644369A3 (en) Display apparatus and mask for manufacturing the same
EP3893278A4 (en) MATRIX SUBSTRATE AND METHOD FOR MAKING IT, AND DISPLAY DEVICE
EP4045972A4 (en) ELECTROCHROMIC DEVICES, METHOD FOR THE PRODUCTION AND OPERATION THEREOF
EP2768020A3 (en) Semiconductor devices and methods of fabricating the same
WO2015126575A8 (en) Silicon carbide semiconductor device, and methods for manufacturing thereof
WO2016192569A3 (en) Low emissivity glass, method for manufacturing the same and vehicle window
EP4057263A4 (en) MATRIX SUBSTRATE, METHOD FOR MAKING IT AND DISPLAY DEVICE
EP3276405A3 (en) Display apparatus and method of manufacturing the same
TWI799628B (zh) 遮罩佈局, 半導體裝置及使用遮罩佈局的製造方法
EP4024597A4 (en) SEPARATOR COMPRISING A FIRE-RETARDANT LAYER, AND METHOD OF MANUFACTURING IT
EP3971954A4 (en) SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF
EP3690943A4 (en) NETWORK SUBSTRATE AND ITS MANUFACTURING PROCESS
EP4006002A4 (en) BONDED SUBSTRATE AND METHOD FOR PRODUCING A BONDED SUBSTRATE
WO2019054718A3 (ko) 프레임 일체형 마스크의 제조 방법
EP3588563A4 (en) NETWORK SUBSTRATE AND ITS MANUFACTURING PROCESS
EP4273522A3 (en) Wafer
SG11201901227PA (en) Component for fabricating sic semiconductor, having plurality of layers having different transmittances, and method for manufacturing the same
EP3584838A4 (en) NETWORK SUBSTRATE, AND ASSOCIATED MANUFACTURING PROCESS
FI20175037A (fi) Säteilyikkuna
EP3989263A4 (en) Method for manufacturing composite substrate, and composite substrate
EP3968371A4 (en) SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF
EP3933895A4 (en) STRUCTURE OF TRENCHED FIELD EFFECT TRANSISTOR AND METHOD OF FABRICATION THEREOF
EP4030517A4 (en) ELECTRODE ASSEMBLY, DEVICE AND METHOD OF MANUFACTURING IT
EP3990680A4 (en) SUBSTRATE REAR FACE PROTECTION
EP4044212A4 (en) SEMICONDUCTOR SUBSTRATE, METHOD OF MANUFACTURE THEREOF AND SEMICONDUCTOR DEVICE

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20230911

AC Divisional application: reference to earlier application

Ref document number: 3715932

Country of ref document: EP

Kind code of ref document: P

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Free format text: PREVIOUS MAIN CLASS: G01J0003020000

Ipc: G02B0026000000

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

RIC1 Information provided on ipc code assigned before grant

Ipc: G01J 3/12 20060101ALN20231222BHEP

Ipc: G01J 3/02 20060101ALI20231222BHEP

Ipc: G01J 3/26 20060101ALI20231222BHEP

Ipc: G02B 5/28 20060101ALI20231222BHEP

Ipc: B81B 3/00 20060101ALI20231222BHEP

Ipc: G02B 26/00 20060101AFI20231222BHEP