EP3868924A4 - Procédé de suppression d'augmentation de la concentration en zinc dans une solution de placage, et procédé de production d'élément de placage à base de zinc - Google Patents
Procédé de suppression d'augmentation de la concentration en zinc dans une solution de placage, et procédé de production d'élément de placage à base de zinc Download PDFInfo
- Publication number
- EP3868924A4 EP3868924A4 EP20886179.9A EP20886179A EP3868924A4 EP 3868924 A4 EP3868924 A4 EP 3868924A4 EP 20886179 A EP20886179 A EP 20886179A EP 3868924 A4 EP3868924 A4 EP 3868924A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- zinc
- suppressing increase
- plating solution
- producing
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019214897A JP6750186B1 (ja) | 2019-11-28 | 2019-11-28 | めっき液の亜鉛濃度の上昇を抑制する方法および亜鉛系めっき部材の製造方法 |
PCT/JP2020/031629 WO2021106291A1 (fr) | 2019-11-28 | 2020-08-21 | Procédé de suppression d'augmentation de la concentration en zinc dans une solution de placage, et procédé de production d'élément de placage à base de zinc |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3868924A1 EP3868924A1 (fr) | 2021-08-25 |
EP3868924A4 true EP3868924A4 (fr) | 2022-03-09 |
Family
ID=72240854
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20886179.9A Withdrawn EP3868924A4 (fr) | 2019-11-28 | 2020-08-21 | Procédé de suppression d'augmentation de la concentration en zinc dans une solution de placage, et procédé de production d'élément de placage à base de zinc |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220298668A1 (fr) |
EP (1) | EP3868924A4 (fr) |
JP (1) | JP6750186B1 (fr) |
CN (1) | CN113195798A (fr) |
MX (1) | MX2021007195A (fr) |
WO (1) | WO2021106291A1 (fr) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100155257A1 (en) * | 2006-06-21 | 2010-06-24 | Atotech Deutschland Gmbh | Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatings |
US8282806B2 (en) * | 2008-11-11 | 2012-10-09 | Enthone Inc. | Galvanic bath and process for depositing zinc-based layers |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2084191A (en) * | 1980-09-23 | 1982-04-07 | Vandervell Products Ltd | Electro-deposition of alloys |
DE19834353C2 (de) | 1998-07-30 | 2000-08-17 | Hillebrand Walter Gmbh & Co Kg | Alkalisches Zink-Nickelbad |
US8377283B2 (en) * | 2002-11-25 | 2013-02-19 | Coventya, Inc. | Zinc and zinc-alloy electroplating |
US7135103B2 (en) * | 2003-10-20 | 2006-11-14 | Waseda University | Preparation of soft magnetic thin film |
JP4822268B2 (ja) * | 2005-04-19 | 2011-11-24 | ユケン工業株式会社 | 回収型電気亜鉛めっき方法および装置 |
JP4738910B2 (ja) * | 2005-06-21 | 2011-08-03 | 日本表面化学株式会社 | 亜鉛−ニッケル合金めっき方法 |
US20160024683A1 (en) * | 2013-03-21 | 2016-01-28 | Atotech Deutschland Gmbh | Apparatus and method for electrolytic deposition of metal layers on workpieces |
-
2019
- 2019-11-28 JP JP2019214897A patent/JP6750186B1/ja active Active
-
2020
- 2020-08-21 EP EP20886179.9A patent/EP3868924A4/fr not_active Withdrawn
- 2020-08-21 MX MX2021007195A patent/MX2021007195A/es unknown
- 2020-08-21 WO PCT/JP2020/031629 patent/WO2021106291A1/fr unknown
- 2020-08-21 US US17/297,470 patent/US20220298668A1/en not_active Abandoned
- 2020-08-21 CN CN202080006376.7A patent/CN113195798A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100155257A1 (en) * | 2006-06-21 | 2010-06-24 | Atotech Deutschland Gmbh | Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatings |
US8282806B2 (en) * | 2008-11-11 | 2012-10-09 | Enthone Inc. | Galvanic bath and process for depositing zinc-based layers |
Non-Patent Citations (2)
Title |
---|
See also references of WO2021106291A1 * |
WEI ET AL: "Selection of an anode for acid zinc-nickel electroplating", METAL FINISHING : DEVOTED EXCLUSIVELY TO METALLIC SURFACE TREATMENTS, ELSEVIER, NEW YORK, NY, US, vol. 97, no. 2, 1 February 1999 (1999-02-01), pages 84 - 86, XP005273900, ISSN: 0026-0576, DOI: 10.1016/S0026-0576(99)80250-5 * |
Also Published As
Publication number | Publication date |
---|---|
JP6750186B1 (ja) | 2020-09-02 |
WO2021106291A1 (fr) | 2021-06-03 |
JP2021085068A (ja) | 2021-06-03 |
US20220298668A1 (en) | 2022-09-22 |
CN113195798A (zh) | 2021-07-30 |
EP3868924A1 (fr) | 2021-08-25 |
MX2021007195A (es) | 2022-03-18 |
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