EP4245461A1 - Electrodeposition grinding wheel and method for producing same - Google Patents

Electrodeposition grinding wheel and method for producing same Download PDF

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Publication number
EP4245461A1
EP4245461A1 EP21891421.6A EP21891421A EP4245461A1 EP 4245461 A1 EP4245461 A1 EP 4245461A1 EP 21891421 A EP21891421 A EP 21891421A EP 4245461 A1 EP4245461 A1 EP 4245461A1
Authority
EP
European Patent Office
Prior art keywords
abrasive grains
plating
plating layer
electrodeposition
grain size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP21891421.6A
Other languages
German (de)
English (en)
French (fr)
Inventor
Masaaki Tsuda
Jun Kishimoto
Takeshi Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Diamond Tools Mfg Co Ltd
Original Assignee
Tokyo Diamond Tools Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Diamond Tools Mfg Co Ltd filed Critical Tokyo Diamond Tools Mfg Co Ltd
Publication of EP4245461A1 publication Critical patent/EP4245461A1/en
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0027—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impregnation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents

Definitions

  • the present invention relates to an electrodeposition whetstone and a manufacturing method thereof.
  • Patent Documents 1 to 3 disclose electrodeposition whetstones.
  • abrasive grains with a larger average grain size and abrasive grains with a smaller average grain size are adhered by a plating layer.
  • An abrasive grain layer containing the abrasive grains with a smaller average grain size is disposed on an outer side of an abrasive grain layer containing the abrasive grains with a larger average grain size.
  • the larger-diameter superabrasive grains and the smaller-diameter superabrasive grains are adhered to the base by a metal plating layer that is a uniformly dispersed single layer.
  • larger-diameter superabrasive grains are supported by an electroless plating layer, and smaller-diameter superabrasive grains are uniformly dispersed in this electroless plating layer.
  • the present invention has been made to solve the above problems and to provide an electrodeposition whetstone having a longer life and a method of manufacturing the same.
  • an electrodeposition whetstone includes a plating layer, first abrasive grains protruding from the plating layer, and second abrasive grains which are arranged between the first abrasive grains.
  • the amount of protrusion of the second abrasive grains from the plating layer is smaller than the amount of protrusion of the first abrasive grains from the plating layer.
  • a grain size of the second abrasive grains is smaller than a grain size of the first abrasive grains.
  • FIG. 1 schematically shows a cross section of an electrodeposition whetstone according to this embodiment.
  • the electrodeposition whetstone 1 includes a base 2, a plating layer 3, first abrasive grains 4, and second abrasive grains 5, which differ from the first abrasive grains 4.
  • the base 2 is a base component (base metal) of the electrodeposition whetstone 1, which has conductivity.
  • the base 2 is formed, for example, of a material that contains a metal such as aluminum, iron, or stainless steel, or an alloy thereof.
  • the material of the base 2 is not limited as long as it has conductivity. It is assumed here that the base 2 of the embodiment is shaped into a disk or substantially into a disk.
  • a thickness direction (indicated by arrows D1 and D2) and an orthogonal direction intersecting (perpendicular or substantially perpendicular to) the thickness direction are defined.
  • the direction from the base 2 toward the plating layer 3 (indicated by arrow D1) is defined as outward, and the direction opposite to the outward direction (indicated by arrow D2) is defined as inward.
  • the shape of the base 2 can be suitably selected based on the use of the electrodeposition whetstone 1, the type of a grinding workpiece, and the like.
  • the plating layer 3 is arranged on the base 2.
  • the plating layer 3 includes the first abrasive grains 4 and the second abrasive grains 5.
  • the plating layer 3 holds the first abrasive grains 4 and the second abrasive grains 5.
  • the plating layer 3 may be formed of a nickel-containing material.
  • the thickness of the plating layer 3 is defined by the thickness extending from the outer surface (external surface) of the base 2 to the outer surface (external surface) of the plating layer 3.
  • the thickness of the plating layer 3 represents an average thickness of the plating layer 3.
  • the thickness of the plating layer 3 can be suitably determined based on the processing conditions such as the use of the electrodeposition whetstone 1 and the type of the grinding workpiece.
  • the thickness of the plating layer 3 is determined in such a manner that at least part of the first abrasive grains 4 and at least part of the second abrasive grains 5 both protrude (are exposed) from the outer surface of the plating layer 3.
  • the thickness of the plating layer 3 may be 40% or larger and 80% or smaller of the average abrasive grain size of the abrasive grains 4.
  • the plating layer 3 includes a first plating layer 31 and a second plating layer 32 different from the first plating layer 31.
  • the first plating layer 31 is provided on the base 2, and the second plating layer 32 is provided on the first plating layer 31.
  • the second plating layer 32 is stacked on the first plating layer 31.
  • the first plating layer 31 and the second plating layer 32 may contain nickel.
  • the second plating layer 32 may include particles having a friction coefficient lower than that of the second plating layer 32. The average particle size of these particles can be measured using a commonly used method. For instance, a laser diffraction particle size distribution analyzer may be used for the measurement.
  • such particles include at least one of polytetrafluoroethylene (PTFE), graphite fluoride, silicon carbide, boron carbide, and tungsten.
  • the particles may also contain nanodiamond particles. Consequently, the friction coefficient of the second plating layer 32 is lowered, which makes the second plating layer 32 resistive to wearing by grinding chips. As a result, the wear resistance of the electrodeposition whetstone 1 is improved. In addition, clogging of the electrodeposition whetstone 1, which tends to be caused by grinding chips, can be suppressed.
  • the second plating layer 32 preferably contains PTFE of an average particle size of 0.1 um or larger and 1 ⁇ m or smaller. With boron or tungsten contained in the second plating layer 32, the hardness (Vickers hardness (Hv)) of the second plating layer 32 increases.
  • the first abrasive grains 4 and the second abrasive grains 5 can be suitably selected depending on the grinding workpiece and the use of the electrodeposition whetstone 1.
  • the first abrasive grains 4 and the second abrasive grains 5 are at least one selected from silicon carbide-based abrasive grains, alumina-based abrasive grains, metal oxide abrasive grains, and superabrasive grains.
  • the metal oxide abrasive grains may be zirconium oxide.
  • the superabrasive grains may be diamond abrasive grains and cubic boron nitride (CBN) abrasive grains.
  • Combinations of the first abrasive grains 4 and the second abrasive grains 5 may be: diamond abrasive grains and diamond abrasive grains; CBN abrasive grains and CBN abrasive grains; diamond abrasive grains and metal oxide abrasive grains; CBN abrasive grains and metal oxide abrasive grains; or CBN abrasive grains and diamond abrasive grains. It is preferable that the first abrasive grains 4 be CBN abrasive grains and the second abrasive grains 5 be diamond abrasive grains.
  • the grain size of the second abrasive grains 5 is smaller than the grain size of the first abrasive grains 4.
  • the grain size of the first abrasive grains 4 (or second abrasive grains 5) indicates, for example, the average grain size of the first abrasive grains 4 (or second abrasive grains 5).
  • the ratio of the grain size of the second abrasive grains to that of the first abrasive grains may stand at 0.4.
  • the grain size of the first abrasive grains 4 may be 10 ⁇ m or larger and 300 ⁇ m or smaller.
  • the grain size of the second abrasive grains 5 may be 10 ⁇ m or larger and 120 ⁇ m or smaller.
  • the first abrasive grains 4 correspond to the grit size 600, and with the grain size of the first abrasive grains 4 being 300 ⁇ m, the first abrasive grains 4 correspond to the grit size 50.
  • the grain size of the second abrasive grains 5 is 10 ⁇ m
  • the second abrasive grains 5 correspond to the grit size 1500
  • the second abrasive grains 5 is 300 ⁇ m
  • the second abrasive grains 5 correspond to the grit size 120.
  • the shape of the first abrasive grains 4 may be at least one selected from being blocky, semi-blocky, and irregular.
  • the first abrasive grains 4 preferably have a semi-blocky shape. If the abrasive grains have a semi-blocky shape, a new cutting edge is created from a fracture in the cleavage plane existing in the crystal planes of the abrasive grains, thereby suppressing degradation in the grindability of the electrodeposition whetstone 1.
  • the second abrasive grains 5 preferably have a blocky shape.
  • Both the first abrasive grains 4 and the second abrasive grains 5 protrude from the plating layer 3. That is, at least part of the first abrasive grains 4 and at least part of the second abrasive grains 5 both protrude outwardly from the surface (outer surface) of the plating layer 3.
  • the amount of protrusion of the first abrasive grains 4 is larger than that of the second abrasive grains.
  • the amount of protrusion denotes an average height of the abrasive grains protruding outwardly from the outer surface of the plating layer 3. As illustrated in FIG.
  • a tip (position) of each of the first abrasive grains 4 (or second abrasive grains 5) farthest away from the base 2 is a protruding end 41 of a first abrasive grain 4 (or protruding end 51 of a second abrasive grain 5).
  • the protruding ends 41 of the first abrasive grains 4 are located farther away from the base 2 (i.e., the outer surface of the plating layer 3) than the protruding ends 51 of the second abrasive grains 5 are.
  • a first virtual plane V1 created by the protruding ends 41 and a second virtual plane V2 created by the protruding ends 51 are defined. Since the amount of protrusion of the protruding ends 41 is larger than that of the protruding ends 51, the first virtual plane V1 is located on the outer side with respect to the second virtual plane V2. It is preferable that the average distance between the first virtual plane V1 and the second virtual plane V2 be equal to or shorter than a range R.
  • the range R can be suitably set based at least on the grain size of the first abrasive grains 4, the grain size of the second abrasive grains 5, and the thickness of the plating layer 3.
  • the range R increase in accordance with an increase in the thickness of the plating layer 3. It is preferable that the range R be defined as 6 ⁇ m or larger and 42 ⁇ m or smaller. In one example, if the first abrasive grains 4 are in a grit size of around 600, the range R is preferably around 6 um. In another example, if the first abrasive grains 4 are in a grit size of around 50, the range R is preferably around 42 ⁇ m. As will be described later, with the electrodeposition whetstone 1 satisfying the range R, the life of the electrodeposition whetstone 1 can be prolonged.
  • the first abrasive grains 4 are arranged in the plating layer 3 so as to be separated from each other in the orthogonal direction. That is, a gap is created in the orthogonal direction between the first abrasive grains 4 arranged in the orthogonal direction.
  • the second abrasive grains 5 are arranged in the gaps created by the first abrasive grains 4 in the orthogonal direction.
  • the second abrasive grains 5 are arranged in gaps created in the orthogonal direction by the first abrasive grains 4 adjacent to each other in the orthogonal direction.
  • the size of the gap (interval) between the first abrasive grains 4 is preferably 20 ⁇ m or larger.
  • the second abrasive grains 5 serve as a bond coating of the plating layer 3. This can improve the strength of the electrodeposition whetstone 1, and can also increase the force of the plating layer 3 holding the abrasive grains. The abrasive grains are therefore prevented from coming off from the electrodeposition whetstone 1. In addition, the plating layer 3 is prevented from being scratched by the grinding chips. The life of the electrodeposition whetstone 1 can thereby be prolonged.
  • the grinding sharpness of the electrodeposition whetstone 1 is improved.
  • the present inventors consider the explanation for this as follows.
  • the grinding workpiece is shaved and deformed by the certain first abrasive grain 4. If the first abrasive grains 4 are separated from each other in the orthogonal direction, it is highly probable that another first abrasive grain 4 will grind the workpiece after the workpiece is elastically recovered. As a result, the grinding effects upon the grinding workpiece will be increased, and the friction upon the workpiece will be reduced.
  • the grinding resistance acting upon the electrodeposition whetstone 1 from the contact surface between the electrodeposition whetstone 1 and the workpiece is lowered.
  • effective grinding can be performed by the electrodeposition whetstone 1, and the grinding sharpness of the electrodeposition whetstone 1 is improved.
  • the grinding resistance reduced it is possible to prevent burrs from being produced in the workpiece by the electrodeposition whetstone 1.
  • the second abrasive grains 5 arranged as described earlier elongate the life of the electrodeposition whetstone 1.
  • the present inventors consider the explanation for this as follows. During grinding of the grinding workpiece with the first abrasive grains 4, grinding chips are formed. Since the amount of protrusion of the second abrasive grains 5 from the plating layer 3 is smaller than the amount of protrusion of the first abrasive grains 4 from the plating layer 3 as described above, these grinding chips are broken by the second abrasive grains 5 into still smaller grinding chips. This reduces damage to the plating layer 3 that tends to be caused by the grinding chips.
  • FIG. 2 shows the steps of an exemplary method of manufacturing the electrodeposition whetstone 1 according to the present embodiment.
  • the base 2 used for the electrodeposition whetstone 1 is manufactured with a commonly known method.
  • the surface (outer surface) of the base 2 may be treated with blasting, masking, or the like.
  • the electrodeposition surface is treated by injecting particles onto the surface (electrodeposition surface) of the base 2.
  • alumina abrasive particles may be used in the blasting treatment.
  • a waterproof tape may be used to cover the portions other than the electrodeposition surface.
  • the first abrasive grains 4 are dispersed over the surface of the base 2.
  • first plating primary plating
  • the first plating may be electrolytic plating, examples of which include electrolytic nickel plating.
  • the first abrasive grains 4 are secured to the surface of the base 2.
  • excessive first abrasive grains 4 may remain between the first abrasive grains 4.
  • the excessive first abrasive grains 4 need to be removed from the surface of the base 2.
  • suitable gaps (intervals) can be maintained between the first abrasive grains 4 in the orthogonal direction.
  • Removal of the excessive first abrasive grains 4 may be conducted by hand scrubbing.
  • the dispersion of the first abrasive grains 4 and the primary plating may be performed after the base 2 is cleaned following the blasting treatment. This will increase the adhesion between the primary plating and the base 2.
  • Further plating is performed upon the first abrasive grains suitably secured to the base 2.
  • the secondary plating may be performed in a manner similar to the primary plating. For instance, electrolytic nickel plating is performed.
  • the previously mentioned first plating layer 31 is formed through the primary plating and secondary plating.
  • the total thickness (average total thickness) obtained by adding the thickness of the primary plating and the thickness of the secondary plating can be suitably determined with reference to the grain size (average grain size) of the first abrasive grains.
  • the average total thickness may be, for example, about 20% of the grain size of the first abrasive grains 4, or about 30% of the grain size of the first abrasive grains 4.
  • the second abrasive grains 5 are dispersed so as to arrange the second abrasive grains 5 in the gaps created in the orthogonal direction between the first abrasive grains 4.
  • the second plating (tertiary plating) is performed upon the first plating layer 31, the first abrasive grains 4, and the second abrasive grains 5.
  • the second plating differs from the first plating.
  • the second plating may be electroless plating, examples of which include electroless Ni-P plating.
  • the previously mentioned second plating layer 32 is thereby formed.
  • the thickness of the tertiary plating is preferably smaller than the thickness of the secondary plating.
  • the thickness of the tertiary plating can be suitably determined with reference to the grain size of the first abrasive grains 4 and the grain size of the second abrasive grains 5.
  • the thickness may be 6 um or larger and 72 ⁇ m or smaller.
  • the first abrasive grains 4 correspond to the grit size 1500
  • the grain size of the first abrasive grains 4 being 72 ⁇ m
  • the first abrasive grains 4 correspond to the grit size 120.
  • the plating layer 3 is completed by the primary plating, secondary plating, and tertiary plating.
  • the electrodeposition whetstone 1 After the completion of the plating layer 3, heat treatment is conducted upon the electrodeposition whetstone 1.
  • a heat treatment a commonly used method can be suitably used. For instance, heat treatment at 350 °C may be performed.
  • the electrodeposition whetstone 1 of the embodiment is completed, as illustrated in the bottom of FIG. 2 .
  • the distance (average distance) between the first virtual plane V1 and the second virtual plane V2 can be determined within the range R.
  • the plating solution for the tertiary plating may contain PTFE having an average particle size of 0.1 ⁇ m or larger and 1 um or smaller in an amount of 5% by volume or more and 40% by volume or less with respect to the total volume of the plating solution.
  • PTFE Ni-P-SiC dispersion plating, hard chromium plating, electroless Ni-P plating, electroless Ni-B plating, or electroless Ni-W-P plating may be performed.
  • heat is applied to the second plating layer 32 after the tertiary plating so as to cure the second plating layer 32. This improves the wear resistance of the electrodeposition whetstone 1.
  • the first abrasive grains 4 protrude from the plating layer 3 outwardly in the thickness direction.
  • the second abrasive grains 5 are arranged between the first abrasive grains in the orthogonal direction.
  • the amount of protrusion of the second abrasive grains 5 are a smaller than that of the first abrasive grains 4 from the plating layer 3 in the thickness direction, and the second abrasive grains 5 have a smaller grain size than that of the first abrasive grains 4.
  • the first abrasive grains 4 may contain at least one selected from the group consisting of diamond abrasive grains, CBN abrasive grains, and metal oxide abrasive grains.
  • the second abrasive grains 5 may include at least one of diamond abrasive grains and CBN abrasive grains.
  • the first abrasive grains 4 are secured to the base by the first plating, with gaps created between the first abrasive grains 4 in the orthogonal direction.
  • a grain size of the second abrasive grains 5 being smaller than a grain size of the first abrasive grains 4 are arranged in these gaps in the orthogonal direction.
  • the first abrasive grains 4 and the second abrasive grains 5 are secured by the second plating, which differs from the first plating, in such a manner that the amount of protrusion of the second abrasive grains 5 in the thickness direction is smaller than the amount of protrusion of the first abrasive grains 4.
  • a coating layer 33 may be formed in the electrodeposition whetstone 1 after the plating process is completed, as shown in FIG. 3 .
  • the plating layer 3 of the electrodeposition whetstone 1 further includes the coating layer 33.
  • the thickness of the coating layer 33 is not limited as long as both the first abrasive grains 4 and the second abrasive grains 5 protrude from the coating layer 33, as illustrated in FIG. 3 .
  • the thickness of the coating layer 33 may be, for example, 0.1 ⁇ m or larger and 0.5 ⁇ m or smaller.
  • the coating layer 33 is formed through electroless plating using a nickel solution to which a reducing agent is added.
  • the coating layer 33 is formed through electrolytic plating using a nickel solution to which a reducing agent is added.
  • the plating bath may be a Watts bath or a sulfamate bath.
  • the Watts bath contains, for example, nickel sulfate, nickel chloride, and boric acid as major components.
  • the sulfamic acid bath contains, for example, nickel sulfamate and boric acid as major components.
  • the coating layer 33 may include particles having a friction coefficient lower than that of the coating layer 33.
  • the aforementioned plating solution for the tertiary plating is used as a plating solution for the coating layer 33.
  • the life of the electrodeposition whetstone 1 can be further prolonged.
  • the amount of protrusion of the first abrasive grains 4 is larger than the amount of protrusion of the second abrasive grains 5 in the electrodeposition whetstone 1.
  • the second plating layer may not always attain a sufficient thickness to secure the first abrasive grains 4 and the second abrasive grains 5; the second plating layer is therefore formed by plating that does not contain PTFE or tungsten. In this manner, the second plating layer can be formed up to a thickness sufficient to secure the second abrasive grains 5. Thereafter, the coating layer 33 is formed. The coating layer 33 will be formed with plating that contains at least one of PTFE and tungsten.
  • the electrodeposition whetstone 1 can still exhibit the same effects as the case where at least one of PTFE and tungsten is contained.
  • a foundation layer 7 may be formed in the electrodeposition whetstone 1, as shown in FIG. 4 .
  • the electrodeposition whetstone 1 further includes a foundation layer 7.
  • the thickness of the foundation layer is not particularly limited. The thickness may be, for example, 0.1 ⁇ m or larger and 1 ⁇ m or smaller.
  • the foundation layer 7 is formed of a material containing at least a ferrous material, aluminum, Alloy 42, or a non-metal material. Examples of the ferrous material include a stainless-steel material and a cast material. Examples of the non-metal material include a non-ferrous material and a resin material. Examples of the non-ferrous material include carbon fiber reinforced plastic (CFRP).
  • the electrodeposition whetstone 1 includes the foundation layer 7
  • plating suitable for the material of the foundation layer 7 is provided on the base 2 before the first abrasive grains 4 are dispersed on the base 2.
  • the base 2 is cleaned after the surface of the base 2 is subjected to the blasting or the like, and then the foundation layer 7 is formed on the base 2.
  • copper plating or nickel chloride plating may be adopted for the plating.
  • the foundation plating may be formed by dry plating instead of wet plating, which uses a plating solution. As the dry plating, physical vapor deposition (PVD) or chemical vapor deposition (CVD) may be performed.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • the invention of the present application is not limited to the above-described embodiment, and can be variously modified at the implementation stage without departing from the gist thereof.
  • each embodiment may be carried out in combination as appropriate as possible, and in that case, the combined effect can be obtained.
  • the above-described embodiment includes inventions at various stages, and various inventions can be extracted by an appropriate combination in a plurality of disclosed constitutional requirements.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
EP21891421.6A 2020-11-10 2021-07-27 Electrodeposition grinding wheel and method for producing same Withdrawn EP4245461A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020187129A JP7162910B2 (ja) 2020-11-10 2020-11-10 電着砥石及び製造方法
PCT/JP2021/027687 WO2022102173A1 (ja) 2020-11-10 2021-07-27 電着砥石及び製造方法

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EP4245461A1 true EP4245461A1 (en) 2023-09-20

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EP21891421.6A Withdrawn EP4245461A1 (en) 2020-11-10 2021-07-27 Electrodeposition grinding wheel and method for producing same

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US (1) US20230219194A1 (ja)
EP (1) EP4245461A1 (ja)
JP (1) JP7162910B2 (ja)
CN (1) CN116615308A (ja)
WO (1) WO2022102173A1 (ja)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63144965A (ja) * 1986-12-03 1988-06-17 Kobe Steel Ltd 研削工具およびその製造方法
JPS63144963A (ja) * 1986-12-03 1988-06-17 Kobe Steel Ltd 研削工具の製造方法
JP2679178B2 (ja) * 1988-11-22 1997-11-19 三菱マテリアル株式会社 電着砥石
JPH0290057U (ja) * 1988-12-29 1990-07-17
JPH06114739A (ja) * 1992-10-09 1994-04-26 Mitsubishi Materials Corp 電着砥石
JPH10329029A (ja) * 1997-05-30 1998-12-15 Osaka Diamond Ind Co Ltd 電着超砥粒砥石
JP3052896B2 (ja) * 1997-06-13 2000-06-19 日本電気株式会社 研磨布表面のドレス治具及びその製造方法
JP2000153463A (ja) 1998-11-16 2000-06-06 Asahi Diamond Industrial Co Ltd 電着工具の製造方法
JP3802884B2 (ja) 2003-04-09 2006-07-26 株式会社呉英製作所 Ｃｍｐコンディショナ
JP2004358640A (ja) 2003-06-09 2004-12-24 Goei Seisakusho:Kk 電着工具の製造方法及び電着工具
JP2005022074A (ja) 2003-06-10 2005-01-27 Nikon Corp 研削用砥石
CA2646973C (en) 2008-12-18 2015-12-01 Sunnen Products Company Honing tool having enhanced wear resistance properties
JP5567900B2 (ja) 2010-05-21 2014-08-06 日本碍子株式会社 電着砥石及びその製造方法

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JP2022076650A (ja) 2022-05-20
CN116615308A (zh) 2023-08-18
WO2022102173A1 (ja) 2022-05-19
US20230219194A1 (en) 2023-07-13
JP7162910B2 (ja) 2022-10-31

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