EP3897074A1 - Module de chauffage à ondes à haute fréquence - Google Patents

Module de chauffage à ondes à haute fréquence Download PDF

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Publication number
EP3897074A1
EP3897074A1 EP21162227.9A EP21162227A EP3897074A1 EP 3897074 A1 EP3897074 A1 EP 3897074A1 EP 21162227 A EP21162227 A EP 21162227A EP 3897074 A1 EP3897074 A1 EP 3897074A1
Authority
EP
European Patent Office
Prior art keywords
frequency wave
frequency
heating module
circuit board
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21162227.9A
Other languages
German (de)
English (en)
Inventor
Oliver Büse
André Kersting
Werner Klausfering
Thomas Wixforth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miele und Cie KG
Original Assignee
Miele und Cie KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miele und Cie KG filed Critical Miele und Cie KG
Publication of EP3897074A1 publication Critical patent/EP3897074A1/fr
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/66—Circuits
    • H05B6/662—Aspects related to the boost transformer of the microwave heating apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/642—Cooling of the microwave components and related air circulation systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/66—Circuits
    • H05B6/68—Circuits for monitoring or control
    • H05B6/686—Circuits comprising a signal generator and power amplifier, e.g. using solid state oscillators

Definitions

  • the invention relates to a high-frequency wave heating module according to the preamble of claim 1 and a high-frequency wave household appliance with such a high-frequency wave heating module according to claim 12.
  • High-frequency waves are understood to mean electromagnetic waves with a frequency of approx. 1 to approx. 300 GHz, i.e. with wavelengths of approx. 30 cm to approx. 1 mm.
  • High-frequency waves can cause molecules to vibrate and thereby increase the temperature of the molecules. This is used, for example, with high-frequency wave ovens in order to heat, cook or cook food within the cooking space.
  • a high-frequency wave oven also called a high-frequency wave oven, usually has an outer housing, inside of which a cooking space is provided.
  • the cooking space is accessible from the outside through an access opening which can be pivotably closed and opened by means of a door or a flap.
  • display and control elements are usually also provided in order, for example, to be able to set the performance and duration of the process by a user.
  • At least one high-frequency wave heating module is usually arranged between the outer housing and the cooking space, which module can generate the high-frequency waves and guide them into the cooking space as a cavity through at least one corresponding high-frequency waveguide.
  • magnetrons instead of generating powerful RF waves using magnetrons as is customary, they can also be generated using transistors.
  • the DE 10 2014 226 280 A1 describes a microwave generator for a microwave oven.
  • the microwave generator has a control board on which, among other things, a microcontroller for controlling the microwave generator is attached, and an amplifier board which contains a number of electrical components which are used to generate the microwave radiation.
  • a heat sink is arranged above the amplifier board, which is applied directly to the amplifier board and is directly connected to it, so that heat generated by components of the amplifier board can be dissipated by means of the heat sink.
  • the heat sink has cooling fins and a fan.
  • the microwave generator is closed at the bottom by a cover made of die-cast aluminum. The cover, together with the heat sink, forms a housing of the microwave generator, which makes it microwave-tight except for two laterally arranged antennas encloses. The microwave radiation is then guided laterally into the cooking chamber by the two antennas via an RF waveguide.
  • the microwave generator has at least a first channel and a second channel, the first channel having a first amplifier circuit and a first antenna connected to it for generating microwaves with a power up to a maximum of a first partial power, and the second channel having a second amplifier circuit and a has connected to it a second antenna for generating microwaves with a power up to a maximum of a second partial power and wherein a maximum total power of the microwave generator is composed of the partial powers of its channels.
  • the disadvantage here is that the microwave generator or the microwave oven is constructed in a comparatively complex manner and corresponding costs can be incurred during manufacture and / or assembly.
  • a coaxial line with appropriate coaxial connectors between the HF module (high frequency module) as a microwave generator and the treatment room of the microwave oven in order to conduct the HF energy (high frequency energy) to the interior.
  • the coaxial line can be formed together with an antenna, i.e. without any further plug-in connection, and attached to the wall of the interior space.
  • the antenna can e.g. B. be a monopole-like or an inverted-F-shaped antenna.
  • the HF energy can also be conducted into the interior via an HF hollow line (high frequency hollow line).
  • HF hollow line high frequency hollow line
  • Usual cross-sections of waveguides can be, for example, rectangular or oval.
  • the RF waves (high frequency waves) can run vertically on such waveguides and through a z. B. pass through rectangular or oval window of the wall of the interior and get into the interior.
  • the guidance of the HF waves by means of at least one additional HF hollow line and in particular two HF hollow lines, as in the DE 10 2014 226 280 A1 described, may represent an additional effort in terms of design, manufacture and / or assembly.
  • the RF hollow line can also take up a not inconsiderable amount of installation space and / or restrict the arrangement of the elements of the microwave generator and / or other parts and components of the microwave household appliance.
  • the RF hollow line can add weight.
  • the invention thus poses the problem of providing a high-frequency wave heating module for a high-frequency wave household appliance and / or a high-frequency wave household appliance of the type described at the outset, which and / or which is simpler, faster, more compact, lighter and / or cheaper to construct, assemble and / or can or can be produced as previously known. This is to be achieved in particular for an HF line.
  • At least one alternative to known such high-frequency wave heating modules for high-frequency wave household appliances and / or high-frequency wave household appliances is to be created.
  • the invention thus relates to an HF heating module with at least one printed circuit board and with a cover which closes the printed circuit board at least essentially on the side which is designed to generate HF waves.
  • the high-frequency wave heating module is characterized in that the printed circuit board and the cover are designed to jointly form a high-frequency (HF) line at least in sections.
  • the RF line which is, for example, in the microwave oven DE 10 2014 226 280 A1 laterally connected to its microwave generator, are formed by the high-frequency wave heating module according to the invention itself. This can be brought about by the installation space which is enclosed between the circuit board and the cover.
  • a comparatively compact, lightweight and / or inexpensive high-frequency wave heating module can be created, which can be installed in a high-frequency wave oven in a comparatively simple, fast and / or inexpensive manner.
  • the RF beams can be guided in a comparatively flexible manner.
  • the circuit board which can also be referred to as a circuit board, is preferably fitted on only one side, which can save installation space and / or costs in that the circuit board can be made comparatively flat.
  • the side of the circuit board that faces the cover can be populated so that the electronic elements can be arranged directly facing the HF line.
  • the unpopulated side of the circuit board can also lie flat against another component, such as a base element, to improve the heat dissipation away from the circuit board or its electronic elements, as will be described in more detail below.
  • both sides of the circuit board can be equipped with electronic elements, e.g. to save space, i.e. to make the high-frequency wave heating module as compact as possible.
  • the cover is also designed to shield the radio-frequency (HF) line from the environment.
  • HF radio-frequency
  • the cover has a flexible HF seal applied by dispensing.
  • HF radio frequency
  • the cover has at least one through opening which is designed to connect the radio frequency (RF) line to an interior space of a radio frequency wave household appliance.
  • the HF radiation from the high-frequency wave heating module can be emitted through this passage opening to a treatment room of the high-frequency wave household appliance in order to be used there.
  • the passage opening can preferably be closed in such a way that HF radiation can pass through, but air, moisture and the like can be kept away from the HF line.
  • the cover is formed in one piece. This can keep the manufacturing and / or assembly costs low.
  • the cover is plugged into spring contacts, which are preferably electrically connected to the circuit board by soldering or press-fitting, and thus electrically connected to the circuit board.
  • the cover facing away from the printed circuit board, at least in sections, has a plurality of cooling elements, preferably a plurality of cooling fins, which are designed to dissipate heat. This can promote the dissipation of heat that can be generated by the electronic elements.
  • the high-frequency wave heating module has a base element which is arranged facing away from the cover on the printed circuit board at least in sections, the base element having a plurality of cooling elements, preferably a plurality of cooling fins, which are designed to discharge.
  • the printed circuit board can be given a stable hold, in particular during the assembly of the high-frequency wave heating module per se and the assembly of the high-frequency wave heating module in a high-frequency wave household appliance.
  • the dissipation of heat which can be generated by the electronic elements of the circuit board, can also be promoted by means of the base element.
  • the base element can serve to avoid undesired radiation of RF waves, in particular if the selected RF line requires this.
  • the base element is made of metal and / or in one piece.
  • the metallic design can promote heat conduction and thus also the dissipation of heat to the outside.
  • the one-piece design can simplify production and / or assembly.
  • the one-piece design can also promote the implementation of functions such as shielding, heat conduction and the like.
  • the base element has at least one through opening which is designed to connect the high-frequency (RF) line to an interior space of a high-frequency household appliance.
  • RF high-frequency
  • the cover is arranged together with the printed circuit board in a common joining direction on the base element, preferably by means of screws. This can simplify and / or accelerate the assembly, especially in the case of screw connections.
  • the high-frequency (HF) line is designed as a stripline, a microstrip, an inverted microstrip or a suspended microstrip. This can enable the implementation of the corresponding properties and / or advantages of such lines in a high-frequency wave heating module according to the invention.
  • the HF line is of the inverted microstrip or suspended microstrip type, the base element or the cover can form the ground plane of the HF line.
  • the invention also relates to a high-frequency wave household appliance, preferably a high-frequency wave oven, with an interior space for receiving an item to be heated and with at least one high-frequency wave heating module as described above.
  • a high-frequency wave household appliance preferably a high-frequency wave oven
  • This can enable the implementation of the corresponding properties and / or advantages of a high-frequency wave heating module according to the invention in a high-frequency wave household appliance according to the invention.
  • the circuit board can face a wall of the interior space and the cover can be arranged facing away from the wall of the interior space, or vice versa. If a base element is also used, the base element can face the wall of the interior space and the cover can be arranged facing away from the wall of the interior space, or vice versa, and the circuit board can be arranged between them.
  • the feeding of the HF rays can take place accordingly in each case through at least one corresponding passage opening of the cover or of the base element.
  • the high-frequency wave heating module is connected to the interior space by means of at least one high-frequency (HF) waveguide in a manner that transmits high-frequency wave radiation.
  • HF high-frequency
  • the high-frequency wave heating module can be directly and rigidly connected to the HF waveguide or attached to the HF waveguide, for example by means of screws.
  • the high-frequency (HF) waveguide is connected to the high-frequency wave heating module in a tolerance-compensating manner.
  • manufacturing and / or assembly tolerances can be compensated for at this point in order to achieve a tight seal between the high-frequency wave heating module and the HF waveguide.
  • This can also apply to the compensation of temperature-related expansions of the material.
  • a wall of the high-frequency (HF) waveguide is formed in one piece with a wall of the interior.
  • the RF waveguide can be formed from the material of the wall of the interior of the high-frequency wave household appliance, such as a treatment room wall plate, by means of a protuberance. This can simplify production and / or assembly and also ensure a tight seal in this area.
  • the circuit board can fulfill several functions, namely that the circuit board can include circuit parts and elements, such as in particular power supply, micro-controller, interfaces, plug connectors, HF generation, HF modulation, HF line, HF Filtering, RF power amplification, sensing of RF waves traveling forwards and backwards on the RF lines and the like.
  • circuit parts and elements such as in particular power supply, micro-controller, interfaces, plug connectors, HF generation, HF modulation, HF line, HF Filtering, RF power amplification, sensing of RF waves traveling forwards and backwards on the RF lines and the like.
  • a few parts enable a robust and / or inexpensive to manufacture high-frequency wave heating module as an HF heating module.
  • a longitudinal direction X extends, which can also be referred to as depth X or length X.
  • a transverse direction (not shown), which can also be referred to as the width, extends perpendicular to the longitudinal direction X.
  • a vertical direction Z which can also be referred to as the height Z, extends perpendicularly both to the longitudinal direction X and to the transverse direction.
  • a high-frequency wave household appliance 1 according to the invention in the form of a high-frequency wave oven 1 or a high-frequency wave oven 1 is essentially enclosed on the outside by an outer housing 10.
  • An interior space 11, which can also be referred to as a treatment space 11, a cooking space 11 or a cavity 11, is arranged inside the outer housing 10 and is accessible through a through opening (not shown) in the longitudinal direction X from the right or from the front.
  • the passage opening can be closed by means of a pivotable door or flap (not shown).
  • the interior 11 is essentially formed by a wall 12.
  • a high-frequency wave heating module 2 which can also be referred to as a high-frequency heating module 2 or an HF heating module 2, is arranged at the height Z above the interior space 11.
  • the high-frequency wave heating module 2 has a printed circuit board 20, which can also be referred to as a circuit board 20.
  • the circuit board 20 is equipped at height Z on its upper side with electronic elements which generate high-frequency wave radiation can.
  • This section of the circuit board 20 is enclosed in the longitudinal direction X, in the transverse direction and at the height Z in a box-shaped manner by a cover 21, which can also be referred to as a cover 21.
  • the cover 21 is formed in one piece from metal and, together with the printed circuit board 20, forms a high-frequency line 22.
  • the base element 23 is formed in one piece from metal and is flush with the printed circuit board 20 in the longitudinal direction X and in the transverse direction.
  • the base element 23 rests flat against the circuit board 20, so that the best possible heat flow can be brought about from the circuit board 20 to the base element 23.
  • the latter forms a plurality of cooling elements 24 in the form of cooling fins 24, which promote the dissipation of heat to the environment.
  • the base element 23 has a through opening 25 which is arranged between or next to the cooling elements 24.
  • the HF radiation from the HF line 22 can pass through the material of the printed circuit board 20 at the height Z to below the high-frequency wave heating module 2 through the passage opening 25.
  • a high-frequency waveguide 3 connects directly or coupled via a tolerance compensation element to the edge of the through opening 25 of the base element 23.
  • a wall 30 of the RF waveguide 3 is formed by a protuberance of the material of the wall 12 of the interior 11 of the high-frequency wave household device 1.
  • the HF radiation can pass through the HF waveguide 3 into the interior space 11 of the high-frequency wave household device 1.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electric Ovens (AREA)
  • Constitution Of High-Frequency Heating (AREA)
EP21162227.9A 2020-04-14 2021-03-12 Module de chauffage à ondes à haute fréquence Pending EP3897074A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102020110144.9A DE102020110144A1 (de) 2020-04-14 2020-04-14 Hochfrequenzwellenheizmodul

Publications (1)

Publication Number Publication Date
EP3897074A1 true EP3897074A1 (fr) 2021-10-20

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ID=74873533

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21162227.9A Pending EP3897074A1 (fr) 2020-04-14 2021-03-12 Module de chauffage à ondes à haute fréquence

Country Status (2)

Country Link
EP (1) EP3897074A1 (fr)
DE (1) DE102020110144A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024074290A1 (fr) * 2022-10-06 2024-04-11 Miele & Cie. Kg Appareil ménager haute fréquence, de préférence appareil de cuisson haute fréquence
WO2024074289A1 (fr) * 2022-10-06 2024-04-11 Miele & Cie. Kg Appareil électroménager à haute fréquence, de préférence appareil de cuisson à haute fréquence

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014226280A1 (de) 2014-12-17 2016-06-23 E.G.O. Elektro-Gerätebau GmbH Mikrowellengenerator und Mikrowellenofen
US20170094731A1 (en) * 2014-03-20 2017-03-30 Guangdong Midea Kitchen Appliances Manufacturing Co., Ltd. Connection structure and input/output connection structure of semiconductor microwave generator for microwave oven, and microwave oven
US20170359863A1 (en) * 2016-06-13 2017-12-14 E.G.O. Elektro-Geraetebau Gmbh Microwave generator for a microwave device and microwave device
DE102017111319A1 (de) * 2017-05-24 2018-11-29 Miele & Cie. Kg Einrichtung zur Erzeugung und Transmission von Hochfrequenzwellen (HF-Wellen)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3934341B2 (ja) 1999-02-15 2007-06-20 独立行政法人情報通信研究機構 無線通信装置
JP5064924B2 (ja) 2006-08-08 2012-10-31 パナソニック株式会社 マイクロ波処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170094731A1 (en) * 2014-03-20 2017-03-30 Guangdong Midea Kitchen Appliances Manufacturing Co., Ltd. Connection structure and input/output connection structure of semiconductor microwave generator for microwave oven, and microwave oven
DE102014226280A1 (de) 2014-12-17 2016-06-23 E.G.O. Elektro-Gerätebau GmbH Mikrowellengenerator und Mikrowellenofen
US20170359863A1 (en) * 2016-06-13 2017-12-14 E.G.O. Elektro-Geraetebau Gmbh Microwave generator for a microwave device and microwave device
DE102017111319A1 (de) * 2017-05-24 2018-11-29 Miele & Cie. Kg Einrichtung zur Erzeugung und Transmission von Hochfrequenzwellen (HF-Wellen)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024074290A1 (fr) * 2022-10-06 2024-04-11 Miele & Cie. Kg Appareil ménager haute fréquence, de préférence appareil de cuisson haute fréquence
WO2024074289A1 (fr) * 2022-10-06 2024-04-11 Miele & Cie. Kg Appareil électroménager à haute fréquence, de préférence appareil de cuisson à haute fréquence
BE1030943B1 (de) * 2022-10-06 2024-05-07 Miele & Cie Hochfrequenz-Haushaltsgerät, vorzugsweise Hochfrequenz-Gargerät
BE1030947B1 (de) * 2022-10-06 2024-05-07 Miele & Cie Hochfrequenz-Haushaltsgerät, vorzugsweise Hochfrequenz-Gargerät

Also Published As

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