EP3948203A1 - Procédé pour la fabrication d'un dispositif capteur et composant et/ou composant de châssis comprenant un tel dispositif capteur - Google Patents

Procédé pour la fabrication d'un dispositif capteur et composant et/ou composant de châssis comprenant un tel dispositif capteur

Info

Publication number
EP3948203A1
EP3948203A1 EP20707218.2A EP20707218A EP3948203A1 EP 3948203 A1 EP3948203 A1 EP 3948203A1 EP 20707218 A EP20707218 A EP 20707218A EP 3948203 A1 EP3948203 A1 EP 3948203A1
Authority
EP
European Patent Office
Prior art keywords
component
sensor layer
blind hole
recess
carrier material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20707218.2A
Other languages
German (de)
English (en)
Inventor
Michael Klank
Thomas Koehne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF Friedrichshafen AG
Original Assignee
ZF Friedrichshafen AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZF Friedrichshafen AG filed Critical ZF Friedrichshafen AG
Publication of EP3948203A1 publication Critical patent/EP3948203A1/fr
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0004—Force transducers adapted for mounting in a bore of the force receiving structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M13/00—Testing of machine parts
    • G01M13/04—Bearings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0041—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by determining deflection or stress
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0083—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by measuring variation of impedance, e.g. resistance, capacitance, induction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors

Definitions

  • the invention relates to a method for producing a sensor device for measuring a momentary load on a component, in which the component is made of a plastic, in which a sensor layer is arranged on the component, the sensor layer having a carrier material and electrically conductive particles embedded therein . Furthermore, the invention relates to a component and / or chassis component which is produced according to such a method.
  • the disadvantage here is that it is difficult to measure loads, in particular forces, within the component, for example a ball joint, by means of such a sensor device. Even if the sensor layer were not attached to the outside of the component, but to an inside between two component components, the loads here would often be so great that the, especially thin, sensor layers would be damaged. In particular, the loads between a ball socket and a joint ball or between a joint housing and the ball socket are so great that a sensor layer attached here would be quickly damaged.
  • the object on which the invention is based is to further develop a method, a component and / or a chassis component of the type mentioned at the outset in such a way that loads and / or forces in a component can be better and / or more reliably measured or determined.
  • an alternative embodiment is to be provided.
  • the object on which the invention is based is achieved with a method according to claim 1 and by means of a component and / or chassis component according to claim 10.
  • Preferred developments of the invention can be found in the subclaims and in the following description.
  • the invention thus relates to a method for producing a sensor device for measuring a momentary load on a component.
  • measuring a momentary load on the component is to be understood as measuring, determining and / or determining a force or force component acting on the component and / or in the component.
  • the sensor device can thus be designed to measure a force or force component currently acting on the component.
  • the load on the component can be a deformation of the component.
  • the momentary load on the component can be an elastic or plastic deformation of the component.
  • the blind hole-like depression is at least partially filled with the carrier material formed as a liquid with the embedded, electrically conductive particles.
  • a liquid carrier material with the electrically conductive particles can be arranged particularly easily in the blind hole-like depression.
  • the blind hole-like depression can be filled and / or filled up at least partially with the liquid carrier material and the embedded, electrically conductive particles under the action of gravity and / or a capillary action.
  • the blind hole-like depression can have a diameter of a few millimeters.
  • the diameter of the sack hole-like depression is preferably smaller than 3 mm, smaller than 2 mm or smaller than 1 mm.
  • a lacquer is used as the liquid carrier material.
  • the electrically conductive particles are preferably designed as carbon nanotubes or so-called carbon nanotubes (CNT).
  • CNT carbon nanotubes
  • the electrically conductive particles are isotropically aligned and / or distributed within the carrier material.
  • the electrically conductive particles are preferably designed as force-sensitive elements.
  • the carbon nanotubes are microscopic tubular structures made of carbon. Carbon nanotubes are electrically conductive and also have the property that they change their electrical resistance when subjected to mechanical stress, for example when they are stretched or compressed as a result of a force. This effect can be used to use carbon nanotubes as force-sensitive elements.
  • force-sensitive elements can be designed as graphene, graphene oxide, carbon black or nanowires.
  • the carrier material with the embedded, electrically conductive particles hardens after the at least partial filling and / or filling of the blind hole-like depression.
  • the carrier material is cured.
  • the hardening of the carrier material can thus be actively initiated or promoted by means of suitable measures. For example, local heating can promote or accelerate the hardening of the carrier material.
  • the carrier material After the carrier material has hardened, it is held together with the electrically conductive particles reliably and / or permanently within the blind hole-like depression.
  • the sensor layer is formed in the blind hole-like recess.
  • At least two electrical line sections for providing contact points for the sensor layer are embedded in the component.
  • the line sections are partially encapsulated and / or overmolded by the plastic of the component when producing the construction.
  • the line sections are protected from external influences and are permanently arranged due to the incorporation and / or integration into the component.
  • the contact points themselves are not covered with the plastic of the component.
  • the line sections and the contact points are arranged such that the contact points are accessible through the blind hole-like recess for the sensor layer.
  • the contact points are preferably arranged in an inner peripheral surface of the blind hole-like recess. Alternatively, the contact points protrude into the blind hole-like recess.
  • the contact points with the sensor layer provided by means of the two electrical line sections are preferably connected to one another in an electrically conductive manner. This creates an electrically conductive connection between the contact points achieved by or by means of the sensor layer, which is arranged in the blind hole-like recess.
  • the line sections can be designed as stamped grids or wires. This enables inexpensive production and / or simple arrangement in the component, in particular in the injection molding tool for producing the component.
  • the contact points are arranged at a distance from one another in the longitudinal direction of the pocket-like recess.
  • the blind hole-like depression is filled and / or filled with the liquid carrier material with the embedded, electrically conductive particles at least until the contact points contact the carrier material and / or the embedded, electrically conductive particles.
  • a first contact point is preferably arranged adjacent to a bottom of the blind hole-like recess.
  • a second contact point can be arranged adjacent to an opening in the blind hole-like recess.
  • the first contact point can be assigned to a first line section and the second contact point to a second line section.
  • the carrier material itself can be designed to be electrically conductive.
  • the measurement, determination and / or determination of the acting load is independent of the amount of the filled carrier material for forming the sensor layer as long as both contact points are connected to one another in an electrically conductive manner by means of the sensor layer.
  • the extent to which the sensor layer extends beyond the contact point assigned to the opening in the direction of the opening, on the other hand, is irrelevant for the functioning of the sensor device.
  • the sensor device is connected to an evaluation device.
  • the evaluation device can determine and / or determine the instantaneous load on the component from electrical resistance measurements on the sensor layer.
  • at least one force and / or force component acting on the component can be determined and / or ascertained.
  • a shear, pressure or tensile load on the component can be determined.
  • a tensile force acting on the component can be determined from a measured, determined and / or determined expansion of the sensor layer.
  • One on the construction Partly acting compressive force can be determined from a measured, determined and / or determined compression of the sensor layer.
  • a plurality of blind hole-like depressions for receiving one sensor layer each are arranged and / or formed in the component.
  • a sensor device with several sensor layers can thus be implemented.
  • the multiple ren blind hole-like depressions and / or multiple sensor layers can be arranged in a suitable manner in relation to one another in the component so that the load on the component, in particular one or more force acting on the component, is shifted by means of the evaluation device, taking into account the measurement on multiple sensor layers Force components, can be determined in more detail. For example, a bending force and / or torsion acting on the component can be determined.
  • the sensor device is preferably designed, in particular by means of a plurality of sensor layers, in order to determine forces currently acting on the component in a location-dependent and / or direction-dependent manner.
  • the component is designed as a chassis component for a vehicle, in particular a motor vehicle.
  • the component can be implemented as a ball socket and / or a joint housing for a ball joint.
  • a ball joint can be, for example, a ball sleeve joint or a ball and socket joint.
  • the blind hole-like recess with the sensor layer can be arranged in the ball socket and / or in the joint housing. Forces acting in the ball joint can be determined by means of such a sensor device.
  • several blind hole-like depressions, each with a sensor layer are distributed around a joint ball in the ball socket and / or in the joint housing.
  • a component and / or chassis component which is manufactured according to the method according to the invention is particularly advantageous, the sensor layer being received in the at least one sack-hole-like depression.
  • the sensor layer in the blind hole-like recess is protected from external influences and / or increased wear.
  • the component and / or chassis component produced according to the method according to the invention is a component and / or chassis component described above.
  • the method is preferably developed in accordance with all of the configurations explained in connection with the component according to the invention and / or chassis component described here.
  • the component and / or chassis component described here can be further developed in accordance with all the configurations explained in connection with the method.
  • FIG. 1 shows a sectional schematic side view of a component according to the invention
  • Fig. 2 is a sectional schematic side view of a chassis component according to the invention Shen.
  • FIG. 1 shows a sectional schematic side view of a component 1 according to the invention.
  • the component 1 is made from a plastic.
  • the component 1 has a sensor device 2.
  • the sensor device 2 has a sensor layer 3.
  • the sensor layer 3 is formed by means of a carrier material and electrically conductive particles embedded therein, which are not shown in detail here. With this execution, the electrically conductive particles are designed as carbon nanotubes.
  • the component 1 has a recess 4 similar to a blind hole.
  • the blind hole-like recess 4 extends into the component 1 like a shaft.
  • the sensor layer 3 is arranged within the blind hole-like recess 4. In this game,sbei the blind hole-like recess 4 is only partially filled or filled by means of the sensor layer 3. Alternatively, the blind hole-like depression 4 can also be completely filled or filled up by means of the sensor layer 3.
  • the sensor device 2 has two electrical line sections 5, 6.
  • the electrical line sections 5, 6 are essentially embedded in the component 1.
  • the electrical line sections 5, 6 provide contact points 7, 8 for the sensor layer 3.
  • the two contact points 7, 8 are connected to the sensor layer 3 in an electrically conductive manner.
  • the electrical line sections 5, 6 can be designed as a lead frame.
  • a first contact point 7 of the, in particular the first, electrical line section 5 is arranged adjacent to a bottom 9 of the blind hole-like recess 4 on an inner circumferential surface 10 of the blind hole-like recess 4.
  • a second contact point 8 of the, in particular the second, electrical line section 6 is arranged adjacent to an opening 11 of the blind hole-like recess 4 on the inner circumferential surface 10.
  • the ends of the electrical line sections 5, 6 facing away from the contact points 7, 8 are connected to an evaluation device 12.
  • the electrical line sections 5, 6, for example in the form of a stamped grid, are first arranged in an injection molding tool not shown here.
  • the component 1 is then produced from a plastic.
  • the line sections 5, 6 are partially encapsulated by the plastic of the component 1 or injected around.
  • the blind hole-like recess 4 can be realized at the same time.
  • the blind hole-like recess 4 can be made after the manufacture of the component 1 by means of a bore. Subsequently, the blind hole-like recess 4 is partially or completely filled or filled with a liquid carrier material with the embedded, electrically conductive particles.
  • blind hole-like recess 4 It is essential here that enough carrier material is filled into the blind hole-like recess 4 so that the carrier material contacts both the contact point 7 and the contact point 8 of the two electrical line sections 5, 6.
  • the extent to which the blind hole-like depression 4 is also filled is not relevant for the function of the sensor device 2.
  • the liquid carrier material is designed as a lacquer with embedded, electrically conductive particles.
  • the carrier material can be filled under the action of gravity and / or a capillary action through the opening 11 into the blind hole-like recess 4. The carrier material then hardens to form the sensor layer 3 and / or is actively hardened.
  • the ends of the line sections 5, 6 facing away from the contact points 7, 8 are connected to the evaluation device 12. From electrical resistance measurements on the sensor layer 3, an instantaneous load and / or force acting on the component 1 can be determined by means of the evaluation device 12.
  • a load or force which is indicated as indicated by arrow 13
  • the sensor layer 3 is stretched or stretched as indicated by arrow 14. This also leads to an expansion or stretching of the electrically conductive particles, which results in a change in the resistance of the sensor layer 3.
  • the sensor layer 3 contracts again. This shortens the electrically conductive particles in the sensor layer 3, which in turn causes a change in the electrical resistance of the sensor layer 3.
  • FIG. 2 shows a sectional schematic side view of a chassis component 15 according to the invention. is interpreted.
  • the ball joint 16 has a joint ball 17, the Lich joint movement in the ball socket 15 is received or stored.
  • the spherical shell 15 has a sensor device 2, which is designed essentially as shown in FIG. In this respect, reference is also made to the preceding description.
  • the spherical shell 15 can have several blind hole-like depressions 4, each of which has a sensor layer 3.
  • the plurality of blind hole-like depressions 4 or sensor layers 3 can be arranged in a uniformly distributed manner around the joint ball 17.
  • two or more of the blind hole-like depressions 4 or sensor layers 3 can be aligned transversely or at right angles to one another with regard to their respective longitudinal alignment. In this way, an improved location-dependent and / or direction-dependent determination of the loads and / or forces acting can be achieved.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

L'invention concerne un procédé pour la fabrication d'un dispositif capteur (2) pour la mesure d'une charge momentanée d'un composant (1, 15), dans lequel le composant (1, 15) est fabriqué en une matière plastique, dans lequel une couche à capteur (3) est disposée sur le composant (1, 15), la couche à capteur (3) présentant un matériau de support et des particules électriquement conductrices intégrée dans celui-ci. Pour pouvoir mesurer ou déterminer de façon améliorée et/ou plus fiable les charges et/ou forces dans le composant (1, 15), le procédé est caractérisé en ce qu'au moins une cavité (4) de type trou borgne pour la réception de la couche à capteur (3) est formée dans le composant (1, 15).
EP20707218.2A 2019-03-26 2020-02-21 Procédé pour la fabrication d'un dispositif capteur et composant et/ou composant de châssis comprenant un tel dispositif capteur Pending EP3948203A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019204178.7A DE102019204178B4 (de) 2019-03-26 2019-03-26 Verfahren zum Herstellen einer Sensoreinrichtung und Bauteil und/oder Fahrwerksbauteil mit einer solchen Sensoreinrichtung
PCT/EP2020/054569 WO2020193024A1 (fr) 2019-03-26 2020-02-21 Procédé pour la fabrication d'un dispositif capteur et composant et/ou composant de châssis comprenant un tel dispositif capteur

Publications (1)

Publication Number Publication Date
EP3948203A1 true EP3948203A1 (fr) 2022-02-09

Family

ID=69701174

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20707218.2A Pending EP3948203A1 (fr) 2019-03-26 2020-02-21 Procédé pour la fabrication d'un dispositif capteur et composant et/ou composant de châssis comprenant un tel dispositif capteur

Country Status (6)

Country Link
US (1) US20220178774A1 (fr)
EP (1) EP3948203A1 (fr)
KR (1) KR20210143728A (fr)
CN (1) CN113677973A (fr)
DE (1) DE102019204178B4 (fr)
WO (1) WO2020193024A1 (fr)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3809957A1 (de) * 1988-03-24 1989-10-05 Felten & Guilleaume Energie Lichtwellenleiter-sensor fuer druckkraefte und seine verwendung
JP3613416B2 (ja) * 1995-10-02 2005-01-26 中部電力株式会社 導電性粉末含有成形体及び荷重検知方法
US6351205B1 (en) 1996-07-05 2002-02-26 Brad A. Armstrong Variable-conductance sensor
ITPV20030001A1 (it) 2003-01-31 2004-08-01 Ferdinando Auricchio Sensore dotato di capacita' portanti per il monitoraggio strutturale con lettura a distanza priva di collegamento diretto.
DE102005030971B4 (de) 2005-06-30 2016-01-21 Zf Friedrichshafen Ag Kugelgelenk mit Sensoreinrichtung, Verfahren zur Belastungsmessung und Verfahren zur Verschleißmessung
DE102008037572A1 (de) * 2008-01-29 2009-08-06 Werner Turck Gmbh & Co. Kg Kraftsensor
EP2381233B1 (fr) * 2009-11-24 2016-11-16 Sumitomo Riko Company Limited Capteur de courbure et procédé de mesure d'une forme déformée
CN102980926B (zh) * 2012-11-28 2015-04-29 清华大学 一种柔性双面全固态离子浓度检测传感器的制备方法
DE102013222151A1 (de) * 2013-10-31 2015-04-30 Schaeffler Technologies Gmbh & Co. Kg Vorrichtung zur Kraftmessung im Wälzlager mittels Sensorschicht
DE102016202769B4 (de) * 2016-02-23 2022-09-15 Technische Universität Dresden Sensor zur integralen oder ortsaufgelösten Messung von Dehnungen basierend auf vorgeschädigten Kohlefasern
DE102016204557A1 (de) 2016-03-18 2017-09-21 Zf Friedrichshafen Ag Sensoreinrichtung, Messeinrichtung, Kraftfahrzeug und Verfahren zum Erfassen einer momentanen Verformung eines Bauteils

Also Published As

Publication number Publication date
US20220178774A1 (en) 2022-06-09
DE102019204178A1 (de) 2020-10-01
CN113677973A (zh) 2021-11-19
DE102019204178B4 (de) 2022-08-04
KR20210143728A (ko) 2021-11-29
WO2020193024A1 (fr) 2020-10-01

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