EP3955060A4 - Composition de masque dur très épais en carbone déposé par centrifugation et procédé de formation de motifs l'utilisant - Google Patents
Composition de masque dur très épais en carbone déposé par centrifugation et procédé de formation de motifs l'utilisant Download PDFInfo
- Publication number
- EP3955060A4 EP3955060A4 EP20788271.3A EP20788271A EP3955060A4 EP 3955060 A4 EP3955060 A4 EP 3955060A4 EP 20788271 A EP20788271 A EP 20788271A EP 3955060 A4 EP3955060 A4 EP 3955060A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- same
- hard mask
- patterning method
- mask composition
- carbon hard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02115—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material being carbon, e.g. alpha-C, diamond or hydrogen doped carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/40—Polymerisation processes
- C08G2261/42—Non-organometallic coupling reactions, e.g. Gilch-type or Wessling-Zimmermann type
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190041402A KR102240213B1 (ko) | 2019-04-09 | 2019-04-09 | 고두께 스핀 온 카본 하드마스크 조성물 및 이를 이용한 패턴화 방법 |
PCT/KR2020/004041 WO2020209527A1 (fr) | 2019-04-09 | 2020-03-25 | Composition de masque dur très épais en carbone déposé par centrifugation et procédé de formation de motifs l'utilisant |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3955060A1 EP3955060A1 (fr) | 2022-02-16 |
EP3955060A4 true EP3955060A4 (fr) | 2023-06-07 |
Family
ID=72751914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20788271.3A Pending EP3955060A4 (fr) | 2019-04-09 | 2020-03-25 | Composition de masque dur très épais en carbone déposé par centrifugation et procédé de formation de motifs l'utilisant |
Country Status (7)
Country | Link |
---|---|
US (1) | US20220179318A1 (fr) |
EP (1) | EP3955060A4 (fr) |
JP (1) | JP7267451B2 (fr) |
KR (1) | KR102240213B1 (fr) |
CN (1) | CN113661445A (fr) |
TW (1) | TWI749496B (fr) |
WO (1) | WO2020209527A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102350590B1 (ko) * | 2021-05-17 | 2022-01-12 | 영창케미칼 주식회사 | 증발감량이 적은 스핀 온 카본 하드마스크 조성물 및 이를 이용한 패턴화 방법 |
KR20230036480A (ko) * | 2021-09-07 | 2023-03-14 | 삼성에스디아이 주식회사 | 하드마스크 조성물, 하드마스크 층 및 패턴 형성 방법 |
KR102479017B1 (ko) | 2022-04-06 | 2022-12-19 | 영창케미칼 주식회사 | 고평탄화 성능을 지닌 스핀 온 카본 하드마스크 조성물 및 이를 이용한 패턴화 방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090176165A1 (en) * | 2007-12-24 | 2009-07-09 | Cheon Hwan Sung | Polymer composition, hardmask composition having antireflective properties, and associated methods |
US20120168894A1 (en) * | 2010-12-30 | 2012-07-05 | Min-Soo Kim | Hard mask composition, method of forming a pattern, and semiconductor integrated circuit device including the pattern |
US20160355699A1 (en) * | 2015-06-02 | 2016-12-08 | Samsung Sdi Co., Ltd. | Organic layer composition and method of forming patterns |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5118191B2 (ja) * | 2007-04-02 | 2013-01-16 | チェイル インダストリーズ インコーポレイテッド | 反射防止性を有するハードマスク組成物及びこれを利用した材料のパターン形成方法 |
KR100908601B1 (ko) * | 2007-06-05 | 2009-07-21 | 제일모직주식회사 | 반사방지 하드마스크 조성물 및 이를 이용한 기판상 재료의패턴화 방법 |
KR20160087101A (ko) * | 2015-01-13 | 2016-07-21 | 최상준 | 새로운 반사방지용 하드마스크 조성물 |
US20170137663A9 (en) * | 2015-03-03 | 2017-05-18 | Jsr Corporation | Composition for resist underlayer film formation, resist underlayer film, and production method of patterned substrate |
JP6394481B2 (ja) * | 2015-04-28 | 2018-09-26 | 信越化学工業株式会社 | レジスト組成物及びパターン形成方法 |
KR101852460B1 (ko) * | 2015-12-16 | 2018-04-26 | 삼성에스디아이 주식회사 | 중합체, 유기막 조성물, 및 패턴형성방법 |
JP6589795B2 (ja) * | 2016-09-27 | 2019-10-16 | 信越化学工業株式会社 | スルホニウム塩、レジスト組成物及びパターン形成方法 |
KR101777687B1 (ko) * | 2016-10-13 | 2017-09-12 | 영창케미칼 주식회사 | 고내에치성 스핀 온 카본 하드마스크 조성물 및 이를 이용한 패턴화 방법 |
KR101910450B1 (ko) * | 2017-03-21 | 2019-01-04 | 동우 화인켐 주식회사 | 하드마스크용 조성물 |
US11650503B2 (en) * | 2018-08-02 | 2023-05-16 | Tokyo Ohka Kogyo Co., Ltd. | Hard mask-forming composition and method for manufacturing electronic component |
CN109188866A (zh) * | 2018-08-16 | 2019-01-11 | 韩国高智株式会社 | 一种用于抗反射有机硬掩模的组合物 |
-
2019
- 2019-04-09 KR KR1020190041402A patent/KR102240213B1/ko active IP Right Grant
-
2020
- 2020-03-25 WO PCT/KR2020/004041 patent/WO2020209527A1/fr unknown
- 2020-03-25 JP JP2021556356A patent/JP7267451B2/ja active Active
- 2020-03-25 CN CN202080026081.6A patent/CN113661445A/zh active Pending
- 2020-03-25 EP EP20788271.3A patent/EP3955060A4/fr active Pending
- 2020-03-25 US US17/442,908 patent/US20220179318A1/en active Pending
- 2020-03-26 TW TW109110330A patent/TWI749496B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090176165A1 (en) * | 2007-12-24 | 2009-07-09 | Cheon Hwan Sung | Polymer composition, hardmask composition having antireflective properties, and associated methods |
US20120168894A1 (en) * | 2010-12-30 | 2012-07-05 | Min-Soo Kim | Hard mask composition, method of forming a pattern, and semiconductor integrated circuit device including the pattern |
US20160355699A1 (en) * | 2015-06-02 | 2016-12-08 | Samsung Sdi Co., Ltd. | Organic layer composition and method of forming patterns |
Non-Patent Citations (1)
Title |
---|
See also references of WO2020209527A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP3955060A1 (fr) | 2022-02-16 |
US20220179318A1 (en) | 2022-06-09 |
CN113661445A (zh) | 2021-11-16 |
KR20200119053A (ko) | 2020-10-19 |
WO2020209527A1 (fr) | 2020-10-15 |
JP7267451B2 (ja) | 2023-05-01 |
KR102240213B1 (ko) | 2021-04-14 |
JP2022525533A (ja) | 2022-05-17 |
TW202037690A (zh) | 2020-10-16 |
TWI749496B (zh) | 2021-12-11 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: G03F 7/09 20060101ALI20230502BHEP Ipc: H01L 21/31 20060101ALI20230502BHEP Ipc: C08G 61/02 20060101ALI20230502BHEP Ipc: C08L 65/00 20060101AFI20230502BHEP |