EP4229016A1 - Élément de verre à paroi structurée et procédé pour le fabriquer - Google Patents
Élément de verre à paroi structurée et procédé pour le fabriquerInfo
- Publication number
- EP4229016A1 EP4229016A1 EP21790795.5A EP21790795A EP4229016A1 EP 4229016 A1 EP4229016 A1 EP 4229016A1 EP 21790795 A EP21790795 A EP 21790795A EP 4229016 A1 EP4229016 A1 EP 4229016A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- glass element
- wall
- recess
- roughness
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 230
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims description 39
- 239000000463 material Substances 0.000 claims abstract description 15
- 235000019592 roughness Nutrition 0.000 claims description 123
- 238000005530 etching Methods 0.000 claims description 55
- 238000007373 indentation Methods 0.000 claims description 25
- 230000005540 biological transmission Effects 0.000 claims description 14
- 230000001419 dependent effect Effects 0.000 claims description 10
- 238000003384 imaging method Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 claims description 3
- 229910052681 coesite Inorganic materials 0.000 claims description 2
- 229910052906 cristobalite Inorganic materials 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 229910052682 stishovite Inorganic materials 0.000 claims description 2
- 229910052905 tridymite Inorganic materials 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 30
- 238000005259 measurement Methods 0.000 description 21
- 230000008569 process Effects 0.000 description 14
- 230000003287 optical effect Effects 0.000 description 10
- 239000012530 fluid Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- 238000004441 surface measurement Methods 0.000 description 5
- 230000002378 acidificating effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000012670 alkaline solution Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 238000005488 sandblasting Methods 0.000 description 3
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- MIMUSZHMZBJBPO-UHFFFAOYSA-N 6-methoxy-8-nitroquinoline Chemical compound N1=CC=CC2=CC(OC)=CC([N+]([O-])=O)=C21 MIMUSZHMZBJBPO-UHFFFAOYSA-N 0.000 description 1
- 238000000018 DNA microarray Methods 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 238000004901 spalling Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/001—Other surface treatment of glass not in the form of fibres or filaments by irradiation by infrared light
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0015—Other surface treatment of glass not in the form of fibres or filaments by irradiation by visible light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/18—Sheet panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Definitions
- the invention relates to a plate-shaped glass element which has glassy material with a coefficient of thermal expansion below 10x 10' 6 K -1 and two opposite surfaces.
- the glass element also has at least one recess connecting the two surfaces and opening into the surfaces, running through the glass of the glass element and having a recess depth which is transverse, preferably perpendicular, to at least one of the surfaces of the glass element and corresponds to a thickness of the glass element.
- the recess has a recess wall that extends around the recess and abuts the two opposing surfaces.
- the wall of the recess has a structure which has a multiplicity of rounded, dome-shaped depressions which adjoin one another.
- glass elements which do not deform at all or only slightly when subjected to the action of force, from the thickness range between 300 ⁇ m and 3 mm, in special cases even up to 6 mm, can also be used.
- the laser beam of an ultra-short pulse laser is directed onto one of the surfaces of the glass element and is concentrated to an elongated focus in the glass element using focusing optics, with the radiated energy of the laser beam producing a large number of filament-shaped channels in the volume of the glass element, the depth of which is transverse to the surface of the glass element runs, with the channels being arranged at a distance from one another,
- defects/channels are preferably produced next to one another in such a way that a row of recesses represents a larger structure, ideally in the form of the recess(es) to be produced.
- the damage/channels run in their longitudinal direction transverse to at least one surface, ideally both surfaces of the glass element.
- the channels extend from one surface, and in particular perpendicularly from this surface through the glass element to the other, oppositely arranged surface and break through both surfaces.
- the typical power of the laser source is particularly favorable in a range from 20 to 300 watts.
- a pulse energy of the pulses and/or pulse packets of more than 400 microjoules is used, furthermore advantageously a total energy of more than 500 microjoules.
- a suitable pulse duration of a laser pulse is in a range of less than 100 picoseconds, preferably less than 20 picoseconds.
- FIG. 2 Schematic representation of a glass element with multiple defects
- the frequency of a pulse packet can be, for example, 12 ns-48 ns, preferably around 20 ns, with the pulse energy being at least 200 microjoules and the burst energy correspondingly being at least 400 microjoules.
- the roughness of the recess wall 11 of the recess 10 to be produced can already be specifically adjusted in advance by appropriate selection of certain values of these parameters.
- the indentation sinks 14 essentially form one opposite the ridges 13 lowest point of the depressions, and preferably the ridges 13 have a highest point, or a highest line. However, the ridges 13 are only narrow in relation to the curvatures or bulges.
- Figures 7 and 8 illustrate the dependency of the roughness that can be generated Recess wall 11 and/or outer wall 11 through the pitch and burst. It is clear here that the roughness or the measured mean roughness values (Ra), in particular with a high pitch from, for example, 12 pm and a high burst from, for example, 7, are particularly high, for example in the range of 3 pm or higher. On the other hand, the measured mean roughness values (Ra) from a pitch above 6 pm are comparatively high even with a very low burst between 1 and 2, for example greater than 1.5 pm.
- a low pitch or a combination of a high pitch and high removal is advantageous in order to separate out at least one inner part 20 in order to widen the channels during the etching process to such an extent that they connect. This can be realized with a sufficiently high removal.
- Worm shape is to be understood in the context of the invention in such a way that the ridges 13 form a non-uniform height around a depression 12 and in some areas have a height that can correspond to the depth of the depression, or at least is significantly lower than the height of a large part of the die Indentation surrounding ridge 13.
- indentations 12 appear in the measurement image with an approximately uniform depth, so that the worm shape results from a row of individual indentations 12.
- the recess wall 11 is formed significantly coarser, and thus also duller or rougher, when using a pulse duration of 10 ps (FIG. 10; mean roughness value of 0.50 ⁇ m) than when using a pulse duration of 1 ps (Fig. 9; average roughness of 0.38 pm).
- the mean roughness value (Ra) can therefore be set particularly precisely by varying the pulse duration.
- the transmission of the glass element can be measured, for example, in such a way that the light passes through the surface 2 of the glass element 1 is passed through, or the degree of reflection of light from a wall is determined by means of reflection measurements, which can then be subtracted from the overall measurement result of the transmission measurements.
- 14 shows the results of a reflection measurement.
- Optical waveguide or a fiber probe light was directed onto the wall 11, 4, and the light reflected from the wall 11, 4 was recorded in the wavelength range between 300 nm and 1000 nm.
- the recorded measurement results make it clear that the degree of reflection can be adjusted by the roughness of the wall 11, 4, or a desired degree of reflection based on the
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Surface Treatment Of Glass (AREA)
- Glass Compositions (AREA)
- Laser Beam Processing (AREA)
Abstract
L'invention concerne un élément de verre en forme de plaque qui présente un matériau de verre ayant des coefficients de dilatation thermique inférieurs à 10×10-6 K-1, et deux surface opposées. L'élément de verre présente par ailleurs au moins une cavité qui traverse le verre de l'élément de verre et qui présente une paroi qui s'étend sur le tour de l'ouverture et qui est adjacente aux deux surfaces opposées. La paroi de la cavité présente une structure qui présente une pluralité de creux en forme de calotte arrondie adjacents entre eux. Les creux et les arêtes qui entourent les creux confèrent une rugosité à la paroi de la cavité. La paroi de la cavité présente une rugosité moyenne (Ra) qui est inférieure à 5 µm, de préférence inférieure à 3 µm, de préférence encore inférieure à 1 µm. L'invention concerne par ailleurs un procédé pour réaliser l'élément de verre en forme de plaque à paroi structurée, la régulation des paramètres laser permettant de régler de manière ciblée la structure de la paroi de la cavité ou la rugosité.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102020126856.4A DE102020126856A1 (de) | 2020-10-13 | 2020-10-13 | Glaselement mit strukturierter Wandung und Verfahren zu dessen Herstellung |
PCT/EP2021/077030 WO2022078774A1 (fr) | 2020-10-13 | 2021-09-30 | Élément de verre à paroi structurée et procédé pour le fabriquer |
Publications (1)
Publication Number | Publication Date |
---|---|
EP4229016A1 true EP4229016A1 (fr) | 2023-08-23 |
Family
ID=78134920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP21790795.5A Pending EP4229016A1 (fr) | 2020-10-13 | 2021-09-30 | Élément de verre à paroi structurée et procédé pour le fabriquer |
Country Status (8)
Country | Link |
---|---|
US (1) | US20230311248A1 (fr) |
EP (1) | EP4229016A1 (fr) |
JP (1) | JP2023546072A (fr) |
KR (1) | KR20230086721A (fr) |
CN (1) | CN116323509A (fr) |
DE (1) | DE102020126856A1 (fr) |
TW (1) | TW202233537A (fr) |
WO (1) | WO2022078774A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102022120050A1 (de) * | 2022-08-09 | 2024-02-15 | RENA Technologies GmbH | Verfahren und System zum Substratätzen sowie Substrathalter |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018100299A1 (de) | 2017-01-27 | 2018-08-02 | Schott Ag | Strukturiertes plattenförmiges Glaselement und Verfahren zu dessen Herstellung |
DE102018110211A1 (de) | 2018-04-27 | 2019-10-31 | Schott Ag | Verfahren zum Erzeugen feiner Strukturen im Volumen eines Substrates aus sprödharten Material |
DE102018110210A1 (de) | 2018-04-27 | 2019-10-31 | Schott Ag | Mikrofluidikzelle und Verfahren zu deren Herstellung |
-
2020
- 2020-10-13 DE DE102020126856.4A patent/DE102020126856A1/de active Pending
-
2021
- 2021-09-30 WO PCT/EP2021/077030 patent/WO2022078774A1/fr unknown
- 2021-09-30 EP EP21790795.5A patent/EP4229016A1/fr active Pending
- 2021-09-30 CN CN202180069869.XA patent/CN116323509A/zh active Pending
- 2021-09-30 JP JP2023522473A patent/JP2023546072A/ja active Pending
- 2021-09-30 KR KR1020237015746A patent/KR20230086721A/ko active Search and Examination
- 2021-10-08 TW TW110137461A patent/TW202233537A/zh unknown
-
2023
- 2023-04-13 US US18/300,087 patent/US20230311248A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2023546072A (ja) | 2023-11-01 |
KR20230086721A (ko) | 2023-06-15 |
TW202233537A (zh) | 2022-09-01 |
WO2022078774A1 (fr) | 2022-04-21 |
DE102020126856A1 (de) | 2022-04-14 |
US20230311248A1 (en) | 2023-10-05 |
CN116323509A (zh) | 2023-06-23 |
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