EP4129026A1 - Module de puissance avec surmoulage, dispositifs comportant un tel module de puissance et procede de fabrication d'un module de puissance avec surmoulage - Google Patents
Module de puissance avec surmoulage, dispositifs comportant un tel module de puissance et procede de fabrication d'un module de puissance avec surmoulageInfo
- Publication number
- EP4129026A1 EP4129026A1 EP21715263.6A EP21715263A EP4129026A1 EP 4129026 A1 EP4129026 A1 EP 4129026A1 EP 21715263 A EP21715263 A EP 21715263A EP 4129026 A1 EP4129026 A1 EP 4129026A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- overmolding
- main
- power module
- electrical connection
- attachment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/464—Additional interconnections in combination with leadframes
- H10W70/466—Tape carriers or flat leads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/04—Manufacture or treatment of leadframes
- H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/016—Manufacture or treatment using moulds
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/66—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output with possibility of reversal
- H02M7/68—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output with possibility of reversal by static converters
- H02M7/72—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output with possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/79—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output with possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M7/797—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output with possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
- H10W70/427—Bent parts
- H10W70/429—Bent parts being the outer leads
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
- H10W72/651—Materials of strap connectors
- H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/853—On the same surface
- H10W72/871—Bond wires and strap connectors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/926—Multiple bond pads having different sizes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
- H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Definitions
- the present invention relates to a power module with overmolding, an electronic system and a voltage converter comprising such a power module, as well as a method of manufacturing such a power module with overmolding.
- the French patent application published under the number FR 3,068,564 A1 describes a power module comprising: electrical connection parts, preferably made of metal, each having a main plate, the main plates extending along the same main plane so as to be substantially coplanar, at least one of the electrical connection pieces comprising at least one electrical connector projecting from its main plate; at least one transistor electrically connected between two upper faces of respectively two of the main plates; and an electrically insulating overmolding, for example made of resin, covering each transistor and at least part of the upper faces of the main plates.
- Such a power module can for example be used in a motor vehicle. However, in such an environment, the power module can be subjected to relatively high mechanical vibrations.
- a drawback of such a power module is that the overmolding risks peeling off over time, for example due to the mechanical vibrations mentioned above.
- a power module comprising: - electrical connection parts, preferably made of metal, each having a main plate, the main plates extending along the same main plane so as to be substantially coplanar, at least one of the electrical connection parts comprising at least one electrical connector projecting from its main plate; at least one transistor electrically connected between two upper faces of respectively two of the main plates; and an electrically insulating overmolding, for example made of resin, covering each transistor and at least part of the upper faces of the main plates; characterized in that at least one of the electrical connection parts also has at least one attachment post to the overmolding, distinct from the electrical connector (s) of this electrical connection part if the latter includes any, each attachment pin is projecting only in a direction of projection in the main plane, from a portion of the main plate of this electrical connection part, and in that the overmolding at least partially covers the attachment pin.
- the contact surface between the overmolding and the connection pieces is increased compared to the case without a tenon, which allows the main plates to be better retained by the overmolding.
- a power module according to the invention may further include one or more of the following optional characteristics, taken in isolation or else in any technically possible combination.
- the electrical connector projects from the main plate into the main plane.
- the transistor has a lower face pressed against the upper face of one of the main plates to which the transistor is connected.
- the fastening pin and the main plate carrying it are made in one piece by continuity of material.
- the electrical connector and the main plate carrying it are made in one piece by continuity of material.
- the power module comprises two transistors, for example having plated lower faces respectively against upper faces of the main plates of two different connection pieces or against the upper face of the main plate of the same connection piece.
- At least one of the electrical connector (s) projects at least in part along the main plane.
- each of the electrical connection parts comprises at least one electrical connector projecting from its main plate.
- the overmolding is integral in one piece.
- each transistor on the one hand, has a lower face pressed against one of the two upper faces to which this transistor is electrically connected and, on the other hand, is electrically connected, for example by a or more ribbons or threads, on the other of the two upper faces.
- at least one of the main plates has, on a lower face, at least a first cavity filled by the overmolding, and the overmolding has, in this cavity, a lower face flush with the lower face of the plate main.
- each first cavity is open on the edge of the main plate having this cavity.
- each electrical connector has a fixed end fixed to the main plate, this fixed end having a lower face entirely uncovered by overmolding.
- the overmolding has a stud projecting downwards
- the main plates are separated from each other along the main plane by at least one gap and the overmolding fills each gap and has, in each gap, a lower face flush with the lower faces of the main plates.
- the stud projects from the underside of the overmolding present in the interstice.
- the direction of projection of the attachment post is substantially perpendicular to the edge of the main plate from which the attachment post projects.
- the hooking pin has a length, depending on its direction of projection, less than or equal to 5 mm
- the electrical connection parts are obtained by cutting a metal plate.
- the attachment pin is formed by a residue of the attachment tab resulting from a cutout of an attachment tab connecting, before cutting, the main plate to another coplanar plate of said metal plate.
- the hooking pin is located on a portion of the outer edge of the main plate.
- each of at least one of the attachment stud (s) has a thickness, as well as a width greater than or equal to its thickness.
- the gripping pin is entirely covered by the overmolding.
- each fastening pin has: - a fixed end fixed to the edge of the main plate, an upper face, a lower face, two side faces, and a front face, and the overmolding covers the less partially one or more of: the lower face, the upper face, the side faces and the front face of each hooking pin.
- the overmolding leaves at least partially uncovered the underside of at least one of the attachment tenons. According to another characteristic, the overmolding has at least one second cavity leaving at least partially uncovered the upper face of at least one of the attachment tenons.
- the cavity defines a free volume including a right cylinder having a circular base included in the main plane, this circular base having a diameter between 3 and 5 mm, preferably 4 mm, and a center located at a distance of between 0.5 and 1.5 mm, preferably 1 mm, from a line of the main plane connecting the two parts of an edge of the overmolding surrounding the cavity.
- the center of the circular base is located vertically over a middle of the width of the gripping post.
- the overmolding has a peripheral protuberance along at least part of an outer edge of the overmolding according to the main plane and projecting downwards lower than the underside of the main plate (s), this peripheral protuberance at least partially covering the underside of at least one of the attachment tenons.
- the peripheral protuberance covers the gripping post at the front of its fixed end so as to leave the underside of the gripping post uncovered at its fixed end.
- the front face of at least one of the attachment stud (s), the lower face of which is covered by the peripheral protuberance is entirely covered by the overmolding, for example by the peripheral protuberance of the overmolding.
- the front face of at least one of the attachment stud (s) is completely covered by the overmolding.
- At least one of the attachment stud (s) protrudes from the overmolding in its direction of projection by a distance of less than 2 mm.
- the power module comprises two hooking pins projecting from the edge of the same main plate, and the overmolding covers, on the one hand, at least partially a part of the extending edge. between the two attachment tenons and, on the other hand, at least partially the side faces facing these two attachment tenons.
- the overmolding leaves visible at least part of a lower face of the main plate of at least one electrical connection part, this part left visible being designed to be pressed against a heat sink.
- a transistor is pressed against the main plate, part of the lower face of which is left visible by the overmolding to be pressed against the heat sink.
- An electronic system comprising a heat sink and a power module according to the invention, and in which the heat sink is in thermal contact with at least one underside left exposed by the overmolding.
- the heat sink is in thermal contact with at least part of the lower face left visible by the overmolding via an electrically insulating thermal connection element.
- the pad comes into contact with the heat sink in order to control the thickness of the electrically insulating thermal connection element present between the heat sink and the lower face (s) of the main plate (s) left discovered by overmolding.
- a method of manufacturing a power module comprising: obtaining a conductive plate, preferably made of metal, extending along a main plane; - Cutting, in the conductive plate, on the one hand, of a frame part and several flat parts comprising at least two electrical connection parts each having a main plate, the main plates extending along the main plane of so as to be substantially coplanar, at least one of the electrical connection pieces comprising at least one electrical connector projecting from its main plate, and, on the other hand, of the attachment tabs of each main plate with at least one of the or other parts; the electrical connection of at least one transistor between two upper faces of respectively two main plates; the production with an electrically insulating material, for example resin, of an overmolding of the transistor and of at least part of the upper faces of the main plates; and cutting the fastening tabs to separate each electrical connection piece from the other piece (s); characterized in that the cutting of the fastening tabs is made so as to leave a residue of the fastening tab projecting from one of
- a method according to the invention may further include one or more of the following optional characteristics, taken in isolation or else in any technically possible combination.
- the overmolding is carried out by casting or injection in one go of the electrically insulating material in a mold.
- the overmolding is carried out before the cutting of the fastening tabs.
- the overmolding is carried out after the cutting of the fastening tabs.
- the cutting of the fastening legs involves cutting a first part of the fastening legs, then performing the overmolding, then cutting a second part of the fastening legs.
- the production of the overmolding comprises the production of a part of the overmolding, then the cutting of the fastening tabs, then the production of a second part of the overmolding.
- the overmolding is carried out to present at least one cavity leaving at least partially uncovered an upper face of at least one of the attachment tenons.
- the cavity defines a free volume including a right cylinder having a circular base included in the main plane, this circular base having a diameter between 3 and 5 mm, preferably 4 mm, and a center located at a distance of between 0.5 and 1.5 mm, preferably 1 mm, from a line of the main plane connecting the two parts of an edge of the overmolding surrounding the cavity.
- the cutting of the attachment tabs firstly comprises the placement of a reinforcing piece against the upper face of at least one of the attachment tabs, this upper face being uncovered by the cavity, then cutting the fastener 2104 from bottom to top with a cutting tool to achieve a shearing effect with the backing piece.
- FIG. 1 Figure 1 schematically shows an electrical system comprising a voltage converter embodying the invention
- FIG. 2 Figure 2 is an exploded three-dimensional view of the voltage converter of Figure 1
- FIG.3 Figure 3 is a three-dimensional view from above of a power module of the voltage converter of Figure 2, without overmolding,
- Figure 4 is a view similar to that of Figure 4, with overmolding
- Figure 5 is a bottom three-dimensional view of the power module of the figures 3 and 4, without overmolding
- Figure 6 is a view similar to that of Figure 5, with overmolding,
- FIG. 7 is a three-dimensional view from above of the tenons attached to the overmolding of the power module of FIGS. 3 to 6, without overmolding,
- Figure 8 is a view similar to that of Figure 7, with overmolding
- Figure 9 is a three-dimensional view from below of the attachment pins of Figures 7 and 8, with overmolding
- FIG.10 Figure 10 is a top view of a cavity of the overmolding revealing an upper face of the gripping post, [0069] [Fig.11] Figure 11 is a three-dimensional view of below the hooking lugs in an alternative embodiment,
- Figure 12 is a three-dimensional sectional view of the power module in the alternative embodiment of Figure 11,
- FIG. 13 is a three-dimensional view from below of the gripping pins in an alternative embodiment
- Figure 14 is a three-dimensional sectional view of the power module in the alternative embodiment of Figure 13,
- FIG. 15 is a three-dimensional view from below of the attachment pins in an alternative embodiment
- FIG. 16 is a three-dimensional view in section of the power module in the alternative embodiment of figure 15,
- FIG. 17 is a three-dimensional view from below of the gripping pins in an alternative embodiment
- Figure 18 is a three-dimensional sectional view of the power module in the alternative embodiment of Figure 17,
- Figure 19 is a three-dimensional view of another embodiment of the power module of the voltage converter of Figure 1, without overmolding,
- Figure 20 is a view similar to that of Figure 19, with overmolding,
- Figure 21 is a three-dimensional view from below of a plate cut to form electrical connection parts of the power module, with overmolding.
- Figure 22 is a three-dimensional view from above of the cut-out plate of Figure 21, and [0081] [Fig.23] Figure 23 illustrates the successive steps of a method of manufacturing a power module, according to one embodiment of the invention.
- the electrical system 100 is for example intended to be installed in a motor vehicle.
- the electrical system 100 firstly comprises an electrical power source 102 designed to deliver a direct voltage U, for example between 10 V and 100 V, for example 48 V or else 12 V.
- the source of power supply 102 comprises for example a battery.
- the electrical system 100 further comprises an electrical machine 130 comprising several phases (not shown) intended to present respective phase voltages.
- the electrical system 100 further includes a voltage converter 104 connected between the power source 102 and the electrical machine 130 to convert between the direct voltage U and the phase voltages.
- the voltage converter 104 firstly comprises a positive bus bar 106 and a negative bus bar 108 intended to be connected to the power supply source 102 to receive the direct voltage U, the positive bus bar 106 receiving a high electric potential and the negative bus bar 108 receiving a low electric potential.
- the voltage converter 104 further comprises at least one power module 110 comprising one or more phase bus bars 122 intended to be respectively connected to one or more phases of the electric machine 130, to supply their respective phase voltages.
- the voltage converter 104 comprises three power modules 110 each comprising two phase bus bars 122 connected to two phases of the electrical machine 130.
- the electric machine 130 comprises two three-phase systems each comprising three phases, and intended to be electrically phase-shifted by 120 ° with respect to each other.
- the first phase busbars 122 of the power modules 110 are respectively connected to the three phases of the first three-phase system, while the second phase bus bars 122 of the power modules 110 are respectively connected to the three phases of the second three-phase system.
- Each power module 110 comprises, for each phase bus bar 122, a high side switch 112 connected between the positive bus bar 106 and the phase bus bar 122 and a low side switch 114 connected between the bus bar phase 122 and the negative bus bar 108.
- the switches 112, 114 are arranged to form a switching arm, in which the phase bus bar 122 forms a midpoint.
- Each switch 112, 114 comprises first and second main terminals 116, 118 and a control terminal 120 intended to selectively open and close the switch 112, 114 between its two main terminals 116, 118 as a function of a signal command applied to it.
- the switches 112, 114 are preferably transistors, for example field effect transistors with a metal-oxide-semiconductor structure (standing for “Metal Oxide Semiconductor Field Effect Transistor” or MOSFET) having a gate forming the control terminal. 120, and a drain and a source respectively forming the main terminals 116, 118.
- MOSFET Metal Oxide Semiconductor Field Effect Transistor
- the switches 112, 114 could be insulated gate bipolar transistors (standing for “Insulated Gâte Bipolar Transistor” or IGBT).
- the switches 112, 114 each have the shape of a plate, for example substantially rectangular, having an upper face and a lower face.
- the first main terminal 116 extends on the underside, while the second main terminal 118 extends on the upper face.
- the switches 112, 114 are intended to be crossed, between their main terminals 116, 118, by a current greater than 1 A.
- the positive bus bar 106, the negative bus bar 108 and the phase bus bars 122 are rigid electrical conductors designed to withstand electrical currents of at least 1 A intended to pass through the switches 112, 114 They preferably have a thickness of at least 1 mm.
- the positive bus bar 106 firstly comprises a common positive bus bar 106A connecting the power modules 110 and, in each power module 110, a local bus bar positive 106B connected to the positive common bus bar 106A.
- the negative bus bar 108 has a negative common bus bar 108A connecting the power modules 110 and, in each power module 110, a negative local bus bar 108B for each low side switch 114, the negative local bus bars 108B being connected to the negative common bus bar 108B.
- the connections are represented in Figure 1 by diamonds.
- the positive common bus bar 106A and the negative common bus bar 108A are each formed from a single conductive piece.
- the electric machine 130 has both an alternator and an electric motor function. More specifically, the motor vehicle further comprises a heat engine (not shown) having an output axis to which the electric machine 130 is connected by a belt (not shown). The heat engine is intended to drive the wheels of the motor vehicle through its output axis.
- the electrical machine 130 supplies electrical energy to the electrical power source 102 from the rotation of the output shaft.
- the voltage converter 104 then operates as a rectifier.
- the electric machine drives the output shaft (in addition to or instead of the heat engine).
- the voltage converter 104 then operates as an inverter.
- the electric machine 130 is for example located in a gearbox or in a clutch of the motor vehicle or instead of the alternator.
- the voltage converter 104 comprises a heat sink 206, also called heat sink, having heat exchange surfaces 204 on which are respectively mounted the power modules 110 (a single module of power 110 is shown in Figure 2).
- the heat exchange between the heat exchange surface 204 of the heat sink 206 and the power module 110 is achieved for example through contact, direct or via a thermally conductive paste, between the heat exchange surface 204 of the heat sink 206 and the power module 110.
- the voltage converter 104 also includes a support box 208 on which is fixed a secondary electronic module such as a control module 210.
- a control module 210 is a control card.
- the support housing 208 is mounted on the heat sink 206.
- the power module 110 comprises several electrical connection parts 304, preferably made of metal.
- Each electrical connection piece 304 has a main plate 306 extending along a horizontal PP main plane, the same for all of the main plates 306 so that the main plates 306 are substantially coplanar.
- the main plates 306 have respective horizontal top faces 308 extending at the same level.
- the top faces 308 are only shown in Figure 3 for the larger main plates 306.
- each gap 310 has a width of less than or equal to one five millimeters. This means that the two main plates delimiting the gap 310 are at most five millimeters apart along this gap 310.
- At least one of the electrical connection parts 304 also has at least one electrical connector projecting from its main plate 306.
- Each electrical connector is for example either in the form a pin 312i, either in the form of a bent tab 312 2 , 312 3 , or again in the form of a straight tab 312 4 .
- the straight tabs 312 4 form the phase bus bars 122
- the bent tab 312 3 forms the local bus bar 106A
- the bent tabs 312 2 form the negative local bus bars 108B
- each electrical connector 312i, 312 2 , 312 3 has a fixed end 314 fixed to the main plate 306, a main portion 316 extending vertically in the example described and ending in a free end 318 and an elbow 320 connecting the fixed end 314 to the main portion 316.
- these different elements of the electrical connectors 312i, 312 2 , 312 3 are only indicated in FIG. 3 for two electrical connectors 312i , 312 2 , one in the form of a pin, the other in the form of a tongue.
- the electrical connector 312 4 projects into the main plane PP over a great length in order to allow its connection, for example at least one centimeter.
- the electrical connector 312 4 has a fixed end 314 fixed to the main plate 306, this fixed end 314 having a large width to allow the passage of current, for example of at least one centimeter.
- At least one of the electrical connection parts 304 also has at least one attachment pin 322 to an overmolding of the power module 110, which will be described later with reference to FIG. 4.
- the attachment pins 322 are dedicated to retain the overmolding against the electrical connection pieces 304.
- the attachment stud (s) 322 of an electrical connection piece 304 are separate from the electrical connector (s) 312i, 312 2 , 312 3 , 312 4 possibly present on this electrical connection part 304.
- each hooking pin 322 does not make it possible to establish an electrical connection with another electrical conductor and is therefore intended to remain free of any electrical connection to another electrical conductor.
- Each attachment pin 322 thus projects only in a direction of projection DP in the main plane PP, from a slice of the main plate 306 of this electrical connection piece 304. This is in contrast to the electrical connectors 312i in pin form and electrical connectors in the form of a bent tongue 312 2 , 312 3 , the vertical portion 316 of which projects vertically.
- the direction of projection DP of the attachment pin 322 is substantially perpendicular to the edge of the main plate 306 from which the attachment pin 322 projects.
- the attachment pin 322 has a length, according to its direction of projection DP, less than or equal to five millimeters and has a thickness E, identical to that of the main plate 306 in the example described, and a width L greater than or equal to its thickness E.
- This width L is preferably less than or equal to 5 millimeter.
- each hooking stud 322 is located outside the power module 110.
- each hooking stud 322 is located on a portion of the outer edge of the main plate 306, that is, that is to say a portion of a wafer not delimiting an interstice 310.
- each attachment post 322 may be formed by a residue of the attachment tab resulting from a cutout of an attachment tab connecting, before cutting, the main plate to another coplanar plate of said metal plate.
- the metal plate is made of copper.
- the metal plate could be made of aluminum or even of gold.
- the power module 110 comprises the transistors 112, 114 each electrically connected between two upper faces 308 of respectively two of the main plates 306, for example to pass and interrupt a power current on command. , which may for example be greater than one ampere, between these two main plates 306.
- Each transistor 112, 114 first of all has a lower face pressed against one of the two upper faces 308 to which this transistor is electrically connected.
- Each transistor 112, 114 further has an upper face, part of which is electrically connected, for example by one or more ribbons 326 (as in the example shown) or wires, to the other of the two upper faces.
- the upper face of transistor 112, 114 further comprises a control portion of transistor 112, 114, electrically connected to an upper face of a third main plate 306, for example by a wire 328 in the example described.
- the tapes 326 are made of aluminum and have, for example, dimensions of 2mmx0.3mm.
- the ribbons 326 are made of gold.
- the wire 328 is made of aluminum and has a diameter of 0.2 mm. In an alternative embodiment, the wire 328 is made of gold.
- the electrical connectors 312i in the form of a pin are used for connecting the power module 110 to the control module 210, in order to take measurements of electrical quantities and to control the transistors 112, 114. [0117] 0118] Further, still in the example described, the electrical connectors 312 2 are connected to the negative bus bar 108 and the electrical connector 312 3 is connected to the positive bus bar 106.
- the two electrical connectors 312 4 in the form of a straight tab respectively form the two phase bus bars 122 of the power module 110.
- the overmolding 402 is an electrical insulator and entirely covers each transistor 112, 114, each ribbons 326 and each wire 328 and at at least part of the upper faces 308 of the main plates 306.
- the overmolding 402 is for example made of resin, for example also of epoxy.
- the overmolding 402 is integral in one piece.
- the overmolding 402 at least partially covers each attachment post 322.
- the contact surface between the overmolding 402 and the connection parts 304 is increased, compared with the case without a post, which allows the overmolding 402 to better retain the main plates 306.
- At least one of the main plates 306 has, on a lower face 502, at least one cavity 504 for retaining the overmolding 402.
- Each retaining cavity 504 is open on the edge of the main plate 306 showing this cavity.
- the retaining cavity 504 is located on the periphery of the underside 502 of the main plate 306. Further, each retaining cavity 504 defines a horizontal step offset vertically above the underside 502 of the. the main plate 306.
- Each retaining cavity 504 is produced for example by stamping.
- the overmolding 402 leaves visible at least part of the lower face 502 of the main plate 306 of each electrical connection piece 304 comprising at least one electrical connector 312i, 312 2 , 312 3 , 312 4 .
- This part left exposed is designed to be pressed against the heat sink 206.
- the heat sink 206 is in thermal contact with each part of the lower face 502 left visible by overmolding 402.
- This thermal contact can be a direct contact or else via an insulating and thermally conductive electrical connection element.
- each retaining cavity 504 is filled by the overmolding 402, and the overmolding 402 has, in this retaining cavity 504, a lower face flush with the lower face 502 of the main plate 206.
- each electrical connector 312i, 312 2 , 312 3 , 312 4 has a lower face entirely uncovered with overmolding 402.
- the overmolding 402 fills each gap 310 and has, in each gap 310, a lower face flush with the lower faces 502 of the main plates 206.
- the overmolding 402 has at least one pad 506 projecting downwards and designed to come into direct contact with the heat sink 206 in order to define a predefined spacing between the lower faces 502 of the main plates 206 and the heat sink 206, and thus the thickness of the thermal conductor element filling this gap.
- each stud 506 projects from the underside of the overmolding present in one of the interstices 310 between the main plates 206.
- each attachment pin 322 has a fixed end 702 fixed to the edge (designated by the reference 704) of the main plate 306 carrying this attachment pin 322. It also has a upper face 706, a lower face 708, two side faces 710 and a front face 712 forming a free end of the attachment pin 322. For the sake of clarity, these different parts are only indicated for one of the attachment pins 322 , but it is apparent to the person skilled in the art that these parts are found on the other attachment lugs 322. In the example described, each attachment lug 322 has a thickness equal to that of the main plate 306 carrying it. In addition, the upper face 706 of the hooking pin also extends in the continuity of the upper face 308 of this main plate 306.
- the overmolding 402 at least partially covers one or more of: the lower face 708, the upper face 706, the side faces 710 and the front face 712 of each tenon of. hook 322. [0129] In the example illustrated, the overmolding 402 covers the major part of the side faces 710 of each fastening pin 322 and leaves its front face 712, its lower face 708 and most of its upper face 706 visible.
- the overmolding 402 at least partially covers the edges 704 of the main plates 306, in particular between the two attachment pins 322 of each pair of successive attachment pins 322, in particular those carried by the same main plate 306.
- This part (indicated by the reference 806) of the overmolding 402 between the two attachment pins 322 extends from one to the other of the two side faces 710 facing these pins grip 322 and covers these two side faces 710 for the most part.
- the overmolding 402 has at least one cavity 802 in the form of an indentation in a slice 804 of the overmolding 402.
- the cavity 802 is open on the upper face of the overmolding. 402. This cavity 802 thus at least partially uncovers the upper face 706 of at least one of the attachment tenons 322.
- each attachment pin 322 protrudes from the overmolding 402 (that is to say parts 806 in the example illustrated) along its direction of projection DP by a distance of at least 1 mm. .
- the lower face 708 of the hooking pin 322 extends in continuity with the lower face 502 of the main plate 306.
- the overmolding 402 does not goes no lower than the undersides 502 of the main plates 306 and leaves them fully uncovered, as do the undersides 708 of the hooking studs 322.
- the cavity 802 delimits a free volume including a right cylinder having a circular base 1002 included in the main plane PP, this circular base 1002 having a diameter D of between 3 and 5 mm, preferably 4 mm, and a center C located at a distance G between 0.5 and 1.5 mm, preferably 1 mm, from a line L of the main plane PP connecting the two parts of the edge 804 of the overmolding 402 surrounding the cavity 802.
- the center C of the circular base 1002 is located vertically over a middle of a width (for example parallel to the line L) of the attachment pin 322, the upper face 706 of which is exposed by the cavity 802.
- the molding 402 is devoid of cavity 802 for at least one of the attachment pins 322 so that the molding 402 covers most of the upper face 706 of each of these attachment pins 322.
- the overmolding 402 is provided with cavities 802 as in FIGS. 8 and 9 and also has a peripheral protuberance 1302 along at least part of an outer edge of the overmolding 402 along the main plane and projecting downwards lower than the lower faces 502 of the main plates 306.
- This peripheral protuberance 1302 has for example the shape of a wall and at least partially covers the lower face 708 with at least one of the attachment tenons 322.
- the peripheral protuberance 1302 covers the lower face 708 over the entire width of the attachment tenon 322.
- the peripheral protuberance 1302 covers the hooking pin 322 at the front of its fixed end 702 so as to leave the part of its lower face uncovered. 708 located at its fixed end 702. This part is indicated in Figure 14 by the reference 1402.
- the overmolding 402 is similar to that of Figures 13 and 14, except that it at least partially covers the front face 712 of minus one of the hooking lugs 322.
- the overmolding 402 entirely covers the front face of the attachment pin 322 shown.
- the overmolding 402 entirely covers at least one of the attachment pins 322.
- the overmolding 402 is similar to that of Figures 15 and 16, except that it entirely covers the lower face 708 of the hooking pin 322 shown.
- Figures 19 and 20 Another embodiment of the power module 110 is illustrated in Figures 19 and 20. As will be apparent, this other embodiment has the same elements as the embodiment of Figures 3 to 10, these elements being designated by the same references as above. The variant embodiments of Figures 11 to 18 can also be applied to the power module of Figures 19 and 20.
- Figures 21 and 22 illustrate a conductive plate 2100, preferably made of metal, extending along the main plane and in which are cut first several flat pieces comprising a frame part 2102 and the electrical connection pieces 304 of the power module 110 (that of FIGS. 3 to 10 in the example illustrated). As explained previously, each electrical connection piece 304 has a main plate and, optionally, at least one electrical connector projecting from its main plate.
- the electrical connectors 312i, 312 2 , 312 3 have been bent.
- attachment tabs 2104 of each main plate with at least one of the other part (s) (other connection part 304 or else frame part 2102).
- these Secondary attachment tabs are not visible.
- the transistors 112, 114 are fixed and electrically connected and the overmolding 402 has been carried out, in particular so as to completely cover the transistors 112, 114 and at least part of the upper faces of the main plates, as well as at least partially at least some of the attachment tabs 2104.
- the overmolding 402 extends to the plane of the lower faces of the main plates of the connection pieces 304.
- a conductive plate extending along a main plane is obtained.
- the conductive plate obtained in the previous step is cut to define the frame part 2102 and the connection parts 304.
- the transistors 112, 114 are fixed and electrically connected to the main plates 306 of the connection pieces 304.
- the overmolding 402 is made with an electrically insulating material, for example resin, so as to completely cover the transistors 112, 114, at least part of the upper faces 308 of the main plates. 306, as well as part of an upper face of some of the legs attachment 2104 (those designed to form the attachment lugs 322).
- this step is carried out by casting or injection all at once into a single mold cavity. More preferably, the mold has a shape delimiting in the overmolding 402 each cavity 802 leaving at least partially uncovered the upper face of the fastening tabs 2104 designed to form the fastening tenons 322.
- the electrical connectors 312i, 312 2 , 312 3 are bent to place their main portions vertically in the example described, as illustrated in FIG. 20.
- the result of this step is illustrated in Figures 21 and 22.
- the fastening tabs 2104 are cut to separate each electrical connection part 304 from the other part or parts.
- this step comprises first of all, for at least one attachment tab (preferably for all the attachment tabs), the placement of a reinforcing piece against the upper face of this tab. 'fastener, this upper face being uncovered thanks to the presence of the cavity 802. Then, a cutting tool cuts this fastener 2104 from the bottom upwards in order to achieve a shearing effect with the reinforcing piece.
- the presence of the reinforcement part makes it possible to avoid deformation of the overmolding during cutting, which could damage it.
- the presence of the cavity (s) 802 makes it possible to discover a sufficient surface area of the upper face of the hooking tabs 2104 to allow the use of the reinforcement piece mentioned above.
- the cutting of the attachment tabs 2104 is made so as to leave, for each attachment tab 2104 covered by the overmolding 402, at least the portion covered by the overmolding 402 as a residue of the attachment tab.
- This attachment tab residue thus forms one of the attachment lugs 322 described above.
- the overmolding 402 could be carried out after the cutting of the fastening tabs 2104. The overmolding 402 would then cover at least one residue of the fastening tab thus forming a fastening pin 322.
- the cutting of the attachment tabs 2104 comprises the cutting of a first part of the attachment tabs 2104 (those designed to form the attachment lugs 322), then the production of the overmolding 422, then the cutting of a second part of the fastening tabs 2104.
- the production of the overmolding 402 comprises the production of a first part of the overmolding (that shown in FIGS. 20 and 21), then the cutting of the fastening tabs 2104 (at least those designed to form the fastening tenons 322), then the production, on the first part of the overmolding, of a second part of the overmolding 402.
- the second part of the overmolding may come to cover the front face of the attachment tenons 322, which was not possible during the production of the first part of the overmolding since the attachment tabs 2104 were not cut.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inverter Devices (AREA)
- Power Conversion In General (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR2003115A FR3108822B1 (fr) | 2020-03-30 | 2020-03-30 | Module de puissance avec surmoulage, dispositifs comportant un tel module de puissance et procede de fabrication d’un module de puissance avec surmoulage |
| PCT/EP2021/058252 WO2021198230A1 (fr) | 2020-03-30 | 2021-03-30 | Module de puissance avec surmoulage, dispositifs comportant un tel module de puissance et procede de fabrication d'un module de puissance avec surmoulage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP4129026A1 true EP4129026A1 (fr) | 2023-02-08 |
Family
ID=74045438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP21715263.6A Pending EP4129026A1 (fr) | 2020-03-30 | 2021-03-30 | Module de puissance avec surmoulage, dispositifs comportant un tel module de puissance et procede de fabrication d'un module de puissance avec surmoulage |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230128774A1 (fr) |
| EP (1) | EP4129026A1 (fr) |
| KR (1) | KR102943099B1 (fr) |
| CN (1) | CN115399081B (fr) |
| FR (1) | FR3108822B1 (fr) |
| WO (1) | WO2021198230A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022134657A1 (de) | 2022-12-22 | 2024-06-27 | Valeo Eautomotive Germany Gmbh | Leistungsmodul, elektrischer Leistungswandler und elektrischer Antrieb für ein Transportmittel |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2738772B2 (ja) * | 1990-04-05 | 1998-04-08 | ローム株式会社 | 面実装型電子部品 |
| JPH09199645A (ja) * | 1996-01-17 | 1997-07-31 | Mitsubishi Electric Corp | 半導体装置および半導体モジュール |
| JP4525734B2 (ja) * | 2007-11-02 | 2010-08-18 | セイコーエプソン株式会社 | 電子部品の実装構造 |
| JP4766162B2 (ja) * | 2009-08-06 | 2011-09-07 | オムロン株式会社 | パワーモジュール |
| JP5452210B2 (ja) * | 2009-12-21 | 2014-03-26 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
| FR2967846B1 (fr) * | 2010-11-23 | 2012-11-30 | Valeo Equip Electr Moteur | Procede d'interconnexion de modules electroniques de puissance d'une machine electrique tournante et assemblage de modules de puissance interconnectes obtenu par ce procede |
| US8197264B1 (en) * | 2011-03-02 | 2012-06-12 | Lear Corporation | Electrical connector |
| JP5344012B2 (ja) * | 2011-09-02 | 2013-11-20 | 株式会社デンソー | 電力変換装置 |
| US8877564B2 (en) * | 2012-06-29 | 2014-11-04 | Intersil Americas LLC | Solder flow impeding feature on a lead frame |
| US10429055B2 (en) * | 2014-04-04 | 2019-10-01 | Lg Innotek Co., Ltd. | Lighting module and lighting apparatus including same |
| EP3283160B1 (fr) * | 2015-04-17 | 2023-09-13 | Meissner Filtration Products, Inc. | Procede modulaire de moulage |
| FR3044859B1 (fr) * | 2015-12-02 | 2018-11-16 | Valeo Systemes De Controle Moteur | Module electronique de puissance, architecture electronique le comprenant, convertisseur de tension et machine electrique le comprenant |
| FR3059202B1 (fr) * | 2016-11-18 | 2019-08-16 | Continental Automotive France | Procede de fabrication sur une plaque de maintien d'un module electronique avec des formes de positionnement depassant du surmoulage final |
| FR3068564B1 (fr) | 2017-06-28 | 2020-11-27 | Valeo Equip Electr Moteur | Module de puissance d'un convertisseur de tension et procede de fabrication d'un tel module de puissance |
| JP7137955B2 (ja) * | 2018-04-05 | 2022-09-15 | ローム株式会社 | 半導体装置 |
| FR3082369B1 (fr) * | 2018-06-08 | 2021-02-19 | Valeo Equip Electr Moteur | Circuit electrique, bras de commutation et convertisseur de tension |
| FR3082306B1 (fr) * | 2018-06-08 | 2020-09-18 | Valeo Equip Electr Moteur | Systeme de mesure d'une temperature d'un composant electrique et bras de commutation comportant un tel systeme |
| EP3584833B1 (fr) * | 2018-06-19 | 2021-09-01 | Mitsubishi Electric R&D Centre Europe B.V. | Module de puissance à alignement amélioré |
| JP7338204B2 (ja) * | 2019-04-01 | 2023-09-05 | 富士電機株式会社 | 半導体装置 |
| JP7304830B2 (ja) * | 2020-02-12 | 2023-07-07 | 三菱電機株式会社 | トランスファーモールド型パワーモジュール、リードフレーム、およびトランスファーモールド型パワーモジュールの製造方法 |
-
2020
- 2020-03-30 FR FR2003115A patent/FR3108822B1/fr active Active
-
2021
- 2021-03-30 US US17/995,064 patent/US20230128774A1/en active Pending
- 2021-03-30 KR KR1020227037039A patent/KR102943099B1/ko active Active
- 2021-03-30 EP EP21715263.6A patent/EP4129026A1/fr active Pending
- 2021-03-30 CN CN202180026517.6A patent/CN115399081B/zh active Active
- 2021-03-30 WO PCT/EP2021/058252 patent/WO2021198230A1/fr not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US20230128774A1 (en) | 2023-04-27 |
| FR3108822A1 (fr) | 2021-10-01 |
| KR102943099B1 (ko) | 2026-03-23 |
| KR20220160618A (ko) | 2022-12-06 |
| WO2021198230A1 (fr) | 2021-10-07 |
| CN115399081A (zh) | 2022-11-25 |
| FR3108822B1 (fr) | 2023-11-03 |
| CN115399081B (zh) | 2026-01-30 |
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