EP3877330A1 - Präkursormaterial für die herstellung siliciumcarbidhaltiger materialien - Google Patents
Präkursormaterial für die herstellung siliciumcarbidhaltiger materialienInfo
- Publication number
- EP3877330A1 EP3877330A1 EP19800991.2A EP19800991A EP3877330A1 EP 3877330 A1 EP3877330 A1 EP 3877330A1 EP 19800991 A EP19800991 A EP 19800991A EP 3877330 A1 EP3877330 A1 EP 3877330A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- silicon carbide
- composition
- dispersion
- precursor
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002243 precursor Substances 0.000 title claims abstract description 98
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims description 146
- 229910010271 silicon carbide Inorganic materials 0.000 title claims description 137
- 239000000463 material Substances 0.000 title claims description 50
- 239000000203 mixture Substances 0.000 claims abstract description 126
- 239000008187 granular material Substances 0.000 claims abstract description 101
- 238000004519 manufacturing process Methods 0.000 claims abstract description 75
- 239000006185 dispersion Substances 0.000 claims abstract description 69
- 238000000034 method Methods 0.000 claims description 131
- 150000001875 compounds Chemical class 0.000 claims description 52
- 239000002904 solvent Substances 0.000 claims description 37
- 230000002829 reductive effect Effects 0.000 claims description 35
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 30
- 229910052799 carbon Inorganic materials 0.000 claims description 25
- 239000003153 chemical reaction reagent Substances 0.000 claims description 24
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 23
- 239000002245 particle Substances 0.000 claims description 22
- 239000002270 dispersing agent Substances 0.000 claims description 21
- -1 invert sugar Chemical compound 0.000 claims description 17
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 14
- 239000002612 dispersion medium Substances 0.000 claims description 14
- 239000002210 silicon-based material Substances 0.000 claims description 14
- 238000007669 thermal treatment Methods 0.000 claims description 14
- 150000004756 silanes Chemical class 0.000 claims description 12
- 238000005275 alloying Methods 0.000 claims description 11
- 239000003054 catalyst Substances 0.000 claims description 11
- 239000003960 organic solvent Substances 0.000 claims description 11
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 9
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 9
- 229910000077 silane Inorganic materials 0.000 claims description 9
- 235000000346 sugar Nutrition 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 7
- 239000000725 suspension Substances 0.000 claims description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 6
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims description 6
- 150000008163 sugars Chemical class 0.000 claims description 6
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 5
- 239000006260 foam Substances 0.000 claims description 5
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 4
- 229920000881 Modified starch Polymers 0.000 claims description 4
- 150000001298 alcohols Chemical group 0.000 claims description 4
- 229960004903 invert sugar Drugs 0.000 claims description 4
- 235000019426 modified starch Nutrition 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 3
- 239000002585 base Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- OWEGMIWEEQEYGQ-UHFFFAOYSA-N 100676-05-9 Natural products OC1C(O)C(O)C(CO)OC1OCC1C(O)C(O)C(O)C(OC2C(OC(O)C(O)C2O)CO)O1 OWEGMIWEEQEYGQ-UHFFFAOYSA-N 0.000 claims description 2
- DGXAGETVRDOQFP-UHFFFAOYSA-N 2,6-dihydroxybenzaldehyde Chemical compound OC1=CC=CC(O)=C1C=O DGXAGETVRDOQFP-UHFFFAOYSA-N 0.000 claims description 2
- 229930091371 Fructose Natural products 0.000 claims description 2
- 239000005715 Fructose Substances 0.000 claims description 2
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 claims description 2
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 2
- GUBGYTABKSRVRQ-PICCSMPSSA-N Maltose Natural products O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@@H]1O[C@@H]1[C@@H](CO)OC(O)[C@H](O)[C@H]1O GUBGYTABKSRVRQ-PICCSMPSSA-N 0.000 claims description 2
- 229920002472 Starch Polymers 0.000 claims description 2
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 claims description 2
- 229930006000 Sucrose Natural products 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N dimethylformamide Substances CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 239000008103 glucose Substances 0.000 claims description 2
- 150000002576 ketones Chemical class 0.000 claims description 2
- 229920000620 organic polymer Polymers 0.000 claims description 2
- 235000019698 starch Nutrition 0.000 claims description 2
- 239000005720 sucrose Substances 0.000 claims description 2
- 150000003462 sulfoxides Chemical class 0.000 claims description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 2
- NKLYMYLJOXIVFB-UHFFFAOYSA-N triethoxymethylsilane Chemical compound CCOC([SiH3])(OCC)OCC NKLYMYLJOXIVFB-UHFFFAOYSA-N 0.000 claims description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 abstract description 29
- 230000000996 additive effect Effects 0.000 abstract description 28
- 229910045601 alloy Inorganic materials 0.000 description 28
- 239000000956 alloy Substances 0.000 description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 25
- 239000012071 phase Substances 0.000 description 24
- 238000010276 construction Methods 0.000 description 20
- 239000007789 gas Substances 0.000 description 17
- 239000011651 chromium Substances 0.000 description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 239000000843 powder Substances 0.000 description 12
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 11
- 239000000377 silicon dioxide Substances 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 239000007858 starting material Substances 0.000 description 8
- 238000003860 storage Methods 0.000 description 8
- 229910000676 Si alloy Inorganic materials 0.000 description 7
- 238000002425 crystallisation Methods 0.000 description 7
- 230000008025 crystallization Effects 0.000 description 7
- 229910021485 fumed silica Inorganic materials 0.000 description 7
- 239000000499 gel Substances 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 235000012239 silicon dioxide Nutrition 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000009826 distribution Methods 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 238000003980 solgel method Methods 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 5
- 239000012300 argon atmosphere Substances 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 230000007062 hydrolysis Effects 0.000 description 5
- 238000006460 hydrolysis reaction Methods 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000007791 liquid phase Substances 0.000 description 4
- 150000001247 metal acetylides Chemical class 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 230000000737 periodic effect Effects 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 229910052726 zirconium Inorganic materials 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 229960004106 citric acid Drugs 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 229910052748 manganese Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000003797 solvolysis reaction Methods 0.000 description 3
- 229910052720 vanadium Inorganic materials 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- XUMBMVFBXHLACL-UHFFFAOYSA-N Melanin Chemical compound O=C1C(=O)C(C2=CNC3=C(C(C(=O)C4=C32)=O)C)=C2C4=CNC2=C1C XUMBMVFBXHLACL-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 229910026551 ZrC Inorganic materials 0.000 description 2
- OTCHGXYCWNXDOA-UHFFFAOYSA-N [C].[Zr] Chemical compound [C].[Zr] OTCHGXYCWNXDOA-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 235000010338 boric acid Nutrition 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 150000001642 boronic acid derivatives Chemical class 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000002178 crystalline material Substances 0.000 description 2
- PSCMQHVBLHHWTO-UHFFFAOYSA-K indium(iii) chloride Chemical compound Cl[In](Cl)Cl PSCMQHVBLHHWTO-UHFFFAOYSA-K 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 150000003009 phosphonic acids Chemical class 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000000110 selective laser sintering Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000020374 simple syrup Nutrition 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 238000010146 3D printing Methods 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 239000007848 Bronsted acid Substances 0.000 description 1
- 239000003341 Bronsted base Substances 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 125000005595 acetylacetonate group Chemical group 0.000 description 1
- 229960004543 anhydrous citric acid Drugs 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000002902 bimodal effect Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 125000005619 boric acid group Chemical class 0.000 description 1
- 150000001638 boron Chemical class 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001805 chlorine compounds Chemical group 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000009770 conventional sintering Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 239000003398 denaturant Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 150000004675 formic acid derivatives Chemical class 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 235000011087 fumaric acid Nutrition 0.000 description 1
- 150000004820 halides Chemical group 0.000 description 1
- 239000007970 homogeneous dispersion Substances 0.000 description 1
- 150000002483 hydrogen compounds Chemical class 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 150000002471 indium Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical group 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- ZLANVVMKMCTKMT-UHFFFAOYSA-N methanidylidynevanadium(1+) Chemical class [V+]#[C-] ZLANVVMKMCTKMT-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 230000010494 opalescence Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000006072 paste Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910021426 porous silicon Inorganic materials 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- LEIGGMIFKQLBRP-UHFFFAOYSA-N tetraethyl silicate Chemical compound CCO[Si](OCC)(OCC)OCC.CCO[Si](OCC)(OCC)OCC LEIGGMIFKQLBRP-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/90—Carbides
- C01B32/914—Carbides of single elements
- C01B32/956—Silicon carbide
- C01B32/963—Preparation from compounds containing silicon
- C01B32/977—Preparation from organic compounds containing silicon
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/90—Carbides
- C01B32/914—Carbides of single elements
- C01B32/956—Silicon carbide
- C01B32/963—Preparation from compounds containing silicon
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
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Definitions
- the present invention relates to the technical field of manufacturing silicon carbide-containing materials, in particular by means of additive manufacturing.
- the present invention relates to a method for producing a composition, in particular a precursor granulate, which is suitable for the production of silicon carbide-containing materials and especially for the production of three-dimensional objects from silicon carbide-containing materials in generative manufacturing processes.
- the present invention further relates to a composition, in particular a precursor granulate, for producing materials containing silicon carbide.
- the present invention relates to a composition, in particular a precursor granulate, for use in additive manufacturing processes.
- the present invention further relates to a liquid composition, in particular a suspension, containing a precursor granulate.
- the present invention relates to the use of a composition, in particular a precursor granulate, for the production of silicon carbide-containing materials or in generative manufacturing processes for the production of three-dimensional objects from silicon carbide-containing materials.
- Generative manufacturing processes also known as additive manufacturing or additive manufacturing (AM) are processes for the rapid production of models, patterns, tools and products from shapeless materials, such as liquids, gels, pastes or powders.
- AM additive manufacturing
- High-energy processes such as selective laser melting (SLM), electron beam melting or deposition welding, are preferably used to produce objects from inorganic materials, since the educts or precursors used only react or melt when the energy input is high.
- SLM selective laser melting
- educts or precursors used only react or melt when the energy input is high are preferably used to produce objects from inorganic materials, since the educts or precursors used only react or melt when the energy input is high.
- SLM selective laser melting
- electron beam melting or deposition welding are preferably used to produce objects from inorganic materials, since the educts or precursors used only react or melt when the energy input is high.
- SLM selective laser melting
- electron beam melting or deposition welding are preferably used to produce objects from inorganic materials, since the educts or precursors used only react or melt when the energy input is high.
- additive manufacturing enables the fast manufacture of highly complex components, but in particular the manufacture of components from inorganic materials poses a number of challenges to both the educt
- Silicon carbide also called carborundum, is an extremely interesting and versatile material for both mechanically stressed components and for semiconductor applications.
- Silicon carbide with the chemical formula SiC has an extremely high hardness and a high sublimation point and is often used as an abrasive or as an insulator in high-temperature reactors.
- Siliciumcar bid also goes with a variety of elements and compounds alloys or alloy-like compounds, which have a variety of advantageous material properties, such as high hardness, high resistance, low weight and low oxidation sensitivity even at high temperatures.
- Materials containing silicon carbide are usually obtained by sintering processes from starting materials or starting material mixture which contain silicon carbide particles. Here, however, relatively porous bodies are obtained which are only suitable for a limited number of fields of application.
- the properties of the porous silicon carbide material produced using conventional sintering methods do not correspond to those of compact crystalline silicon carbide, so that the advantageous properties of the silicon carbide cannot be fully exploited.
- silicon carbide is therefore unsuitable as the sole starting material for additive manufacturing, in particular for processes such as laser melting. Because of the versatility of silicon carbide and the large number of positive application properties, attempts have nevertheless been made to process silicon carbide using additive manufacturing processes.
- DE 10 2015 105 085.4 describes a process for the production of bodies from silicon carbide crystals, the silicon carbide being obtained in particular by laser irradiation from suitable precursor compounds containing carbon and silicon. Under the action of the laser beam, the precursor compounds selectively decompose and silicon carbide is formed without the silicon carbide sublimating.
- the method described in DE 10 2015 105 085.4 is perfectly suitable for obtaining objects made of silicon carbide, but the reproducible representation of the precursor material, which is obtained by means of a sol-gel method, is lengthy and complex.
- the aging of the compounds used from a sol to a gel is very time-consuming, and on the other hand, the precursor material obtained in the sol-gel process still has to undergo a reductive thermal treatment, in particular a carbothermal treatment, at approximately 1,100 ° C. undergo in order to obtain reproducible precursor materials with consistently good properties for additive manufacturing.
- the product obtained by simple drying after the sol-gel process has changing compositions and can only be converted into a stable and reproducible form by the reductive thermal treatment at high temperatures.
- silicon carbide-containing materials in particular silicon carbide crystals or fibers, which are obtained by deposition from the gas phase.
- a precursor granulate is again used as the starting material, that is elaborately obtained by a sol-gel process and then subjected to a thermal treatment at over 1,000 ° C.
- an object of the present invention is to be seen in providing a simplified method for producing a composition, in particular a precursor granulate, which can be used in the additive manufacturing of objects made of materials containing silicon carbide.
- Another object of the present invention is to provide a precursor granulate which can be reproducibly produced in a constant quality with as little effort as possible.
- the present invention in accordance with a first aspect of the present invention is consequently a method for producing a composition, in particular a precursor granulate according to claim 1; Further advantageous embodiments of this aspect of the invention are the subject of the respective subclaims.
- Another object of the present invention according to a second aspect of the present invention is a composition, in particular a precursor granulate according to claim 16.
- Another object of the present invention according to a third aspect of the present invention is a liquid composition according to claim 17.
- the present invention according to a fourth aspect of the present invention relates to the use of a composition according to claim 18.
- another object of the present invention according to a fifth aspect of the present invention is the use of a composition, in particular a precursor granulate, according to claim 19 .
- the present invention - according to a first aspect of the present invention - is thus a method for producing a composition, in particular an SiC precursor granulate, wherein
- a defined composition in particular an SiC precursor granulate
- a solution or dispersion preferably a colloidal solution or a sol
- the solvent or dispersing agent can and should preferably be removed quickly.
- the method according to the invention thus represents a significant simplification compared to the previous production of compositions, in particular
- SiC precursor granules for the additive manufacturing of silicon carbide-containing bodies.
- the method according to the invention brings significant time and energy savings, as a result of which the costs for the production of the composition, in particular the precursor granules, can be significantly reduced.
- the composition in particular the precursor granulate, does not contain any powder mixture, in particular, no mixture of different precursor powders and / or granules. It is a special feature of this procedure that a homogeneous granulate, in particular a precursor granulate, is used as the starting material for additive manufacturing.
- the composition in particular the precursor granules, can transition into the gas phase or the precursor compounds can react to the desired target compounds by means of short exposure times of energy, in particular laser radiation, individual particles of different inorganic substances with particle sizes in the pm range not sublimating must be diffused, the components of which must then form the corresponding compounds and alloys.
- the individual building blocks, in particular special elements, of the target compound containing silicon carbide are homogeneously distributed and arranged in close proximity to one another, ie less energy is required to produce the compounds containing silicon carbide.
- the precursor granules obtainable by the process according to the invention are also suitable for the production of a wide variety of materials containing silicon carbide.
- the precursor granules obtainable with the process according to the invention can be used in all processes in which materials containing silicon carbide are obtained either from precursor compounds and / or by vapor phase deposition.
- the method according to the invention always enables a simple, inexpensive and reproducible way to obtain suitable starting materials.
- a solution is to be understood as a one-phase system in which at least one substance, in particular a compound or its constituents, such as, for example, ions, are homogeneously distributed in another substance, the solvent.
- a dispersion is understood to mean an at least two-phase system, a first phase, namely the dispersed phase, being distributed in a second phase, the continuous phase.
- the continuous phase is also referred to as a dispersing medium or dispersing agent.
- a colloidal solution or a sol is understood to mean a solution or finely divided dispersion which preferably has particles with a particle diameter of 1 to 1,000 nm.
- sols or colloidal solutions or also in the case of polymeric compounds in which macromolecules are present in finely divided form in the solvent or dispersion medium the transition between a solution and a dispersion is often fluid, so that it is no longer clear between a solution or a Dispersion can be distinguished.
- silicon dioxide as the silicon-containing compound
- the solution or dispersion, in particular the sol has particles with a particle diameter of more than 1,000 nm. However, it is also preferred in this case if the diameter of the silica particles is less than 1,000 nm.
- the particle sizes can be determined, for example, by means of dynamic light scattering.
- a silicon carbide-containing compound is to be understood as a binary, ternary or quaternary inorganic compound or alloy, the molecular formula of which contains silicon and carbon.
- a silicon carbide-containing compound in the context of the present invention does not contain any molecularly bound carbon, such as, for example, carbon monoxide or carbon dioxide; rather, the carbon is in a solid structure.
- the method according to the invention for the preparation of precursor materials is suitable for a large spectrum of compounds containing silicon carbide.
- the silicon carbide-containing compound is usually selected from optionally doped silicon carbide, non-stoichiometric silicon carbides and silicon carbide alloys.
- a non-stoichiometric silicon carbide compound is understood to mean a silicon carbide which does not contain carbon and silicon in a molar ratio of 1: 1, but in ratios which deviate therefrom.
- silicon carbide alloys are to be understood as meaning compounds of silicon carbide with metals, such as, for example, titanium or other compounds, such as zirconium carbide or boron nitride, which contain silicon carbide in different and widely fluctuating proportions. Silicon carbide alloys often form high-performance ceramics or stoichiometric compounds, which are characterized by particular hardness and temperature resistance.
- composition according to the invention can be used in a wide range of variations and is suitable for producing a large number of different silicon carbide compounds, in particular in order to specifically adjust their mechanical properties.
- the non-stoichiometric silicon carbide is usually a silicon carbide of the general formula (I)
- SiCi- x (I) with x 0.05 to 0.8, in particular 0.07 to 0.5, preferably 0.09 to 0.4, preferred
- Such silicon-rich silicon carbides have a particularly high mechanical strength and are suitable for a large number of applications as ceramics.
- the silicon carbide-containing compound produced in the context of the present invention is a silicon carbide alloy
- the silicon carbide alloy is usually selected from MAX phases, alloys of silicon carbide with elements, in particular metals, and alloys of silicon carbide with
- silicon carbide alloys contain silicon carbide in varying and strongly fluctuating proportions.
- silicon carbide is the main component of the alloys.
- the silicon carbide alloy it is also possible for the silicon carbide alloy to contain silicon carbide only in small amounts.
- the silicon carbide alloy usually has the silicon carbide in amounts of 10 to 95% by weight, in particular 15 to 90% by weight, preferably 20 to 80% by weight.
- M stands for an early transition metal from the third to sixth group of the periodic table of the elements, while A stands for an element of the 13th to 16th group of the periodic table of the elements.
- X is either carbon or nitrogen.
- MAX phases are of interest whose sum formula contains silicon carbide (SiC), ie silicon and carbon.
- MAX phases have unusual combinations of chemical, physical, electrical and mechanical properties, as they show both metallic and ceramic behavior depending on the conditions. This includes, for example, high electrical and thermal conductivity, high resilience to thermal shock, very high hardness and low thermal expansion coefficients. If the silicon carbide alloy is a MAX phase, it is preferred if the MAX phase is selected from Ti 4 SiC3 and ThSiC.
- the aforementioned MAX phases in particular are highly resistant to chemicals and oxidation at high temperatures.
- the silicon carbide-containing compound is an alloy of the silicon carbide, it has proven itself in the case that the alloy is an alloy of silicon carbide with metals, if the alloy is selected from alloys of silicon carbide with metals from the group of Al, Ti, V, Cr, Mn, Co, Ni, Zn, Zr and their mixtures.
- the alloy of silicon carbide is selected from alloys of silicon carbide with metal carbides and / or nitrides, it has proven useful if the alloys of silicon carbide with metal carbides and / or nitrides is selected from the group of silicon carbide with boron carbides, in particular B 4 C, Chromium carbides, in particular Cr 2 C3, titanium carbides, in particular TiC, molybdenum carbides, in particular M02C, niobium carbides, in particular NbC, tantalum carbides, in particular TaC, vanadium carbides, in particular VC, zirconium carbides, in particular ZrC, tungsten carbides, in particular WC, boron nitride, in particular BN, and their mixtures.
- boron carbides in particular B 4 C
- a powdery composition is obtained in the second process step (b).
- a powdery composition in particular a precursor granulate, makes it possible to use the composition in powder bed processes for the production of objects containing silicon carbide.
- the powdery composition has particle sizes in the range from 0.5 pm to 1,000 pm, in particular 0.5 pm to 500 pm, preferably 1 pm to 200 pm, preferably 10 pm to 100 pm , particularly preferably 40 pm to 80 pm.
- the particles of the precursor granules have a D60 value in the range from 1 to 500 pm, in particular 2 to 100 pm, preferably 12 to 80 pm, preferably 40 to 75 pm.
- the D60 value for the particle size represents the limit below which the particle size is 60% of the particles of the composition, i. H. 60% of the particles of the composition have particle sizes which are smaller than the D60 value.
- the composition has a bimodal particle size distribution. In this way, in particular compositions with a high bulk density are accessible.
- the silicon-containing compound is concerned, it has proven useful if the silicon-carbide-containing compound is selected from silanes, silane hydrolyzates, orthosilicic acid, silicon dioxide and mixtures thereof, preferably silanes, silicon dioxide and mixtures thereof.
- the use of silanes or silane hydrolyzates and orthosilicic acid is a preferred embodiment since the abovementioned compounds can be converted into silicon dioxide derivatives quickly and without volatile organic residues.
- the stoichiometry of the resulting composition and also of the silicon carbide-containing compound obtainable with it can be easily adjusted.
- tailored compositions can be obtained which are suitable for the production of specific compounds containing silicon carbide.
- the use of silanes is particularly preferred in this context.
- silicon dioxide is often also used directly as the silicon-containing compound, in particular in finely divided form.
- Silicon dioxide is preferably used in the form of oligomeric or polymeric silica.
- Particularly good results are obtained when the oligomeric or polymeric silica is selected from precipitated silica, silica gel, silica sol, pyrogenic silica and their mixtures, preferably silica sol, pyrogenic silica and mixtures thereof.
- Particularly good results are obtained in this connection if the oligomeric or polymeric silica is pyrogenic silica, preferably hydrophilic pyrogenic silica.
- silane selected from silanes of the general formula II R 4 -nSiX n (II) with
- R alkyl, in particular Cr to Cs alkyl, preferably Cr to C 3 alkyl, preferably Cr and / or C 2 alkyl;
- Aryl in particular Ce to C 2 o-aryl, preferably Ce to C is aryl, preferably Ce to Cio aryl;
- Olefin in particular terminal olefin, preferably C 2 - to Cio-olefin, preferably C 2 - to Cs-olefin, particularly preferably C 2 - to Cs-olefin, very particularly preferably C 2 - and / or C 3 -olefin , particularly preferably vinyl;
- Amine in particular C 2 - to Cio-amine, preferably C 2 - to Cs-amine, preferably C 2 - to Cs-amine, particularly preferably C 2 - and / or C 3 -amine;
- Carboxylic acid in particular C 2 - to Cio-carboxylic acid, preferably C 2 - to Cs-carboxylic acid, preferably C 2 - to Cs-carboxylic acid, particularly preferably C 2 - and / or C3-carboxylic acid;
- Alcohol in particular C 2 to Cio alcohol, preferably C 2 to Cs alcohol, preferably C 2 to Cs alcohol, particularly preferably C 2 and / or C3 alcohol;
- X halide, especially chloride and / or bromide
- silane is selected from silanes of the general formula IIa
- the silane is selected from tetraalkoxysilanes and / or trialkoxyalkylsilanes, preferably tetraethoxysilane. It is very particularly preferred in this context if the silane is selected from tetraethoxysilane, tetramethoxysilane or triethoxymethylsilane, with tetraethoxysilane being particularly preferably used.
- the amount in which the solution or dispersion contains the silicon-containing compound can vary widely.
- the solution or dispersion in the first process step (a) contains the silicon-containing compound in amounts of 5 to 40% by weight, in particular 10 to 30 % By weight, preferably 15 to 25% by weight, preferably 17 to 20% by weight, based on the solution or dispersion.
- the solution or dispersion in the first process step (a) prefers the silicon-containing compound in a proportion of 1 to 25%, in particular 2 to 20%, preferably 3 to 15%, preferably 4 to 10% Contains 5 to 10%, based on the total amount of the solution or dispersion.
- at least one of the components at temperatures in the range from 30 to 100 ° C., preferably 40 to 80 ° C., preferably 50 to 70 ° C is heated.
- the solution or dispersion is preferably heated at least temporarily to the aforementioned temperatures during the production process. Due to the temperature increase, a rapid solution or fine dispersion of the individual components in the solvent or dispersant is given and a possible hydrolysis of, for example, silanes or doping and alloying reagents takes place significantly more quickly.
- the solvent or dispersion medium is heated, in particular to temperatures in the range from 20 ° C. below, preferably 10 ° C. below, the boiling point of the solvent or dispersion medium to the boiling point of the solvent or dispersion medium.
- the solution or dispersion contains the solvent or dispersing agent in amounts of 20 to 80% by weight, in particular 30 to 70% by weight. -%, preferably 40 to 60 wt .-%, preferably 45 to 55 wt .-%, based on the solution or dispersion.
- the solution or dispersion contains the solvent or dispersion medium in a proportion of 40 to 95%, in particular 50 to 90%, preferably 60 to 90%, preferably 70 to 90%.
- the solvent or dispersant is selected from water, organic solvents and mixtures thereof.
- the solvent or dispersion medium is selected from organic solvents or from mixtures of water and organic solvents
- the solvent is selected from alcohols, esters, ketones, amines, amides, sulfoxides and mixtures thereof, in particular methanol, Ethanol, 2-propanol, acetone, ethyl acetate, / V, / V-dimethylformamide, dimethyl sulfoxide and mixtures thereof.
- Particularly good results are obtained when the organic solvent is selected from alcohols, in particular methanol, ethanol and 2-propanol. Because of its relatively high volatility and low toxicity, ethanol is preferred.
- the solvent or dispersant is a mixture of water and at least one organic solvent.
- the solvent or dispersion medium is a mixture of water and an alcohol, in particular methanol, ethanol and 2-propanol, preferably ethanol.
- the solvent or dispersant is a mixture of water and at least one organic solvent, it has proven useful if the solvent or dispersant has a weight-based ratio of water to organic solvents in the range from 4: 1 to 1:10, in particular 2: 1 to 1: 8, preferably 1: 1 to 1: 5, preferably 1: 1 to 1: 3.
- the solvent or dispersant has a ratio of water to organic solvents in the range from 10: 1 to 1: 5, in particular 8: 1 to 1: 2, preferably 5: 1 to 1: 1 , preferably 2: 1 to 1: 1.
- silicon dioxide is used as the silicon-containing compound, it can be provided according to a preferred embodiment of the present invention that water is used as the sole solvent or dispersant.
- the carbon-containing compound its content in the solution or dispersion in the first process step (a) can vary within a wide range.
- the solution or dispersion usually has the carbon-containing compound in amounts of 1 to 50% by weight, in particular 5 to 40% by weight, preferably 8 to 30% by weight, preferably 10 to 25% by weight, particularly preferably 12 to 20 wt .-%, based on the solution or dispersion.
- the chemical composition of the carbon-containing compound is usually selected from sugars, in particular sucrose, glucose, fructose, invert sugar, maltose; Strength; Starch derivatives; organic polymers, especially phenol-formaldehyde resin and resorcinol-formaldehyde resin, and their mixtures.
- sugars in particular sucrose, glucose, fructose, invert sugar, maltose; Strength; Starch derivatives; organic polymers, especially phenol-formaldehyde resin and resorcinol-formaldehyde resin, and their mixtures.
- the solution or dispersion contains at least one doping and / or alloying reagent. If the solution contains a doping and / or alloying reagent, it has proven useful if the solution or dispersion contains the doping or alloying reagent in amounts of 0.000001 to 60% by weight, in particular 0.000001 to 45% by weight. %, preferably 0.000005 to 45% by weight, preferably 0.00001 to 40% by weight, based on the solution or dispersion.
- the solution or dispersion has a doping reagent
- the solution or dispersion has the doping reagent usually in amounts of 0.000001 to 0.5% by weight, preferably 0.000005 to 0.1% by weight, preferably
- the solution or dispersion contains an alloy reagent
- the solution or dispersion contains the alloy reagent in amounts of 5 to 60% by weight, in particular 10 to 45% by weight, preferably 15 to 45% by weight. %, preferably 20 to 40 wt .-%, based on the solution or dispersion.
- the chemical nature of the doping reagent it can be selected from suitable doping elements.
- the doping reagent or the doping element is preferably selected from elements of the third and fifth main groups of the periodic table.
- the doping reagent is preferably selected from compounds of an element of the third or fifth main group of the periodic table of the elements which are soluble in the solvent or dispersant.
- the doping reagent is usually selected from nitric acid, ammonium chloride, melamine, phosphoric acid, phosphonic acids, boric acid, borates, boron chloride, indium chloride and their mixtures.
- the solution may contain nitric acid, ammonium chloride or melanin. If doping with phosphorus is provided, phosphoric acid or phosphates or phosphonic acids can be used, for example.
- boric acids such as boron trichloride, for example, are used.
- boron salts such as boron trichloride, for example.
- water-soluble indium salts such as indium chloride, are usually used as the doping reagent.
- the solution or dispersion contains an alloy reagent
- the alloy reagent is usually selected from compounds of Al, Ti, V, Cr, Mn, Co, Ni, Zn, Zr and which are soluble in the solvent or dispersion medium their mixtures.
- the alloy reagent is selected from chlorides, nitrates, acetates, acetylacetonates and formates of Al, Ti, V, Cr, Mn, Co, Ni, Zn, Zr and mixtures thereof.
- the solution or dispersion contains at least one catalyst.
- the catalyst is contained in particular as component (v) in the solution or dispersion in the first process step (a).
- the catalyst should accelerate the solvolysis or hydrolysis of the components used so that they form a solution or homogeneous dispersion as quickly as possible.
- silicon dioxide as a silicon-containing compound
- the use of a catalyst can usually be dispensed with, unless the catalyst is used to accelerate the Solvolysis or hydrolysis of doping or alloying reagents is to be used.
- the catalyst is an acid or base, preferably an acid.
- the acids and bases used are Bronsted acids and bases.
- the acid is selected from the group of carboxylic acids, mineral acids and their mixtures.
- carboxylic acids such as, for example, acetic acid, oxalic acid, citric acid, fumaric acid, fatty acids, in particular citric acid.
- carboxylic acids such as, for example, acetic acid, oxalic acid, citric acid, fumaric acid, fatty acids, in particular citric acid.
- the amount in which the solution or dispersion contains the catalyst can naturally vary within wide limits. It has proven itself within the scope of the present invention, however, if the solution or dispersion contains the catalyst in amounts of 0.1 to 10% by weight, in particular 0.5 to 7% by weight, preferably 1 to 5% by weight .-%, preferably 2 to 4 wt .-%, based on the solution or dispersion. Rapid amounts of hydrolysis of the starting compounds used can be ensured with amounts of catalyst in the abovementioned ranges.
- the second method step (b) is carried out immediately after the first method step (a).
- the second process step takes place before gel formation, for example by hydrolyzed silanes.
- the second method step (b) is carried out at the latest 30 minutes, preferably at the latest 15 minutes, after completion of the first method step (a).
- the duration of the first process step (a) is concerned, this can vary within wide ranges.
- the preparation of the solution or dispersion in process step (a) is usually carried out by simultaneous or successive mixing of the individual components over a period of 1 minute to 2 hours, in particular 10 minutes to 1.5 hours, preferably 15 minutes to 1 Hours.
- the solvent or dispersant is removed at elevated temperature and / or under reduced pressure. It is particularly preferred in the context of the present invention if the solvent or dispersant is removed at elevated temperature and under reduced pressure, for example in the context of a vacuum distillation. An increase in temperature or a decrease in the pressure is advantageous, since this ensures faster removal of the solvent or dispersant, and thus gel formation can be reliably avoided.
- a thermal treatment in particular a reductive thermal treatment, obtained in the second process step (b) , is subjected.
- This preferably gives a reduced composition.
- the reductive thermal treatment usually takes place under an inert gas atmosphere, the carbon source in particular, preferably a sugar-based carbon source, reacting with oxides or other compounds of silicon and possibly other compounds of other elements, as a result of which the elements are reduced and volatile oxidized carbon and hydrogen compounds, especially water and C0 2 , which are removed via the gas phase.
- the composition is usually in the third process step (c) to temperatures in the range from 300 to 900 ° C., in particular 400 to 800 ° C., preferably 500 to 700 ° C, heated.
- the thermal treatment in particular a reductive thermal treatment, makes it possible to obtain a precursor granulate with a significantly higher density.
- These precursor granules with increased density are also called reduced precursor granules or reduced composition below.
- the density of the composition after process step (c) is increased by approximately 8 to 30%, in particular 10 to 20%, compared to the product obtained in process step (b).
- the use of the reduced composition or the reduced precursor granulate makes it possible to significantly increase the layer thickness of the silicon carbide-containing material produced in the course of powder bed processes or by processes based on cladding, and to compact, i.e. to get non-porous, materials.
- the third process step (c) is usually carried out under a protective gas atmosphere, in particular under a nitrogen or argon atmosphere, or in vacuo.
- silicon carbide-containing materials from the composition, in particular the precursor granulate. If different silicon carbide-containing materials, such as non-stoichiometric silicon carbide or silicon carbide alloys, are to be obtained, the result is each have different preferred embodiments of the composition according to the invention and of the method according to the invention.
- the solution or dispersion in the first process step contains the silicon-containing compound in amounts of 10 to 40% by weight. , in particular 12 to 30% by weight, preferably 15 to 25% by weight, preferably 17 to 20% by weight, based on the solution or dispersion.
- the solution or dispersion contains the carbon-containing compounds in amounts of 6 to 40% by weight, preferably 8 to 30% by weight, preferably 10 to 25% by weight, particularly preferably 12 up to 20 wt .-%, based on the solution or dispersion.
- the solution or dispersion prefers the solvent or dispersion medium in amounts of 20 to 80% by weight, in particular 30 to 70% by weight, preferably 40 to 60% by weight 45 to 55 wt .-%, based on the solution or dispersion.
- the solution or dispersion usually contains the doping reagent in amounts of 0.000001 to 0.5% by weight, preferably 0.000005 to 0.1% by weight, preferably 0.00001 to 0 , 01 wt .-%, based on the solution or dispersion.
- % in particular 15 to 40% by weight, preferably 18 to 35% by weight, preferably 20 to 30% by weight, based on the solution or dispersion.
- the solution or dispersion contains the carbon-containing compound in amounts of 6 to 40% by weight, preferably 8 to 30% by weight, preferably 10 to 25% by weight, particularly preferably, 12 to 20 wt .-%, based on the solution or dispersion.
- the solution or dispersion contains the solvent or dispersion medium in amounts of 20 to 80% by weight, in particular 30 to 70% by weight, preferably 40 to 60% by weight , preferably 45 to 55 wt .-%, based on the solution or dispersion.
- the solution or dispersion contains the doping reagent in amounts of 0.000001 to 0.5% by weight, preferably 0.000005 to 0.1% by weight. , prefers
- the solution or dispersion in the first process step (a) contains the silicon-containing compound in amounts of 5 to 30% by weight, in particular 6 to 25% by weight. %, preferably 8 to 20% by weight, preferably 10 to 20% by weight, based on the solution or dispersion.
- the solution or dispersion contains the carbon-containing compound in amounts of 5 to 40% by weight, preferably 6 to 30% by weight, preferably 7 to 25% by weight, particularly preferably 10 to 20% by weight, based on the solution or dispersion.
- the solution or dispersion contains the solvent or dispersion medium in amounts of 20 to 70% by weight, in particular 25 to 65% by weight, preferably 30 to 60% by weight, preferably 35 to 50 wt .-%, based on the solution or dispersion contains.
- the solution or dispersion contains the alloy reagent in amounts of 5 to 60% by weight, in particular 10 to 45% by weight, preferably 15 to 45% by weight, preferably 20 to 40% by weight, based on the solution or dispersion.
- Another object of the present invention - according to a second aspect of the present invention - is a composition, in particular a precursor granulate, obtainable by the process described above.
- the composition according to the invention, in particular the precursor granulate is outstandingly suitable for producing materials containing silicon carbide and in particular objects containing silicon carbide.
- the silicon carbide-containing materials or objects can either be produced by additive manufacturing or also by gas phase deposition, in particular chemical vapor deposition (CVD), whereby fibers and foams, but also crystalline materials containing silicon carbide, are accessible, for example.
- CVD chemical vapor deposition
- the previously described reduced composition in particular the reduced precursor granulate, is particularly suitable for applications in additive manufacturing. Due to the higher density of the reduced precursor granulate, it is much easier to obtain compact, non-porous objects by means of additive manufacturing. Either the reduced or the non-reduced precursor granules can be used for all other applications, the non-reduced precursor granules generally being used due to the simple production and the low energy input.
- the composition according to the invention reference can be made to the above statements regarding the method according to the invention.
- Another object of the present invention - according to a third aspect of the present invention - is a liquid composition, in particular a suspension of a precursor granulate described above.
- the precursor granules obtained in granular form it is not only possible to use the precursor granules obtained in granular form, but it is also possible to suspend the precursor granules in a liquid which is applied to substrates by means of printing processes, for example, and then to convert them to objects containing silicon carbide. Under a suspension is in Understanding within the scope of the present invention a dispersion in which a solid phase is present dispersed in a liquid phase.
- a liquid composition contains the precursor granules usually in amounts of 5 to 60% by weight, in particular 10 to 50% by weight, preferably 20 to 40% by weight, preferably 25 to 35 wt .-%, based on the liquid composition.
- the liquid phase of the liquid composition this can be selected from all suitable organic solvents or water.
- the liquid phase of the liquid composition is preferably selected from alcohols, in particular ethanol, isopropanol or methanol, or acetone. Equally, it can be provided that a thickener is added to the liquid composition, in particular in the liquid phase, in order to adjust the viscosity in a targeted manner.
- the liquid composition in particular the suspension, can be applied in a suitable layer thickness.
- the liquid composition according to the invention in particular suspension, can in particular be used to emphasize layers of silicon carbide-containing materials, for example in wafer production, or for additive production by means of printing processes, in particular ink-jet processes.
- the liquid composition is applied to a substrate at least in some areas and then converted to silicon carbide-containing materials at temperatures of 1,600 ° C. to 2,100 ° C.
- Yet another object of the present invention - according to a fourth aspect of the present invention - is the use of a composition, in particular a precursor granulate for the production of granules containing silicon carbide or for the production of foams and / or fibers containing silicon carbide.
- a composition in particular a precursor granulate for the production of granules containing silicon carbide or for the production of foams and / or fibers containing silicon carbide.
- Processes for the production of electrode materials or also of fibers and foams are known in the prior art. For example, reference is also made to DE 10 2014 1 16 868 A1, DE 10 2015 100 062 A1 or US 2010/2000595 A1.
- the non-reduced composition in particular the non-reduced precursor granules, can be used for this type.
- Yet another object of the present invention - according to a fifth aspect of the present invention - is the use of a composition, in particular a precursor granulate, for the production of three-dimensional objects containing silicon carbide.
- the composition described above, in particular the precursor granulate is outstandingly suitable for the additive manufacturing of structures containing silicon carbide.
- the composition, in particular the precursor granulate is preferably obtained in a process for the production of three-dimensional objects, in particular workpieces, from compounds containing silicon carbide by means of additive manufacturing, the compounds containing silicon carbide being obtained from the composition, in particular the precursor granulate, by selective, in particular location-selective, energy input. used.
- the process allows in particular the simple production of almost any silicon carbide-containing materials - in particular from non-stoichiometric silicon carbides to silicon carbide-containing alloys for high-performance ceramics.
- the method also allows the creation of high-resolution and detailed three-dimensional structures, ie the course of edges is highly precise and in particular free of burrs. In the process, it is about it it is also possible to obtain compact solids which do not have a porous structure but consist of crystalline materials containing silicon carbide.
- the materials and three-dimensional objects obtainable with the method according to the invention thus have almost the properties of crystalline silicon carbide compounds in their material properties.
- the three-dimensional structures in a supported construction, especially in a powder bed process.
- the composition not exposed to the action of energy, in particular laser radiation can be used further, d. H.
- the method according to the invention can be carried out almost without undesired residues.
- the method according to the invention allows a very fast and inexpensive preparation of three-dimensional objects containing silicon carbide and in particular does not require the use of pressure in order to provide compact non-porous and non-porous materials.
- the reaction to the target connections can take place in a variety of ways.
- the precursor compounds are cleaved under the action of energy, in particular under the action of a laser beam, and pass into the gas phase as reactive particles. Since silicon and carbon as well as optionally doping or alloying elements are immediately adjacent in the gas phase due to the special composition of the precursor, the silicon carbide or the doped silicon carbide or the only sublime from 2,300 ° C. is different
- Silicon carbide alloy In particular, crystalline silicon carbide absorbs laser energy much less well than the precursor granulate and conducts heat very well, so that the defined silicon carbide compounds are deposited in a strictly localized manner. In contrast, undesired constituents of the precursor compound form stable gases, such as C0 2 , FICI, FI2O etc. and can be removed via the gas phase.
- a protective gas atmosphere in particular a nitrogen and / or argon atmosphere, preferably an argon atmosphere.
- the process according to the invention is generally carried out under a protective gas atmosphere so that, in particular, carbon-containing precursor compounds are not oxidized. If the procedure is under an argon atmosphere, is carried out, it is usually also an inert gas atmosphere, since argon does not react with the precursor compounds under the process conditions.
- nitrogen is used as the protective gas, silicon nitrides in particular can also be formed. This may be desirable, for example, when the silicon carbide is additionally mixed with nitrogen.
- the process according to the invention is carried out under an argon atmosphere.
- the energy input takes place by means of radiation energy, in particular by laser radiation.
- the energy input in particular by means of laser radiation, takes place with a resolution of 0.1 to 150 pm, in particular 1 to 100 gm, preferably 10 to 50 pm. In this way it is possible to position objects from the precursor granulate that are particularly rich in contrast and sharply delimited or rich in detail.
- the resolution of the energy input in particular a laser beam, generally represents the lower limit of the resolution for interfaces and details of the object produced.
- the energy input can also be limited locally by using masks. However, the use of laser beams is preferred.
- the resolution of the energy input is to be understood in particular as the minimum width of the area of energy input. It is usually limited by the cross-sectional area of the laser beam or dimensioning of the mask.
- the additive manufacturing is carried out using a method similar to selective laser melting (SLM): selective synthetic crystallization (SSC).
- SLM selective laser melting
- SSC selective synthetic crystallization
- the object is not created from the melt, but from the gas phase.
- the apparatus structure and the implementation of the selective synthetic crystallization correspond to the selective laser melting, ie for the selective synthetic crystallization the same devices can be used under very similar conditions as for the selective laser melting.
- the energy required to convert the starting materials into the gas phase can be introduced into the precursor granules by laser radiation.
- the method is carried out as a multi-stage method. In this context, it is particularly envisaged that
- the composition in particular the precursor granulate, is provided in the form of a layer, in particular a layer,
- the composition in particular the precursor granules, is converted into a silicon-carbide-containing compound by the action of energy, in particular at least in regions, so that a layer of the three-dimensional object is produced , and
- step (c) in a third method step following the second method step (b), a further layer, in particular layer, of the composition, in particular of the precursor granules, onto the layer of the composition which has been converted, in particular at least in regions, in the second method step (b), in particular of the precursor granulate, the process steps (b) and (c) being repeated until the three-dimensional object is finished.
- method step (b) is carried out after method step (c).
- the method is thus carried out in particular as a so-called powder bed method, in which the three-dimensional object to be produced is produced in layers from a powder by selective introduction of energy.
- a three-dimensional representation of the object to be produced is usually generated by means of computer technology, in particular as a CAD file, which is transferred to a corresponding layer attachment and then successively, ie. H. Layer by layer, by means of additive manufacturing, in particular by means of selective synthetic crystallization. In this way, the finished three-dimensional object is finally obtained.
- the precursors are selected and in particular matched to the selective synthetic crystallization in such a way that a homogeneous, compact three-dimensional body is obtained directly from the gas phase and does not have to be subjected to sintering.
- one layer, in particular one layer, of the composition has a thickness, in particular a layer thickness, of 1 to 1,000 ⁇ m, in particular 2 to 500 ⁇ m, preferably 5 to 250 ⁇ m, preferably 10 to 180 ⁇ m, particularly preferably 20 to 150 ⁇ m, very particularly preferably 20 to 100 pm.
- thicknesses of the layers, in particular layer thicknesses, in the areas mentioned above for the composition detailed three-dimensional objects can be generated with a high resolution.
- the silicon carbide-containing object to be produced can be additively produced on a substrate, for example a carrier plate or a complex-shaped body, which is later detached from the object containing silicon carbide.
- the substrate can also consist of a workpiece with which the additively manufactured object subsequently remains firmly connected.
- Particularly suitable as substrates or existing objects are workpieces made of materials with a relatively high melting point and with a material structure that ensures a relatively good connection with silicon carbide. Silicon carbide and silicon carbide-containing compounds, ceramic materials and metals are particularly suitable as substrate materials for these applications.
- objects can be made from silicon carbide alloys that have layers with different properties, or e.g. Layers of silicon carbide containing materials on metals, e.g. Tool steel, apply.
- precursors in a suitable manner to complex-shaped substrates and to transform them there in particular with a laser into compounds containing silicon carbide
- it can be provided according to one embodiment of the present invention, in accordance with the method known in metal additive manufacturing as "build-up welding", very small amounts from precursor Granularly selectively apply granulate with the aid of a suitable arrangement, in particular a granulate jet, and immediately process it with the laser.
- FIG. 1 shows a cross section along an xy plane of a device for carrying out a method for producing three-dimensional objects from the precursor granules according to the invention
- FIG. 2 shows an enlarged detail from FIG. 1, which represents in particular the three-dimensional object produced.
- FIG. 1 shows a section through a device for producing three-dimensional silicon carbide-containing objects by means of selective laser sintering along an xy plane.
- the device 1 has in a xy plane, which is perpendicular to an xz plane, a construction field, the construction field extension 2 of which in the x direction is shown in FIG. 1.
- a three-dimensional object is generated on the construction field from a powdery composition 3, in particular a precursor granulate described above, by selective irradiation of laser beams 4.
- the construction field is at least partially movable by the piston 6 in the z direction, in particular along a z axis which is perpendicular to the xy plane.
- the entire construction field is designed to be movable by means of the piston 6 over its construction field extension 2, in particular the entire extension of the construction field in the x and y directions.
- the construction field shown in the figure has a powder bed made from composition 3 according to the invention, in particular the precursor granulate according to the invention.
- Adjacent to the construction site are storage facilities 7 for receiving and dispensing the composition 3.
- the Vorra processing devices 7 are provided with pistons movable in the z direction, in particular along a z axis, so that by moving the piston in the z direction either a space in the storage device 7 for receiving the composition 3 is created or the composition is pressed out of the storage device 7, in particular in the area of the construction site.
- the composition 3 After delivery from the storage device 7, the composition 3 is distributed in a homogeneous, uniform layer on the construction field by a distribution device 8, wherein excess composition 3 can always be taken up in an opposite storage device 7.
- the distribution device 8 is shown in the figure by way of example in the form of a scooter.
- the device 1 has means for generating laser beams, in which laser beams 4 are generated.
- the laser beams 4 can be deflected onto the construction field via deflection means 10, in particular at least one mirror arrangement, so that the three-dimensional object 5 is obtained there.
- a thin layer of the composition 3 is now presented on the construction site and then heated and melted by selective spatially resolved irradiation of laser beams 4 generated in the means for generating laser beams 9 and deflected via the deflecting means 10 or split into its components, so that a layer of a silicon carbide-containing compound is obtained.
- composition 3 is dispensed from a storage device 7, which is distributed homogeneously with the distribution device 8 in the form of a thin layer on the construction area. This creates a new layer of the composition 3, which can then be irradiated. Excess composition 3 is taken up again in the opposite storage device 7. The layer is then irradiated and heated in a location-selective manner by the laser beams 4, as a result of which a new layer of the three-dimensional object 5 is produced from a material containing silicon carbide. The three-dimensional object 5 is finally built up by repeating these method steps.
- FIG. 2 shows an enlarged section of the construction field, in particular FIG.
- FIG. 2 shows the different layers 11 made of material containing silicon carbide, which build up the three-dimensional object 5.
- the individual layers 11 are only shown to illustrate the present invention.
- the individual layers are usually not recognizable on the three-dimensional object 5, since homogeneous objects made of material containing silicon carbide are obtained by the method described.
- invert sugar syrup solution with a sugar content of 72.2% in a mixture of 35 ml of fully demineralized water and 1 10 ml of ethanol (purity> 99% with 1% methyl ethyl ketone as denaturant) and 8.70 g of anhydrous citric acid and heated to 70 ° C.
- tetraethyl orthosilicate tetraethoxysilane
- a colorless dry granulate is formed, which can be adjusted to particle sizes between 2 cm and 100 pm by using different stirrers and adjusting the stirring speeds.
- the colorless granulate is suitable for a large number of applications for the production of materials containing silicon carbide, in particular silicon carbide granules, silicon carbide wafers, for the production of foams and fibers from silicon carbide by means of CVD methods (chemical vapor deposition) or also in additive manufacturing processes.
- CVD methods chemical vapor deposition
- the colorless granules are heated to temperatures of 500 to 800 ° C. under protective gas and in a vacuum. This gives cocoa-colored to black granules, the density of which is increased by approximately 10 to 20% compared to the colorless granules described above and which is referred to below as reduced granules.
- the reduced dark granulate is outstandingly suitable for additive manufacturing, in particular for powder bed processes, such as, for example, the selective synthetic crystallization described above or selective laser sintering. Likewise, the reduced dark granules can be excellent In this way, material-applying processes such as build-up welding can also be carried out.
- invert sugar syrup solution with a 72.2% sugar content are mixed with 140 ml of fully deionized water and 27.1 g of pyrogenic silica with an average particle size of 200 nm and heated to 70 ° C. for 30 minutes with stirring . The water is then quickly removed in vacuo (30 mbar).
- a colorless dry granulate is obtained, which can be adjusted to particle sizes between 2 cm and 100 pm by using different stirrers and adjusting the stirring speeds.
- the colorless granules correspond in their properties and possible uses to the precursor granules described under 1.).
- the colorless granules are heated to temperatures of 500 to 800 ° C. under protective gas and in a vacuum. This gives cocoa-colored to black granules, the density of which is increased by approximately 10 to 20% compared to the colorless granules described above and which is referred to below as reduced granules.
- the reduced granules obtained correspond in all points to the reduced granules described under 1.).
- Composition 9 Means for producing lasers
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Abstract
Description
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DE102018127877.2A DE102018127877A1 (de) | 2018-11-08 | 2018-11-08 | Präkursormaterial für die Herstellung siliciumcarbidhaltiger Materialien |
PCT/EP2019/080382 WO2020094711A1 (de) | 2018-11-08 | 2019-11-06 | Präkursormaterial für die herstellung siliciumcarbidhaltiger materialien |
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US (1) | US20220002163A1 (de) |
EP (1) | EP3877330A1 (de) |
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GB9023268D0 (en) * | 1990-10-25 | 1990-12-05 | Nat Res Dev | Sol-gel method of making silicon carbide and of protecting a substrate |
DE102007045178A1 (de) | 2007-09-21 | 2009-04-02 | Robert Bosch Gmbh | Kraftstofffördermodul |
KR101190202B1 (ko) * | 2010-05-04 | 2012-10-12 | 한국과학기술연구원 | 에멀젼 전기 방사법을 이용한 탄화규소 나노섬유의 제조방법 및 이에 따라 제조된 탄화규소 나노섬유 |
KR102007358B1 (ko) * | 2012-09-28 | 2019-08-05 | 엘지이노텍 주식회사 | 탄화규소 분말 및 이의 제조 방법 |
US9657409B2 (en) * | 2013-05-02 | 2017-05-23 | Melior Innovations, Inc. | High purity SiOC and SiC, methods compositions and applications |
US9630854B2 (en) * | 2013-06-26 | 2017-04-25 | Bridgestone Corporation | Silicon carbide powder |
DE102014116868A1 (de) | 2014-11-18 | 2016-05-19 | Universität Paderborn | Verfahren zum Herstellen eines Elektrodenmaterials für eine Batterieelektrode |
DE102015100062A1 (de) | 2015-01-06 | 2016-07-07 | Universität Paderborn | Vorrichtung und Verfahren zum Herstellen von Siliziumcarbid |
DE102015105085A1 (de) | 2015-04-01 | 2016-10-06 | Universität Paderborn | Verfahren zum Herstellen eines Siliziumcarbid-haltigen Körpers |
WO2017029673A1 (en) * | 2015-08-19 | 2017-02-23 | Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd | 3d polymerizable ceramic inks |
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2018
- 2018-11-08 DE DE102018127877.2A patent/DE102018127877A1/de not_active Withdrawn
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2019
- 2019-11-06 US US17/291,505 patent/US20220002163A1/en not_active Abandoned
- 2019-11-06 EP EP19800991.2A patent/EP3877330A1/de not_active Withdrawn
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