Classifications

• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
  • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
  • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/50—Working by transmitting the laser beam through or within the workpiece
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
  • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
  • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
  • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
  • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
  • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
  • B23K26/073—Shaping the laser spot
  • B23K26/0738—Shaping the laser spot into a linear shape
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/362—Laser etching
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/50—Working by transmitting the laser beam through or within the workpiece
  • B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
  • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
  • C03C23/001—Other surface treatment of glass not in the form of fibres or filaments by irradiation by infrared light
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
  • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
  • C03C23/0015—Other surface treatment of glass not in the form of fibres or filaments by irradiation by visible light
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/18—Sheet panels
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/50—Inorganic materials other than metals or composite materials
  • B23K2103/54—Glass
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
  • Y02P40/00—Technologies relating to the processing of minerals
  • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
  • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

• the invention relates to a plate-shaped glass element which has glassy material with a coefficient of thermal expansion below 10x 10' 6 K -1 and two opposite surfaces.
• the glass element also has at least one recess connecting the two surfaces and opening into the surfaces, running through the glass of the glass element and having a recess depth which is transverse, preferably perpendicular, to at least one of the surfaces of the glass element and corresponds to a thickness of the glass element.
• the recess has a recess wall that extends around the recess and abuts the two opposing surfaces.
• the wall of the recess has a structure which has a multiplicity of rounded, dome-shaped depressions which adjoin one another.
• glass elements which do not deform at all or only slightly when subjected to the action of force, from the thickness range between 300 ⁇ m and 3 mm, in special cases even up to 6 mm, can also be used.
• the laser beam of an ultra-short pulse laser is directed onto one of the surfaces of the glass element and is concentrated to an elongated focus in the glass element using focusing optics, with the radiated energy of the laser beam producing a large number of filament-shaped channels in the volume of the glass element, the depth of which is transverse to the surface of the glass element runs, with the channels being arranged at a distance from one another,
• defects/channels are preferably produced next to one another in such a way that a row of recesses represents a larger structure, ideally in the form of the recess(es) to be produced.
• the damage/channels run in their longitudinal direction transverse to at least one surface, ideally both surfaces of the glass element.
• the channels extend from one surface, and in particular perpendicularly from this surface through the glass element to the other, oppositely arranged surface and break through both surfaces.
• the typical power of the laser source is particularly favorable in a range from 20 to 300 watts.
• a pulse energy of the pulses and/or pulse packets of more than 400 microjoules is used, furthermore advantageously a total energy of more than 500 microjoules.
• a suitable pulse duration of a laser pulse is in a range of less than 100 picoseconds, preferably less than 20 picoseconds.
• FIG. 2 Schematic representation of a glass element with multiple defects
• the frequency of a pulse packet can be, for example, 12 ns-48 ns, preferably around 20 ns, with the pulse energy being at least 200 microjoules and the burst energy correspondingly being at least 400 microjoules.
• the roughness of the recess wall 11 of the recess 10 to be produced can already be specifically adjusted in advance by appropriate selection of certain values of these parameters.
• the indentation sinks 14 essentially form one opposite the ridges 13 lowest point of the depressions, and preferably the ridges 13 have a highest point, or a highest line. However, the ridges 13 are only narrow in relation to the curvatures or bulges.
• Figures 7 and 8 illustrate the dependency of the roughness that can be generated Recess wall 11 and/or outer wall 11 through the pitch and burst. It is clear here that the roughness or the measured mean roughness values (Ra), in particular with a high pitch from, for example, 12 pm and a high burst from, for example, 7, are particularly high, for example in the range of 3 pm or higher. On the other hand, the measured mean roughness values (Ra) from a pitch above 6 pm are comparatively high even with a very low burst between 1 and 2, for example greater than 1.5 pm.
• a low pitch or a combination of a high pitch and high removal is advantageous in order to separate out at least one inner part 20 in order to widen the channels during the etching process to such an extent that they connect. This can be realized with a sufficiently high removal.
• Worm shape is to be understood in the context of the invention in such a way that the ridges 13 form a non-uniform height around a depression 12 and in some areas have a height that can correspond to the depth of the depression, or at least is significantly lower than the height of a large part of the die Indentation surrounding ridge 13.
• indentations 12 appear in the measurement image with an approximately uniform depth, so that the worm shape results from a row of individual indentations 12.
• the recess wall 11 is formed significantly coarser, and thus also duller or rougher, when using a pulse duration of 10 ps (FIG. 10; mean roughness value of 0.50 ⁇ m) than when using a pulse duration of 1 ps (Fig. 9; average roughness of 0.38 pm).
• the mean roughness value (Ra) can therefore be set particularly precisely by varying the pulse duration.
• the transmission of the glass element can be measured, for example, in such a way that the light passes through the surface 2 of the glass element 1 is passed through, or the degree of reflection of light from a wall is determined by means of reflection measurements, which can then be subtracted from the overall measurement result of the transmission measurements.
• 14 shows the results of a reflection measurement.
• Optical waveguide or a fiber probe light was directed onto the wall 11, 4, and the light reflected from the wall 11, 4 was recorded in the wavelength range between 300 nm and 1000 nm.
• the recorded measurement results make it clear that the degree of reflection can be adjusted by the roughness of the wall 11, 4, or a desired degree of reflection based on the

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• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Plasma & Fusion (AREA)
• Mechanical Engineering (AREA)
• Chemical Kinetics & Catalysis (AREA)
• General Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Life Sciences & Earth Sciences (AREA)
• Geochemistry & Mineralogy (AREA)
• Materials Engineering (AREA)
• Oil, Petroleum & Natural Gas (AREA)
• Health & Medical Sciences (AREA)
• Toxicology (AREA)
• Surface Treatment Of Glass (AREA)
• Laser Beam Processing (AREA)
• Glass Compositions (AREA)

Applications Claiming Priority (2)

Publications (1)

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Family Applications (1)

Country Status (7)

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• 2020
  • 2020-10-13 DE DE102020126856.4A patent/DE102020126856A1/de active Pending
• 2021
  • 2021-09-30 WO PCT/EP2021/077030 patent/WO2022078774A1/de not_active Ceased
  • 2021-09-30 KR KR1020237015746A patent/KR102941903B1/ko active Active
  • 2021-09-30 JP JP2023522473A patent/JP7826605B2/ja active Active
  • 2021-09-30 EP EP21790795.5A patent/EP4229016A1/de active Pending
  • 2021-09-30 CN CN202180069869.XA patent/CN116323509A/zh active Pending
• 2023
  • 2023-04-13 US US18/300,087 patent/US20230311248A1/en active Pending

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