SG11201901227PA - Component for fabricating sic semiconductor, having plurality of layers having different transmittances, and method for manufacturing the same - Google Patents
Component for fabricating sic semiconductor, having plurality of layers having different transmittances, and method for manufacturing the sameInfo
- Publication number
- SG11201901227PA SG11201901227PA SG11201901227PA SG11201901227PA SG11201901227PA SG 11201901227P A SG11201901227P A SG 11201901227PA SG 11201901227P A SG11201901227P A SG 11201901227PA SG 11201901227P A SG11201901227P A SG 11201901227PA SG 11201901227P A SG11201901227P A SG 11201901227PA
- Authority
- SG
- Singapore
- Prior art keywords
- component
- layers
- sic semiconductor
- manufacturing
- same
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000002834 transmittance Methods 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/32—Carbides
- C23C16/325—Silicon carbide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02378—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02441—Group 14 semiconducting materials
- H01L21/02447—Silicon carbide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02502—Layer structure consisting of two layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02529—Silicon carbide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/24—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Ceramic Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Drying Of Semiconductors (AREA)
- Woven Fabrics (AREA)
Abstract
COMPONENT FOR FABRICATING SIC SEMICONDUCTOR, HAVING PLURALITY OF LAYERS HAVING DIFFERENT TRANSMITTANCES, AND METHOD FOR MANUFACTURING THE SAME [] Provided according to an embodiment of the present invention is a component for fabricating an SiC semiconductor, having a plurality of layers having different transmittances, the component comprising two or more superposed layers, wherein each of the superposed layers contains SiC and has a transmittance value different from that of another adjacent layer. Fig. 6
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20160104727 | 2016-08-18 | ||
KR1020170104300A KR101914289B1 (en) | 2016-08-18 | 2017-08-17 | SiC PART FOR SEMICONDUCTOR MANUFACTORING COMPRISING DIFFERENT TRANSMITTANCE MULTILAYER AND METHOD OF MANUFACTURNING THE SAME |
PCT/KR2017/009001 WO2018034531A1 (en) | 2016-08-18 | 2017-08-18 | Component for fabricating sic semiconductor, having plurality of layers having different transmittances, and method for manufacturing same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201901227PA true SG11201901227PA (en) | 2019-03-28 |
Family
ID=61401375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201901227PA SG11201901227PA (en) | 2016-08-18 | 2017-08-18 | Component for fabricating sic semiconductor, having plurality of layers having different transmittances, and method for manufacturing the same |
Country Status (6)
Country | Link |
---|---|
US (1) | US20190206686A1 (en) |
JP (1) | JP6756907B2 (en) |
KR (5) | KR101914289B1 (en) |
CN (1) | CN109564933B (en) |
SG (1) | SG11201901227PA (en) |
TW (1) | TWI668862B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102305539B1 (en) * | 2019-04-16 | 2021-09-27 | 주식회사 티씨케이 | SiC EDGE RING |
KR102096787B1 (en) | 2019-06-11 | 2020-04-03 | 주식회사 바이테크 | Manufacturing method for multilayered polycrystalline silicon carbide parts |
KR102188258B1 (en) | 2020-04-27 | 2020-12-09 | 주식회사 바이테크 | Manufacturing method for single body and multi-layered polycrystalline silicon carbide parts, polycrystalline silicon carbide parts and shower head for plasma processing chambers |
KR102578550B1 (en) * | 2021-05-27 | 2023-09-15 | 주식회사 티씨케이 | Component of semiconductor manufacturing apparatus and preparing method of the same |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2668477B1 (en) * | 1990-10-26 | 1993-10-22 | Propulsion Ste Europeenne | REFRACTORY COMPOSITE MATERIAL PROTECTED AGAINST CORROSION, AND METHOD FOR THE PRODUCTION THEREOF. |
JPH0662541U (en) * | 1993-02-17 | 1994-09-02 | 日新電機株式会社 | A member for supporting an object to be processed in a plasma processing apparatus |
JP4531870B2 (en) * | 1997-10-14 | 2010-08-25 | 三井造船株式会社 | Multilayer silicon carbide wafer |
JP3773341B2 (en) * | 1997-10-31 | 2006-05-10 | 東海カーボン株式会社 | SiC coated carbon material |
JP4043003B2 (en) * | 1998-02-09 | 2008-02-06 | 東海カーボン株式会社 | SiC molded body and manufacturing method thereof |
JP3932154B2 (en) * | 1998-10-16 | 2007-06-20 | 東海カーボン株式会社 | SiC molded body and manufacturing method thereof |
JP2002073267A (en) * | 2000-08-31 | 2002-03-12 | Canon Inc | Coordinate input device |
US7291286B2 (en) * | 2004-12-23 | 2007-11-06 | Lam Research Corporation | Methods for removing black silicon and black silicon carbide from surfaces of silicon and silicon carbide electrodes for plasma processing apparatuses |
JP4769541B2 (en) * | 2005-10-27 | 2011-09-07 | トヨタ自動車株式会社 | Manufacturing method of semiconductor material |
ITTO20070099A1 (en) * | 2007-02-09 | 2008-08-10 | St Microelectronics Srl | PROCEDURE FOR THE REALIZATION OF AN INTERFACE BETWEEN SILICON CARBIDE AND SILICON OXIDE WITH LOW DENSITY OF STATES |
JP5595795B2 (en) * | 2009-06-12 | 2014-09-24 | 東京エレクトロン株式会社 | Method for reusing consumable parts for plasma processing equipment |
CN105609509A (en) * | 2009-12-04 | 2016-05-25 | 株式会社半导体能源研究所 | Display device |
JP2012049220A (en) * | 2010-08-25 | 2012-03-08 | Mitsui Eng & Shipbuild Co Ltd | Plasma resistant member and method for recycling the same |
JP5961357B2 (en) * | 2011-09-09 | 2016-08-02 | 昭和電工株式会社 | SiC epitaxial wafer and manufacturing method thereof |
CN104641453B (en) * | 2012-10-12 | 2018-03-30 | 住友电气工业株式会社 | Group III nitride composite substrate and its manufacture method and the method for manufacturing Group III nitride semiconductor device |
JP2014154666A (en) * | 2013-02-07 | 2014-08-25 | Sumitomo Electric Ind Ltd | Silicon carbide semiconductor substrate manufacturing method and silicon carbide semiconductor device manufacturing method |
US9711334B2 (en) * | 2013-07-19 | 2017-07-18 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based thin film coatings on process rings |
JP5604577B2 (en) * | 2013-10-01 | 2014-10-08 | 昭和電工株式会社 | SiC epitaxial wafer |
KR20150123078A (en) * | 2014-04-24 | 2015-11-03 | (주) 휘강지에이치티 | Method of manufacturing a focus ring |
US9362368B2 (en) * | 2014-10-31 | 2016-06-07 | Seiko Epson Corporation | Substrate with silicon carbide film, method for producing substrate with silicon carbide film, and semiconductor device |
KR102336686B1 (en) * | 2014-12-11 | 2021-12-08 | 삼성디스플레이 주식회사 | Vapor deposition apparatus and vapor deposition method using the same |
KR101631797B1 (en) * | 2015-04-13 | 2016-06-20 | 주식회사 티씨케이 | SiC structure for dry etching apparatus and manufacturing method the SiC structure |
JP6544166B2 (en) * | 2015-09-14 | 2019-07-17 | 信越化学工業株式会社 | Method of manufacturing SiC composite substrate |
KR101650342B1 (en) * | 2016-07-06 | 2016-08-23 | 부경대학교 산학협력단 | Functionally graded dual-nanoparticlate-reinforced aluminum matrix bulk materials and preparation method thereof |
-
2017
- 2017-08-17 KR KR1020170104300A patent/KR101914289B1/en active IP Right Review Request
- 2017-08-18 SG SG11201901227PA patent/SG11201901227PA/en unknown
- 2017-08-18 CN CN201780049906.4A patent/CN109564933B/en active Active
- 2017-08-18 JP JP2019511556A patent/JP6756907B2/en active Active
- 2017-08-18 US US16/325,877 patent/US20190206686A1/en active Pending
- 2017-08-18 TW TW106128098A patent/TWI668862B/en active
-
2018
- 2018-10-25 KR KR1020180128337A patent/KR102304519B1/en active IP Right Grant
-
2019
- 2019-10-21 KR KR1020190130432A patent/KR102208252B1/en active IP Right Review Request
- 2019-10-21 KR KR1020190130433A patent/KR102216867B1/en active IP Right Grant
-
2021
- 2021-09-14 KR KR1020210122697A patent/KR102595804B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20180119544A (en) | 2018-11-02 |
CN109564933A (en) | 2019-04-02 |
KR102216867B1 (en) | 2021-02-18 |
KR101914289B1 (en) | 2018-11-01 |
KR101914289B9 (en) | 2023-04-20 |
KR102208252B9 (en) | 2023-05-24 |
KR20190124177A (en) | 2019-11-04 |
KR20190124178A (en) | 2019-11-04 |
US20190206686A1 (en) | 2019-07-04 |
KR20180020912A (en) | 2018-02-28 |
KR20210118014A (en) | 2021-09-29 |
JP2019525495A (en) | 2019-09-05 |
KR102304519B1 (en) | 2021-09-27 |
TW201818544A (en) | 2018-05-16 |
CN109564933B (en) | 2020-12-25 |
TWI668862B (en) | 2019-08-11 |
KR102595804B1 (en) | 2023-10-31 |
KR102208252B1 (en) | 2021-01-28 |
JP6756907B2 (en) | 2020-09-16 |
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