FR3108822B1 - Module de puissance avec surmoulage, dispositifs comportant un tel module de puissance et procede de fabrication d’un module de puissance avec surmoulage - Google Patents

Module de puissance avec surmoulage, dispositifs comportant un tel module de puissance et procede de fabrication d’un module de puissance avec surmoulage Download PDF

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Publication number
FR3108822B1
FR3108822B1 FR2003115A FR2003115A FR3108822B1 FR 3108822 B1 FR3108822 B1 FR 3108822B1 FR 2003115 A FR2003115 A FR 2003115A FR 2003115 A FR2003115 A FR 2003115A FR 3108822 B1 FR3108822 B1 FR 3108822B1
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France
Prior art keywords
overmolding
power module
electrical connection
main
electrical
Prior art date
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FR2003115A
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English (en)
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FR3108822A1 (fr
Inventor
Virginie Vercambre
Vasquez Yavier Alejandro Gomez
Lyes Haddad
Luc Demarez
Hicham Aytous
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Valeo Equipements Electriques Moteur SAS
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Valeo Equipements Electriques Moteur SAS
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Application filed by Valeo Equipements Electriques Moteur SAS filed Critical Valeo Equipements Electriques Moteur SAS
Priority to FR2003115A priority Critical patent/FR3108822B1/fr
Priority to KR1020227037039A priority patent/KR20220160618A/ko
Priority to PCT/EP2021/058252 priority patent/WO2021198230A1/fr
Priority to CN202180026517.6A priority patent/CN115399081A/zh
Priority to EP21715263.6A priority patent/EP4129026A1/fr
Priority to US17/995,064 priority patent/US20230128774A1/en
Publication of FR3108822A1 publication Critical patent/FR3108822A1/fr
Application granted granted Critical
Publication of FR3108822B1 publication Critical patent/FR3108822B1/fr
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
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    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73221—Strap and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/66—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output with possibility of reversal
    • H02M7/68—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output with possibility of reversal by static converters
    • H02M7/72—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output with possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/79—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output with possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/797—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output with possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Inverter Devices (AREA)
  • Power Conversion In General (AREA)

Abstract

Le module de puissance comporte : - des pièces de connexion électrique, de préférence en métal, présentant chacune une plaque principale, les plaques principales s’étendant selon un même plan principal de manière à être sensiblement coplanaires, au moins une des pièces de connexion électrique comprenant au moins un connecteur électrique se projetant depuis sa plaque principale ; - au moins un transistor connecté électriquement entre deux faces supérieures de respectivement deux des plaques principales ; et - un surmoulage isolant électrique (402), par exemple en résine, recouvrant chaque transistor et au moins une partie des faces supérieures des plaques principales. Au moins une des pièces de connexion électrique présente en outre au moins un tenon d’accroche (322) au surmoulage (402), distinct du ou des connecteurs électriques de cette pièce de connexion électrique si cette dernière en comprend, chaque tenon d’accroche (322) se projetant uniquement selon une direction de projection (DP) dans le plan principal, depuis une tranche de la plaque principale de cette pièce de connexion électrique, et le surmoulage (402) recouvre au moins partiellement le tenon d’accroche (322). Figure pour l’abrégé : Fig. 8
FR2003115A 2020-03-30 2020-03-30 Module de puissance avec surmoulage, dispositifs comportant un tel module de puissance et procede de fabrication d’un module de puissance avec surmoulage Active FR3108822B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR2003115A FR3108822B1 (fr) 2020-03-30 2020-03-30 Module de puissance avec surmoulage, dispositifs comportant un tel module de puissance et procede de fabrication d’un module de puissance avec surmoulage
KR1020227037039A KR20220160618A (ko) 2020-03-30 2021-03-30 오버몰딩이 있는 전원 모듈, 이러한 전원 모듈을 포함하는 장치, 및 오버몰딩이 있는 전원 모듈을 제조하는 방법
PCT/EP2021/058252 WO2021198230A1 (fr) 2020-03-30 2021-03-30 Module de puissance avec surmoulage, dispositifs comportant un tel module de puissance et procede de fabrication d'un module de puissance avec surmoulage
CN202180026517.6A CN115399081A (zh) 2020-03-30 2021-03-30 具有包覆模制件的功率模块、包括这种功率模块的装置以及用于制造具有包覆模制件的功率模块的方法
EP21715263.6A EP4129026A1 (fr) 2020-03-30 2021-03-30 Module de puissance avec surmoulage, dispositifs comportant un tel module de puissance et procede de fabrication d'un module de puissance avec surmoulage
US17/995,064 US20230128774A1 (en) 2020-03-30 2021-03-30 Power module with overmoulding, devices comprising such a power module and method for manufacturing a power module with overmoulding

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2003115 2020-03-30
FR2003115A FR3108822B1 (fr) 2020-03-30 2020-03-30 Module de puissance avec surmoulage, dispositifs comportant un tel module de puissance et procede de fabrication d’un module de puissance avec surmoulage

Publications (2)

Publication Number Publication Date
FR3108822A1 FR3108822A1 (fr) 2021-10-01
FR3108822B1 true FR3108822B1 (fr) 2023-11-03

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FR2003115A Active FR3108822B1 (fr) 2020-03-30 2020-03-30 Module de puissance avec surmoulage, dispositifs comportant un tel module de puissance et procede de fabrication d’un module de puissance avec surmoulage

Country Status (6)

Country Link
US (1) US20230128774A1 (fr)
EP (1) EP4129026A1 (fr)
KR (1) KR20220160618A (fr)
CN (1) CN115399081A (fr)
FR (1) FR3108822B1 (fr)
WO (1) WO2021198230A1 (fr)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3068564B1 (fr) 2017-06-28 2020-11-27 Valeo Equip Electr Moteur Module de puissance d'un convertisseur de tension et procede de fabrication d'un tel module de puissance
FR3082369B1 (fr) * 2018-06-08 2021-02-19 Valeo Equip Electr Moteur Circuit electrique, bras de commutation et convertisseur de tension
FR3082306B1 (fr) * 2018-06-08 2020-09-18 Valeo Equip Electr Moteur Systeme de mesure d'une temperature d'un composant electrique et bras de commutation comportant un tel systeme

Also Published As

Publication number Publication date
KR20220160618A (ko) 2022-12-06
EP4129026A1 (fr) 2023-02-08
WO2021198230A1 (fr) 2021-10-07
US20230128774A1 (en) 2023-04-27
FR3108822A1 (fr) 2021-10-01
CN115399081A (zh) 2022-11-25

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