EP3868924A4 - Verfahren zur unterdrückung der erhöhung der zinkkonzentration in einer plattierungslösung und verfahren zur herstellung einer beschichtung auf zinkbasis - Google Patents

Verfahren zur unterdrückung der erhöhung der zinkkonzentration in einer plattierungslösung und verfahren zur herstellung einer beschichtung auf zinkbasis Download PDF

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Publication number
EP3868924A4
EP3868924A4 EP20886179.9A EP20886179A EP3868924A4 EP 3868924 A4 EP3868924 A4 EP 3868924A4 EP 20886179 A EP20886179 A EP 20886179A EP 3868924 A4 EP3868924 A4 EP 3868924A4
Authority
EP
European Patent Office
Prior art keywords
zinc
suppressing increase
plating solution
producing
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20886179.9A
Other languages
English (en)
French (fr)
Other versions
EP3868924A1 (de
Inventor
Toshihiro Sugiura
Yasunori Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yuken Industry Co Ltd
Original Assignee
Yuken Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yuken Industry Co Ltd filed Critical Yuken Industry Co Ltd
Publication of EP3868924A1 publication Critical patent/EP3868924A1/de
Publication of EP3868924A4 publication Critical patent/EP3868924A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/06—Filtering particles other than ions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
EP20886179.9A 2019-11-28 2020-08-21 Verfahren zur unterdrückung der erhöhung der zinkkonzentration in einer plattierungslösung und verfahren zur herstellung einer beschichtung auf zinkbasis Withdrawn EP3868924A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019214897A JP6750186B1 (ja) 2019-11-28 2019-11-28 めっき液の亜鉛濃度の上昇を抑制する方法および亜鉛系めっき部材の製造方法
PCT/JP2020/031629 WO2021106291A1 (ja) 2019-11-28 2020-08-21 めっき液の亜鉛濃度の上昇を抑制する方法および亜鉛系めっき部材の製造方法

Publications (2)

Publication Number Publication Date
EP3868924A1 EP3868924A1 (de) 2021-08-25
EP3868924A4 true EP3868924A4 (de) 2022-03-09

Family

ID=72240854

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20886179.9A Withdrawn EP3868924A4 (de) 2019-11-28 2020-08-21 Verfahren zur unterdrückung der erhöhung der zinkkonzentration in einer plattierungslösung und verfahren zur herstellung einer beschichtung auf zinkbasis

Country Status (6)

Country Link
US (1) US20220298668A1 (de)
EP (1) EP3868924A4 (de)
JP (1) JP6750186B1 (de)
CN (1) CN113195798A (de)
MX (1) MX2021007195A (de)
WO (1) WO2021106291A1 (de)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100155257A1 (en) * 2006-06-21 2010-06-24 Atotech Deutschland Gmbh Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatings
US8282806B2 (en) * 2008-11-11 2012-10-09 Enthone Inc. Galvanic bath and process for depositing zinc-based layers

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2084191A (en) * 1980-09-23 1982-04-07 Vandervell Products Ltd Electro-deposition of alloys
DE19834353C2 (de) 1998-07-30 2000-08-17 Hillebrand Walter Gmbh & Co Kg Alkalisches Zink-Nickelbad
US8377283B2 (en) * 2002-11-25 2013-02-19 Coventya, Inc. Zinc and zinc-alloy electroplating
US7135103B2 (en) * 2003-10-20 2006-11-14 Waseda University Preparation of soft magnetic thin film
JP4822268B2 (ja) * 2005-04-19 2011-11-24 ユケン工業株式会社 回収型電気亜鉛めっき方法および装置
JP4738910B2 (ja) * 2005-06-21 2011-08-03 日本表面化学株式会社 亜鉛−ニッケル合金めっき方法
US20160024683A1 (en) * 2013-03-21 2016-01-28 Atotech Deutschland Gmbh Apparatus and method for electrolytic deposition of metal layers on workpieces

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100155257A1 (en) * 2006-06-21 2010-06-24 Atotech Deutschland Gmbh Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatings
US8282806B2 (en) * 2008-11-11 2012-10-09 Enthone Inc. Galvanic bath and process for depositing zinc-based layers

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
See also references of WO2021106291A1 *
WEI ET AL: "Selection of an anode for acid zinc-nickel electroplating", METAL FINISHING : DEVOTED EXCLUSIVELY TO METALLIC SURFACE TREATMENTS, ELSEVIER, NEW YORK, NY, US, vol. 97, no. 2, 1 February 1999 (1999-02-01), pages 84 - 86, XP005273900, ISSN: 0026-0576, DOI: 10.1016/S0026-0576(99)80250-5 *

Also Published As

Publication number Publication date
JP6750186B1 (ja) 2020-09-02
WO2021106291A1 (ja) 2021-06-03
JP2021085068A (ja) 2021-06-03
US20220298668A1 (en) 2022-09-22
CN113195798A (zh) 2021-07-30
EP3868924A1 (de) 2021-08-25
MX2021007195A (es) 2022-03-18

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