EP3950981A4 - Matériau de cuivre et élément de dissipation de chaleur - Google Patents
Matériau de cuivre et élément de dissipation de chaleur Download PDFInfo
- Publication number
- EP3950981A4 EP3950981A4 EP20783133.0A EP20783133A EP3950981A4 EP 3950981 A4 EP3950981 A4 EP 3950981A4 EP 20783133 A EP20783133 A EP 20783133A EP 3950981 A4 EP3950981 A4 EP 3950981A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat
- copper material
- dissipating member
- dissipating
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019068349 | 2019-03-29 | ||
PCT/JP2020/010018 WO2020203071A1 (fr) | 2019-03-29 | 2020-03-09 | Matériau de cuivre et élément de dissipation de chaleur |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3950981A1 EP3950981A1 (fr) | 2022-02-09 |
EP3950981A4 true EP3950981A4 (fr) | 2023-04-26 |
Family
ID=72668260
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20783133.0A Pending EP3950981A4 (fr) | 2019-03-29 | 2020-03-09 | Matériau de cuivre et élément de dissipation de chaleur |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3950981A4 (fr) |
JP (1) | JP7248104B2 (fr) |
CN (1) | CN113631742A (fr) |
WO (1) | WO2020203071A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7491960B2 (ja) | 2021-04-19 | 2024-05-28 | 株式会社Kmct | 耐食性銅合金、銅合金管および熱交換器 |
WO2022224940A1 (fr) * | 2021-04-19 | 2022-10-27 | 株式会社 Kmct | Alliage de cuivre résistant à la corrosion, tuyau en alliage de cuivre et échangeur de chaleur |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080223728A1 (en) * | 2004-01-29 | 2008-09-18 | Nippon Mining & Metals Co., Ltd. | Ultrahigh-Purity Copper and Process for Producing the Same |
EP3243916A1 (fr) * | 2015-01-07 | 2017-11-15 | Mitsubishi Materials Corporation | Fil supraconducteur et bobine supraconductrice |
EP3441486A1 (fr) * | 2016-04-06 | 2019-02-13 | Mitsubishi Materials Corporation | Fil supraconducteur, et bobine supraconductrice |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH062058A (ja) | 1992-06-23 | 1994-01-11 | Furukawa Electric Co Ltd:The | 結晶粒成長抑制無酸素銅 |
JP3856581B2 (ja) | 1999-01-18 | 2006-12-13 | 日鉱金属株式会社 | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
JP6202718B2 (ja) * | 2013-03-26 | 2017-09-27 | 三菱マテリアル株式会社 | 放熱基板 |
JP6668899B2 (ja) * | 2016-04-06 | 2020-03-18 | 三菱マテリアル株式会社 | 超伝導安定化材、超伝導線及び超伝導コイル |
JP6939367B2 (ja) | 2017-10-04 | 2021-09-22 | 株式会社リコー | 情報処理システム、情報処理装置、情報処理方法及び情報処理プログラム |
-
2020
- 2020-03-09 CN CN202080024700.8A patent/CN113631742A/zh active Pending
- 2020-03-09 WO PCT/JP2020/010018 patent/WO2020203071A1/fr unknown
- 2020-03-09 EP EP20783133.0A patent/EP3950981A4/fr active Pending
- 2020-03-09 JP JP2021511309A patent/JP7248104B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080223728A1 (en) * | 2004-01-29 | 2008-09-18 | Nippon Mining & Metals Co., Ltd. | Ultrahigh-Purity Copper and Process for Producing the Same |
EP3243916A1 (fr) * | 2015-01-07 | 2017-11-15 | Mitsubishi Materials Corporation | Fil supraconducteur et bobine supraconductrice |
EP3441486A1 (fr) * | 2016-04-06 | 2019-02-13 | Mitsubishi Materials Corporation | Fil supraconducteur, et bobine supraconductrice |
Non-Patent Citations (1)
Title |
---|
See also references of WO2020203071A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP3950981A1 (fr) | 2022-02-09 |
TW202104604A (zh) | 2021-02-01 |
CN113631742A (zh) | 2021-11-09 |
JP7248104B2 (ja) | 2023-03-29 |
WO2020203071A1 (fr) | 2020-10-08 |
JPWO2020203071A1 (fr) | 2020-10-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20210930 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20230324 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C22F 1/08 20060101ALI20230320BHEP Ipc: C22F 1/00 20060101ALI20230320BHEP Ipc: C22C 9/00 20060101AFI20230320BHEP |