EP3797566A1 - Circuit carrier having an installation place for electronic components, electronic circuit and production method - Google Patents

Circuit carrier having an installation place for electronic components, electronic circuit and production method

Info

Publication number
EP3797566A1
EP3797566A1 EP19766184.6A EP19766184A EP3797566A1 EP 3797566 A1 EP3797566 A1 EP 3797566A1 EP 19766184 A EP19766184 A EP 19766184A EP 3797566 A1 EP3797566 A1 EP 3797566A1
Authority
EP
European Patent Office
Prior art keywords
circuit carrier
recess
depot
circuit
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19766184.6A
Other languages
German (de)
French (fr)
Inventor
Matthias Heimann
Christian Schellenberg
Robby Urbahn
Klaus Wilke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP3797566A1 publication Critical patent/EP3797566A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
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    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/32227—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the layer connector connecting to a bond pad of the item
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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    • H01L2224/83909—Post-treatment of the layer connector or bonding area
    • H01L2224/83951—Forming additional members, e.g. for reinforcing, fillet sealant
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/09036—Recesses or grooves in insulating substrate
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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    • H05K2201/09209—Shape and layout details of conductors
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    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
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    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Definitions

  • Circuit carrier with a slot for electronic components, electronic circuit and manufacturing process
  • the invention relates to a circuit carrier with an installation space for an electronic component.
  • the invention relates to an electronic circuit with such a circuit carrier.
  • the invention also relates to a method for producing a circuit carrier, in which an installation space for an electronic component is generated.
  • the invention also relates to a method for producing an electronic assembly in which such a scarf device carrier is used.
  • Circuit carriers and electronic circuits are widely used in common products.
  • power electronics circuits which are used, for example, in rectifiers and converters.
  • Good thermal and electrical contacting of power semiconductors in such power electronic circuits must be ensured so that their function is unrestricted.
  • the good thermal and electrical properties with a low overall height must be guaranteed by the contact structure. If the overall height is reduced, however, the use of an insulation medium is mainly required around the outside of the power component. Particularly in the case of planar chip top contacts of power semiconductors, these areas of the chip edges and the adjoining line areas passivated on the chip must be filled with the insulation medium. For perfect insulation it is necessary that this backfill is bubble-free. However, this represents a technical challenge.
  • the insulation material which is also referred to as the underfill material, must ensure that during the filling process, outgassing from the joint zone finds its way out and does not form bubbles in the underfill material. Especially with sintered joining zones, which are good for a thermal structure are suitable, outgassing often leads to bubbles during backfilling.
  • the following underfill materials are used as backfill materials: epoxy resins optimized for underflows with and without fillers.
  • the object of the invention is therefore to provide a scarf device carrier with a slot for electronic components or an electronic circuit with such a circuit carrier, in which the possibility of a bubble-free filling with an underfill material is improved. It is also an object of the invention to provide a method for producing such a circuit carrier and a method for producing such an electronic assembly, with this method supporting a bubble-free filling with underfill material.
  • the installation space has at least one recess or surface structuring at its edge which forms a depression in the surface of the circuit carrier.
  • Surface structuring means an adaptation of the surface in such a way that it is used as a flow obstacle for the underfill material. This can be achieved, for example, by roughening the surface with a laser, for example. Due to the fact that the surface structuring provides a different surface, this represents a flow obstacle for the underfill material. This is achieved according to the invention by making the structured surface more difficult to wet than the rest of the surface of the circuit carrier or the layers thereon. The advantages of the invention are explained below with reference to the recesses.
  • a recess which is designed as a recess, has the advantage when filling the gap between the component and the circuit carrier that the recess tion remains free of underfill material for longer than the remaining gap between the component and the circuit carrier. This makes it possible for outgassing to escape from this joint gap (hereinafter referred to as gap) during the backfilling while the underfill material is spreading in the gap.
  • the underfill material forms a flow front.
  • the recess is arranged at the edge of the installation location in such a way that the flow front can run towards this gap. This means that the recess is only closed by the underfill material so that the recess can transport the outgassing to the outside until the very end. The formation of bubbles is therefore advantageously avoided.
  • the edge of the slot is defined by the outer edge of the component to be built. In other words, when designing the installation space on the circuit carrier, it must be taken into account which dimensions the component has to be assembled.
  • the recess is then rich in the imaginary outer edge of the component in the scarf device carrier. For example, this can be done in such a way that part of the recess lies within the installation space and part of the recess lies outside the installation space.
  • the gap should be chosen as narrow as possible.
  • a sintered material is used as the contacting material, very narrow gaps can advantageously be realized.
  • conventional contact deposits made of sintered material these can be, for example, in a range from 20 micrometers to 100 micrometers
  • the installation locations are usually quite angular or square, preferably also U-shaped. It is particularly advantageous if the recesses are arranged on the edge of the old construction site in such a way that they are in the middle between the corners of the slot. An underfilling of the gap can then take place particularly advantageously starting from the corners, so that the flow fronts move from the corners of the installation site to the recesses and fill the recesses last. If the flow front reaches the recess faster from one corner than from the other corner, the recess advantageously represents a flow obstacle, since the underfill material has to overcome resistance to the edge of the recess, that is, the edge of the to overcome the recess forming recess.
  • the recess advantageously remains open for a long time for outgassing and finally only when the flow fronts of the underfill material meet from opposite directions on the recess.
  • the result is a bubble-free or at least largely bubble-free underfill result.
  • the filler would preferably flow from the center of the one building site to the corners if this was added to the middle of the one building site.
  • the recess consists of a slot or a preferably circular opening which extends perpendicular to the edge of the installation space.
  • the recess at the edge of the installation space should pass through the imaginary edge of the component, so that the recess can transport outgassing outwards from the installation location.
  • a slot which runs perpendicular to the edge of the installation space, can lie on both sides of the edge of the installation space and therefore fulfills this task particularly well.
  • such a slot can advantageously be easily produced, for example, by micro milling or laser processing.
  • the depression is provided in an insulation layer forming the surface of the circuit carrier, in particular consisting of a solder resist, and / or in a metallization on the circuit device carrier.
  • the depression for example the slot
  • all layers of the layer structure of the circuit carrier are available for its formation.
  • the insulation layer is normally brought up to the installation location and ends at a certain distance from the installation location so that it can be reliably kept free of insulating material. If this layer consists, for example, of a solder resist, this is usually developed photochemically.
  • the recesses can be taken into account from the beginning and can be formed in situ with the production using the solder stop layer.
  • the metallization is applied as a bearing on the circuit board and is structured to form contact areas and conductor tracks.
  • the recess can advantageously be produced in situ during processing.
  • the recesses can be formed, for example, by micro-milling or laser processing. These methods have the advantage of very high accuracy, so that the recesses can be made precisely. In particular, the sharp edges of the depression required to stop the flow front of the underfill material can be produced by these methods. be trained. In addition, it is also possible to use milling or laser processing to produce recesses which extend down into the material of the circuit carrier. Deeper recesses have the advantage that outgassing can be transported to the outside even more reliably.
  • a depot of a joining aid, in particular a sintered material is applied to the installation location.
  • the circuit carrier is usually already provided with joining aid.
  • This can be solder material, which is applied, for example, as a paste using mask technology. If printing errors occur during this process that lead to the openings being filled, this can be determined optically before the components are installed, so that this error can be rejected or corrected at an early stage.
  • the depot can also consist of a sintered material. This can also be printed from sinter paste. Here, the information given above for the application of solder material applies accordingly. Alternatively, preforms (molded parts) can also be used, which can advantageously be produced particularly precisely. These are fixed in place or placed directly before assembly of the component.
  • the depot consists of a sintered material, with a molding being provided at the edge of the depot.
  • the depot consists of a sintered material, it is possible to provide formations which have a comparatively fine geometry. This is because the sintered pots essentially maintain their shape during joining (apart from shrinkage), so that these fine structures are retained. This is different with solder W erkstoffen which are sealed up to prepare the compound. Here, fine formations would be lost due to the surface tension of the liquid solder material.
  • the formations advantageously support the diversion of outgassing during the filling of the gap with underfill material.
  • the formations have the task of guiding the underfill material in a certain direction when its flow front arrives at the form, so that, for example, it can be prevented from penetrating into areas in which bubbles can be enclosed.
  • the formations can also advantageously be used in such a way that the flow front is directed towards a flow obstacle such as a recess in the form of a recess (more on this below).
  • the recesses which provide an edge of the depression as a flow obstacle, then cause the flow front to be stopped until the recess also fills with underfill material at the end. Until then, the recess can be used as a channel for transporting outgassing.
  • the formations can be prevented by redirecting the flow fronts or by stopping the flow fronts, the underfill material, which fills the gap from different corners of an installation space, flows together too early and thus prevents outgassing with the consequence of bubbles would.
  • the formations can be arranged in the middle between two corners if one assumes square or rectangular installation spaces.
  • a structure which consists of sintering
  • the fabric protrudes and thus forms an obstacle that stops or deflects an underfill material flowing along the depot.
  • the shape has the shape of a wedge that protrudes from the edge of the depot.
  • a wedge-shaped shape is arranged so that the wedge lies on its triangular surface, so to speak.
  • the wedge-shaped shape as a prism with a triangular base, this prism with one of its side faces on the depot
  • the width of the wedge corresponds exactly to the height of the depot.
  • the wedge fills the gap over its entire gap height. Since the gap width is given by the height of the sintered deposit, this is only the case if the width of the wedge corresponds to the height of the deposit. As a result, the redirecting function of the formation is advantageously used most effectively. In addition, it is easiest to manufacture such a shape, which corresponds to the height of the sintered deposit.
  • a mask is used which has a mask opening containing the molding, the filling of this mask opening in addition to the deposit made of sintered material simultaneously producing the molding at the same height.
  • the shape can also have different geometries than that of a wedge.
  • This can also be cuboidal, for example, the cuboid adjoining the side of the deposit made of sintering paste, so to speak. It is also advantageous here if the cuboid has the same height as the depot.
  • the formation has the shape of a half cylinder, which connects with its flat side surface to the deposit made of sintered paste. It is also advantageous here if the height of this half cylinder corresponds to the height of the depot.
  • circuit carrier is designed according to one of claims 4 to 8, the electronic component being fastened to the depot of the joining aid.
  • the electronic circuit is an implementation in which the circuit carrier is used for the end product, which has already been explained in detail above. If such an electronic assembly is underfilled with underfill material, bubble-free underfill results can be achieved as a result, whereby the above object is achieved.
  • the bubble-free underfill material partially improves both the heat conduction and the electrical insulation in the electronic assembly.
  • a gap between the circuit carrier and the component is filled with an underfill material.
  • the object is alternatively achieved with the subject matter (method) specified at the outset according to the invention in that at least one recess is produced at the edge of the installation space, this being formed as a depression in the upper surface of the circuit carrier.
  • the product produced namely the circuit carrier, can advantageously be used to produce the electronic assembly explained above.
  • the advantages associated with this have already been mentioned and should not be mentioned again here.
  • the recess is produced by a machining process, in particular by milling or drilling.
  • cutting processes such as micromilling or drilling allow particularly high accuracies.
  • the necessary edges which form the edge of the depression, can be formed with sharp edges in the recesses.
  • Elongated recesses can be created during milling. Depending on whether the axis of rotation of the milling head is perpendicular or parallel to the surface of the circuit carrier, the elongated recesses can have a sharp edge all around or have a tapered edge at their ends. The tapered edge at the end of the recesses can be used as a flow aid so that the recess is still filled with underfill material at the end of the underfilling process.
  • recess is produced by structuring a layer, in particular by structuring an insulation layer on the circuit board.
  • a depot made of a joining aid is brought up or attached to the installation location.
  • the depots made of the joining aid in particular the sintered material, can be applied to the circuit carrier prior to the assembly of the electronic components.
  • the quality of this interim result (before assembly of the Depots) can then be inspected before final assembly takes place.
  • An electronic component is attached to the depot,
  • the underfill material is introduced into the gap in an area outside the at least one recess, preferably exactly in the middle between two recesses.
  • the underfill material expands when it is introduced in the middle between two recesses, advantageously to the sides. If this is not the case, the recesses serve as a flow obstacle to eliminate these irregularities. Reliable outgassing is therefore easily possible. If, as already explained, a square or rectangular installation space is provided and the recesses are provided in the middle of the side edges, the middle between the recesses is usually at the corners (in the case of square installation spaces or near the corners also in the case of rectangular installation spaces). Further details of the invention are described below with reference to the drawing. The same or corresponding drawing elements are each provided with the same reference characters and are only explained to the extent that there are differences between the individual figures.
  • the described components of the embodiments each represent individual features of the invention that are to be considered independently of one another, and which also further develop the invention independently of one another and are therefore also to be regarded individually or in a combination other than that shown as part of the invention . Furthermore, the described embodiments can also be supplemented by further features of the invention already described.
  • FIG. 1 shows an exemplary embodiment of the electronic assembly according to the invention with an exemplary embodiment of the circuit carrier according to the invention as a sectional view
  • FIG. 2 shows the supervision of an exemplary embodiment of the circuit carrier according to the invention
  • FIG. 8 shows a metallization with recesses as an embodiment of the circuit carrier according to the invention as a view
  • FIG. 9 shows the circuit carrier according to FIG. 8 with sintered paste depots attached as a top view
  • FIG. 10 shows a mask with which the embodiment of the sinter paste depots according to FIG. 9 can be printed.
  • an electronic circuit 11 which has a circuit carrier 12 and electronic components 13.
  • the electronic components 13 are each provided in slots 14 of the circuit carrier 12.
  • the installation locations 14 result from openings being formed in an insulation layer 15 from a solder resist.
  • a depot 16 is provided on the surface of the circuit carrier 12 (see, for example, FIG. 3), a sintered connection 17 was melted down.
  • a remaining gap 18 is filled with an underfill material 19 which closes the gap between the component 13 and the circuit carrier 12.
  • the electronic circuit 11 has a cover plate 20 which is in each case connected to the respective upper sides of the components 13 via a further sintered connection 21.
  • the electronic circuit 11 is shown without any recesses 22 or from moldings 23 (but compare Figures 3 to 7).
  • the shapes and recesses shown in these figures can, however, lie in front of or behind the cutting plane which is shown in Figure 1. If so, the variants according to the figures mentioned can be introduced into the electronic circuit 11 according to FIG. 1.
  • FIG. 1 also shows a structure of how it would look according to the prior art without any recesses and shapes.
  • a structure was produced for text purposes, this structure being cut in section plane II-II in accordance with FIG. 1. It can be seen in this sectional plane a grinding surface, which is formed by the Sinterver bond 17. This sintered connection 17 is from surrounded the underfill material 19. Because the electronic
  • Circuit 11 according to FIG. 2 was produced without recesses and formations, bubbles 24 were created in the underfill material during casting of the gap 18 (see same FIG. 1), which originated from the sintering connection 17 by outgassing. This formation of bubbles is to be prevented with the inventive formations and recesses.
  • FIG. 2 also shows contact structures 25, which are used for connecting the electronic component 21 (see FIG. 1) that is not shown in FIG. 2.
  • FIG. 3 shows a section of the electronic assembly, which can be constructed according to FIG. 1.
  • the cutout represents an edge of the recess 14, in which the component 13 can also be seen.
  • the edge of the recess 14 is formed by the insulation layer 15 below the component 13.
  • the insulation layer 15 does not reach the depot 16 made of a sintered material which is brought up on a contact layer which is part of a structured metallization 26.
  • the metallization 26 and the insulation layer 15 are each located on the surface 27 of the circuit carrier 12.
  • the recess 22 can be seen, which was made in the insulation layer 15. This has been done by a micro milling cutter, which can be seen from the fact that the recess 22 runs outwards.
  • the recess is therefore a slot in the insulation layer 15 through which the section of FIG. 3 runs in the longitudinal direction.
  • the slot could also be produced, for example, by an etching process or laser processing.
  • the shape 23 can also be seen, which is connected differently to the depot 26 and can be, for example, wedge-shaped, the shape of a half-cylinder or cuboid.
  • this formation 23 connects in the middle of the depot 16 to the outside and projects from it (hence the term formation).
  • the sintered deposits 16 have the advantage that this shape is retained even after the heat treatment for the purpose of joining the sintered connection, since the sintered bodies which form the deposits 16 remain dimensionally stable during the joining.
  • the respective geometry of the formations can also be seen in FIGS. 5 to 7. These have the height of the depot 16 and are each connected to the outer edges.
  • the formation consists of a wedge. In other words, this is a triangular prism, which adjoins one of its three side surfaces on the outside of the depot 16 and thus protrudes from the side edge with the opposite tip.
  • the base and the top surface of this prism are thus on the level of the bottom and the top of the depot 16, respectively.
  • the shape is as a half cylinder, which protrudes with the part of the round outer surface from the outside and lies with the straight cut surface on the side surface of the depot 16. Base and top surface are thus again with the top and bottom of the depot 16 on one level.
  • the formation 23 is cube-shaped, one of the side surfaces of this cube lying on the side surface of the depot 16.
  • the upper and the lower side of the cube each form a common surface with the top and the bottom of the depot 16.
  • FIG. 4 a variant of the electrical circuit 11 according to FIG. 3 is shown, which only differs in that both a shape 23 and a recess 22 are used together. If the gap 18 is filled with the solder material, both the recess 22 and the formation 23 both act in their own way in order to conduct the underfill material 19. This flows both in the embodiment according to FIG. 3 and in the embodiment.
  • Example of Figure 4 each from the corners of the component 13 Mentele (these are in front and behind the sectional plane of Figures 3 and 4) to the formation 23 and recess 22 out. This direction of flow is perpendicular to the plane of the drawing. Through the formation 23 this flow is then redirected to the right in the illustration according to FIGS. 3 and 4, this flow then running parallel to the plane of the drawing.
  • the recess 22 represents a flow barrier, at least for the flow direction perpendicular to the lateral plane, so that the underfill material first comes to a standstill at this barrier and outgassings from the depot 16 can penetrate freely into the open. Only when the flow front has run inward from the outer corners or edges of the component 13 in the gap 18 is it passed through the formation 23 into the gap, so that it can be filled from the inside out (from left to right in this drawing) . However, this only happens before the gap 18 is completely filled with underfill material, so that bubbles can be avoided.
  • FIGS. 5 to 7 further configurations for the recesses 22 are shown. These can be combined in the electronic assemblies 11 shown in the other figures.
  • the formation consists of a structuring of the insulation layer 15.
  • This structuring can, for example, be generated simultaneously with the formation of the installation space 14.
  • the insulation layer 15 lies directly on the surface 27 of the substrate 12, since the metalization 26 has been removed in this area of the surface 27.
  • the recess 22 is produced by micro-milling. This recess is located differently than shown in FIG. 3, but not only in the insulation layer 15 but also in the metallization 26, which in this case is still underneath the insulation layer 15.
  • the thickness of the insulation Layer 15 and the metallization 26 advantageously achieve greater gap depths, since these can be provided in both layer areas. Larger gap depths also present a difficult obstacle for the flowing underfill material to overcome.
  • FIG. 7 shows the location at which the recesses 22 can be provided.
  • the installation location 14 is shown from above, and it can also be seen that the front of the solder resist, which forms the insulation layer 15, is somewhat irregularly formed (exaggerated in FIG. 7).
  • the recesses 22 have been produced in this case by a laser, which explains the round ends of the groove produced.
  • the outer contour of the component 13 can be seen in FIG. 7, which is, however, only set to later.
  • FIG. 8 shows the circuit carrier 12 with a metallization, which in addition to the contact structures 25 also has the recesses 22.
  • the savings required for this can be produced, for example, by etching in the metallization.
  • FIG. 9 shows how the depots 16 made of sintered paste were applied to the circuit carrier 12 according to FIG. It can also be seen here that the formations 23 correspond to the recesses 22, so that the effect of redirecting the underfill material described in FIG. 4 can be achieved. It can also be seen that the depots 16 of sintering paste for some components consist of several segments in order to ensure different contacts of the electronic component to be added (not shown in FIG. 9). According to FIG. 10, a printing stencil is shown, which has mask openings 28 at the locations that the depots 16 according to FIG. 9 are to be printed. It can be seen that the formations 23 according to FIG. 9 are realized by indentations 29 in the mask openings 28. These are filled out during printing with the material, for example the sintering paste, so that the depots 16 show the formations 23.

Abstract

The invention relates to a circuit carrier (12) or an electronic assembly (11) having a circuit carrier (12) of this type and to methods for producing said circuit carrier (12) and said electronic assembly (11). Said circuit carrier (12) and said electronic assembly (11) have an installation place (14) for an electronic component (13) that has been joined by means of joining connections (16), in particular sintered connections. According to the invention, recesses (22) and protrusions (23) are provided, which, during the underfilling of a gap (18) between the component (13) and the circuit carrier (12), direct the underfill material (16) and thus prevent the underfill material from flowing together too early. Flowing together too early results namely in the formation of bubbles in the underfill material, which bubbles reduce the quality of the underfill. This can advantageously be prevented.

Description

Beschreibung description
Schaltungsträger mit einem Einbauplatz für elektronische Bau elemente, elektronische Schaltung und Herstellungsverfahren Circuit carrier with a slot for electronic components, electronic circuit and manufacturing process
Die Erfindung betrifft ein Schaltungsträger mit einem Einbau platz für ein elektronisches Bauelement. Außerdem betrifft die Erfindung eine elektronische Schaltung mit einem solchen Schaltungsträger . Die Erfindung betrifft auch ein Verfahren zum Herstellen eines Schaltungsträgers , bei dem ein Einbau platz für ein elektronisches Bauelement erzeugt wird. Weiter hin betrifft die Erfindung auch ein Verfahren zum Herstellen einer elektronischen Baugruppe bei dem ein solcher Schal tungsträger zum Einsatz kommt. The invention relates to a circuit carrier with an installation space for an electronic component. In addition, the invention relates to an electronic circuit with such a circuit carrier. The invention also relates to a method for producing a circuit carrier, in which an installation space for an electronic component is generated. Furthermore, the invention also relates to a method for producing an electronic assembly in which such a scarf device carrier is used.
Schaltungsträger und elektronische Schaltungen finden in häu figen Produkten vielfache Anwendung. Insbesondere gibt es auch leistungselektronische Schaltungen, welche zum Beispiel in Gleichrichtern und Umrichtern Verwendung finden. Für eine gute thermische und elektrische Kontaktierung von Leistungs halbleitern in solchen leistungselektronischen Schaltungen muss gesorgt werden, damit deren Funktion uneingeschränkt ge geben ist. Die guten thermischen und elektrischen Eigenschaf ten bei gleichzeitig einer geringen Bauhöhe müssen durch die Kontaktstruktur gewährleistet sein. Bei einer Verringerung der Bauhöhe wird allerdings zusätzlich der Einsatz eines Iso lationsmediums hauptsächlich um die Außenseiten des Leis tungsbauelementes erforderlich. Insbesondere im Fall von planaren Chip-Oberseiten-Kontaktierungen von Leistungshalb leitern müssen diese Bereiche der Chip-Kanten und die angren zenden auf dem Chip passivierten Leitungsbereiche mit dem Isolationsmedium verfüllt werden. Für eine einwandfreie Iso lation ist es erforderlich, dass diese Verfüllung blasenfrei erfolgt. Dies stellt jedoch eine technische Herausforderung dar. Das Isolationsmaterial, welches auch als Underfill- Material bezeichnet wird muss gewährleisten, dass während dem Verfüllen Ausgasungen aus der Fügezone nach außen finden und keine Blasen im Underfill-Material bilden. Insbesondere bei gesinterten Fügezonen, die für einen thermischen Aufbau gut geeignet sind, führen Ausgasen während des Verfüllens häufig zu Blasen. Als Verfüllmaterialien kommen beispielsweise fol gende Underfill-Materialien zum Einsatz: Auf Unterfließen op timierte Epoxidharze mit und ohne Füllstoffe. Circuit carriers and electronic circuits are widely used in common products. In particular, there are also power electronics circuits which are used, for example, in rectifiers and converters. Good thermal and electrical contacting of power semiconductors in such power electronic circuits must be ensured so that their function is unrestricted. The good thermal and electrical properties with a low overall height must be guaranteed by the contact structure. If the overall height is reduced, however, the use of an insulation medium is mainly required around the outside of the power component. Particularly in the case of planar chip top contacts of power semiconductors, these areas of the chip edges and the adjoining line areas passivated on the chip must be filled with the insulation medium. For perfect insulation it is necessary that this backfill is bubble-free. However, this represents a technical challenge. The insulation material, which is also referred to as the underfill material, must ensure that during the filling process, outgassing from the joint zone finds its way out and does not form bubbles in the underfill material. Especially with sintered joining zones, which are good for a thermal structure are suitable, outgassing often leads to bubbles during backfilling. The following underfill materials are used as backfill materials: epoxy resins optimized for underflows with and without fillers.
Die Aufgabe der Erfindung liegt daher darin, einen Schal tungsträger mit einem Einbauplatz für elektronische Bauele mente beziehungsweise eine elektronische Schaltung mit einem solchen Schaltungsträger anzugeben, bei dem die Möglichkeit eines blasenfreien Verfüllens mit einem Underfill-Material verbessert ist. Außerdem ist es Aufgabe der Erfindung ein Verfahren zum Herstellen eines solchen Schaltungsträgers so wie ein Verfahren zum Herstellen einer solchen elektronischen Baugruppe anzugeben, wobei bei diesem Verfahren ein blasen freies Verfüllen mit Underfill-Material unterstützt wird. The object of the invention is therefore to provide a scarf device carrier with a slot for electronic components or an electronic circuit with such a circuit carrier, in which the possibility of a bubble-free filling with an underfill material is improved. It is also an object of the invention to provide a method for producing such a circuit carrier and a method for producing such an electronic assembly, with this method supporting a bubble-free filling with underfill material.
Diese Aufgabe wird mit dem eingangs angegebenen Anspruchsge genstand ( Schaltungsträger) erfindungsgemäß dadurch gelöst, dass der Einbauplatz an seinem Rand mindestens eine Ausneh mung oder Oberflächenstrukturierung aufweist, die eine Ver tiefung in der Oberfläche des Schaltungsträgers ausbildet.This object is achieved with the subject matter (circuit carrier) specified at the outset according to the invention in that the installation space has at least one recess or surface structuring at its edge which forms a depression in the surface of the circuit carrier.
Als Oberflächenstrukturierung wird eine Anpassung der Ober fläche dahingehend verstanden, dass diese als Fließhindernis für das Underfill-Material zum Einsatz kommt. Dies kann bei spielsweise erreicht werden, indem die Oberfläche beispiels weise mit einem Laser aufgeraut wird. Dadurch, dass die Ober flächenstrukturierung eine andere Oberfläche zur Verfügung stellt, stellt diese ein Fließhindernis für das Underfill- Material dar. Dies wird erfindungsgemäß durch eine schwerere Benetzbarkeit der strukturierten Fläche im Vergleich zum Rest der Oberfläche des Schaltungsträgers oder der darauf befind lichen Schichten erreicht. Im Folgenden werden die Vorteile der Erfindung jeweils anhand der Ausnehmungen erläutert. Surface structuring means an adaptation of the surface in such a way that it is used as a flow obstacle for the underfill material. This can be achieved, for example, by roughening the surface with a laser, for example. Due to the fact that the surface structuring provides a different surface, this represents a flow obstacle for the underfill material. This is achieved according to the invention by making the structured surface more difficult to wet than the rest of the surface of the circuit carrier or the layers thereon. The advantages of the invention are explained below with reference to the recesses.
Selbstverständlich gelten diese analog aber auch bei Verwen dung der Oberflächenstrukturierung. Of course, these apply analogously but also when using the surface structuring.
Das Einbringen einer Ausnehmung, die als Vertiefung ausgebil det ist, hat beim Verfüllen des Spaltes zwischen dem Bauele ment und dem Schaltungsträger den Vorteil, dass die Ausneh- mung länger frei von Underfill-Material bleibt, als der rest liche Spalt zwischen dem Bauelement und dem Schaltungsträger . Hierdurch besteht die Möglichkeit, dass Ausgasungen während des Verfüllens durch die Vertiefung aus diesem Fügespalt (im Folgenden kurz Spalt) entweichen während sich das Underfill- Material im Spalt ausbreitet. Dabei bildet das Underfill- Material eine Fließfront. Die Ausnehmung ist derart am Rand des Einbauplatzes angeordnet, dass die Fließfront auf diesen Spalt zulaufen kann. Damit wird die Ausnehmung erst zuletzt von dem Underfill-Material verschlossen, sodass die Ausneh mung bis zuletzt die Ausgasungen nach außen transportieren kann. Die Bildung von Blasen wird daher vorteilhaft vermie den . The introduction of a recess, which is designed as a recess, has the advantage when filling the gap between the component and the circuit carrier that the recess tion remains free of underfill material for longer than the remaining gap between the component and the circuit carrier. This makes it possible for outgassing to escape from this joint gap (hereinafter referred to as gap) during the backfilling while the underfill material is spreading in the gap. The underfill material forms a flow front. The recess is arranged at the edge of the installation location in such a way that the flow front can run towards this gap. This means that the recess is only closed by the underfill material so that the recess can transport the outgassing to the outside until the very end. The formation of bubbles is therefore advantageously avoided.
Der Rand des Einbauplatzes ist durch die Außenkante des ein zubauenden Bauelementes definiert. Mit anderen Worten ist bei der Konzeption des Einbauplatzes auf dem Schaltungsträger zu berücksichtigen, welche Dimensionen das Bauelement, dass es zu montieren gilt, aufweist. Die Ausnehmung ist dann im Be reich der gedachten Außenkante des Bauelementes in dem Schal tungsträger vorzusehen. Beispielsweise kann dies so erfolgen, dass ein Teil der Ausnehmung innerhalb des Einbauplatzes und ein Teil der Ausnehmung außerhalb des Einbauplatzes liegt.The edge of the slot is defined by the outer edge of the component to be built. In other words, when designing the installation space on the circuit carrier, it must be taken into account which dimensions the component has to be assembled. The recess is then rich in the imaginary outer edge of the component in the scarf device carrier. For example, this can be done in such a way that part of the recess lies within the installation space and part of the recess lies outside the installation space.
Auf diesem Weg entsteht eine Art Kanal oder „Tunnel" für die Ausgasungen, während das Underfill-Material im Spalt verteilt wird . In this way, a kind of channel or "tunnel" is created for the outgassing, while the underfill material is distributed in the gap.
Der Spalt ist im Interesse einer direkten Wärmeleitung und einer geringen Bauhöhe möglichst schmal zu wählen. Insbeson dere, wenn als Kontaktierungswerkstoff ein Sintermaterial zum Einsatz kommt, können vorteilhaft sehr enge Spalte realisiert werden. Diese können bei üblichen Kontaktdepots aus Sinter werkstoff beispielsweise in einem Bereich von 20 Mikrometern bis 100 Mikrometer liegen In the interest of direct heat conduction and a low overall height, the gap should be chosen as narrow as possible. In particular, if a sintered material is used as the contacting material, very narrow gaps can advantageously be realized. With conventional contact deposits made of sintered material, these can be, for example, in a range from 20 micrometers to 100 micrometers
Die Einbauplätze sind üblicherweise in ihrer Grundform recht eckig oder quadratisch, bevorzugt auch U-förmig ausgebildet. Besonders vorteilhaft ist es, wenn die Ausnehmungen am Rand des alten Bauplatzes derart angeordnet werden, dass diese sich in der Mitte zwischen den Ecken des Einbauplatzes befin den. Ein Unterfüllen des Spaltes kann dann besonders vorteil haft von den Ecken ausgehend erfolgen, sodass sich die Fließ fronten von den Ecken des Einbauplatzes zu den Ausnehmungen hinbewegen und die Ausnehmungen zuletzt ausfüllen. Sollte hierbei die Fließfront von einer Ecke schneller als von der anderen Ecke zu der Ausnehmung gelangen, stellt die Ausneh mung vorteilhaft auf ein Fließhindernis dar, da das Unter- füll-Material einen Widerstand überwinden muss, um die Kante der Ausnehmung, also die Kante der die Ausnehmung bildenden Vertiefung, zu überwinden. Hierdurch bleibt die Ausnehmung vorteilhaft längere Zeit für ein Ausgasen geöffnet und schließlich erst, wenn die Fließfronten des Underfill- Materials sich aus entgegengesetzten Richtungen an der Aus nehmung treffen. Das Ergebnis ist ein blasenfreies oder zu mindest weitgehend blasenfreies Unterfüllungsergebnis erzie len . In their basic form, the installation locations are usually quite angular or square, preferably also U-shaped. It is particularly advantageous if the recesses are arranged on the edge of the old construction site in such a way that they are in the middle between the corners of the slot. An underfilling of the gap can then take place particularly advantageously starting from the corners, so that the flow fronts move from the corners of the installation site to the recesses and fill the recesses last. If the flow front reaches the recess faster from one corner than from the other corner, the recess advantageously represents a flow obstacle, since the underfill material has to overcome resistance to the edge of the recess, that is, the edge of the to overcome the recess forming recess. As a result, the recess advantageously remains open for a long time for outgassing and finally only when the flow fronts of the underfill material meet from opposite directions on the recess. The result is a bubble-free or at least largely bubble-free underfill result.
Selbst verständlich ist es auch möglich, die Ausnehmungen an den Ecken vorzusehen. In diesem Fall würde der Füllstoff vor zugsweise von der Mitte des ein Bauplatzes zu den Ecken flie ßen, wenn diese an der Mitte des einen Bauplatzes hinzugefügt wird . Of course, it is also possible to provide the recesses at the corners. In this case, the filler would preferably flow from the center of the one building site to the corners if this was added to the middle of the one building site.
Gemäß einer Ausgestaltung der Erfindung ist vorgesehen, dass die Ausnehmung aus einem Schlitz oder einer bevorzugt kreis förmigen Öffnung besteht, der senkrecht zum Rand des Einbau platzes verläuft. According to one embodiment of the invention it is provided that the recess consists of a slot or a preferably circular opening which extends perpendicular to the edge of the installation space.
Wie bereits erwähnt, soll die Ausnehmung am Rand des Einbau platzes die gedachte Kante des Bauelementes durchlaufen, so dass die Ausnehmung Ausgasungen aus dem Einbauplatz nach au ßen transportieren kann. Ein Schlitz, welcher senkrecht zum Rand des Einbauplatzes verläuft, kann jenseits und diesseits des Randes des Einbauplatzes liegen und erfüllt diese Aufgabe daher besonders gut. Außerdem lässt sich ein solcher Schlitz vorteilhaft einfach beispielsweise durch Mikrofräsen oder La serbearbeitung erzeugen. Alternativ ist auch ein subtraktives Ätzverfahren, beispielsweise durch fotolithographische Struk turierung als Fertigungsverfahren denkbar. As already mentioned, the recess at the edge of the installation space should pass through the imaginary edge of the component, so that the recess can transport outgassing outwards from the installation location. A slot, which runs perpendicular to the edge of the installation space, can lie on both sides of the edge of the installation space and therefore fulfills this task particularly well. In addition, such a slot can advantageously be easily produced, for example, by micro milling or laser processing. Alternatively, there is also a subtractive one Etching process, for example by photolithographic structuring conceivable as a manufacturing process.
Gemäß einer Ausgestaltung der Erfindung ist vorgesehen, dass die Vertiefung in einer die Oberfläche des Schaltungsträgers bildenden Isolationsschicht, insbesondere bestehend aus einem Lötstopplack, und/oder in einer Metallisierung auf dem Schal tungsträger vorgesehen ist. According to one embodiment of the invention, it is provided that the depression is provided in an insulation layer forming the surface of the circuit carrier, in particular consisting of a solder resist, and / or in a metallization on the circuit device carrier.
Wird die Vertiefung, beispielsweise der Schlitz, in der Ober fläche des Schaltungsträger erzeugt, stehen zu dessen Ausbil dung alle Lagen des Schichtaufbaus des Schaltungsträgers zur Verfügung. Die Isolationsschicht wird normalerweise an den Einbauplatz herangeführt und endet in einem bestimmten Ab stand des Einbauplatzes, damit dieser zuverlässig von Iso liermaterial freigehalten werden kann. Besteht diese Schicht beispielsweise aus einem Lötstoplack, wird dieser üblicher weise fotochemisch entwickelt. Hierbei können die Ausnehmun gen von Anfang an berücksichtigt werden und in Situ mit der Herstellung mit der Lötstopschicht ausgebildet werden. If the depression, for example the slot, is generated in the upper surface of the circuit carrier, all layers of the layer structure of the circuit carrier are available for its formation. The insulation layer is normally brought up to the installation location and ends at a certain distance from the installation location so that it can be reliably kept free of insulating material. If this layer consists, for example, of a solder resist, this is usually developed photochemically. Here, the recesses can be taken into account from the beginning and can be formed in situ with the production using the solder stop layer.
Eine andere Möglichkeit besteht darin, die Metallisierung auf dem Schaltungsträger für die Erzeugung der Ausnehmung zu nut zen. Auch die Metallisierung ist als Lager auf dem Schal tungsträger aufgebracht und wird zur Ausbildung von Kontakt flächen und Leiterbahnen strukturiert. Bei diesem Strukturie rungsprozess (beispielsweise ätztechnisch) kann die Vertie fung vorteilhaft während des Prozessierens in Situ herge stellt werden. Another possibility is to use the metallization on the circuit carrier for the production of the recess. The metallization is applied as a bearing on the circuit board and is structured to form contact areas and conductor tracks. In this structuring process (for example, in terms of etching technology), the recess can advantageously be produced in situ during processing.
Selbstverständlich ist es auch möglich andere Fertigungsver fahren für die Ausnehmung vorzusehen. Sowie in der Isolati onsschicht als auch in der Metallisierung können die Ausneh mungen beispielsweise durch Mikrofräsen oder Laserbearbeitung ausbildet werden. Diese Verfahren haben den Vorteil einer sehr hohen Genauigkeit, sodass die Ausnehmungen präzise her gestellt werden können. Insbesondere die für ein Stoppen der Fließfront des Underfill-Materials erforderlichen scharfen Kanten der Vertiefung können durch diese Verfahren hervorra- gend ausgebildet werden. Außerdem ist es möglich, mittels Fräsens oder Laserbearbeitung auch Ausnehmungen herzustellen, die bis in das Material des Schaltungsträgers herab reichen. Tiefere Ausnehmungen haben den Vorteil, dass Ausgasungen noch zuverlässiger nach außen transportiert werden können. Of course, it is also possible to provide other manufacturing processes for the recess. As well as in the insulation layer and in the metallization, the recesses can be formed, for example, by micro-milling or laser processing. These methods have the advantage of very high accuracy, so that the recesses can be made precisely. In particular, the sharp edges of the depression required to stop the flow front of the underfill material can be produced by these methods. be trained. In addition, it is also possible to use milling or laser processing to produce recesses which extend down into the material of the circuit carrier. Deeper recesses have the advantage that outgassing can be transported to the outside even more reliably.
Gemäß einer Ausgestaltung der Erfindung ist vorgesehen, dass auf dem Einbauplatz ein Depot eines Fügehilfsstoffes, insbe sondere aus einem Sinterwerkstoff, aufgetragen ist. According to one embodiment of the invention, it is provided that a depot of a joining aid, in particular a sintered material, is applied to the installation location.
Wenn der Fügehilfsstoff auf dem Schaltungsträger bereits vor gesehen ist, erleichtert dies vorteilhaft die Montage des Bauelementes. Zu Montagezwecken wird der Schaltungsträger üb licherweise bereits mit Fügehilfsstoff versehen. Hierbei kann es sich um Lotmaterial handeln, welches beispielsweise als Paste mittels Maskentechnologie aufgetragen wird. Falls bei diesem Prozess Druckfehler auftreten, die zu einem Ausfüllen der Ausnehmungen führen, kann dies vor Montage der Bauelemen te optisch ermittelt werden, sodass frühzeitig ein Ausschuss beziehungsweise eine Korrektur dieses Fehlers erfolgen kann. If the joining aid is already seen on the circuit carrier, this advantageously facilitates the assembly of the component. For assembly purposes, the circuit carrier is usually already provided with joining aid. This can be solder material, which is applied, for example, as a paste using mask technology. If printing errors occur during this process that lead to the openings being filled, this can be determined optically before the components are installed, so that this error can be rejected or corrected at an early stage.
Das Depot kann auch aus einem Sinterwerkstoff bestehen. Die ser kann ebenfalls aus Sinterpaste gedruckt werden. Hierbei gilt das oben zu der Applikation von Lotwerkstoff angegebene entsprechend. Alternativ können auch Preforms (Formteile) verwendet werden, die vorteilhaft besonders präzise herge stellt werden können. Diese werden im Einbauplatz fixiert o- der direkt vor der Montage des Bauelementes aufgelegt. The depot can also consist of a sintered material. This can also be printed from sinter paste. Here, the information given above for the application of solder material applies accordingly. Alternatively, preforms (molded parts) can also be used, which can advantageously be produced particularly precisely. These are fixed in place or placed directly before assembly of the component.
Gemäß einer Ausgestaltung der Erfindung ist vorgesehen, dass das Depot aus einem Sinterwerkstoff besteht, wobei am Rand des Depots eine Ausformung vorgesehen ist. According to an embodiment of the invention, it is provided that the depot consists of a sintered material, with a molding being provided at the edge of the depot.
Wenn das Depot aus einem Sinterwerkstoff besteht, ist es mög lich, Ausformungen vorzusehen, die einer vergleichsweise fei ne Geometrie aufweisen. Dies liegt daran, dass die Sinterde pots ihre Form während des Fügens im Wesentlichen beibehalten (wenn man von einer Schrumpfung einmal absieht) , sodass diese feinen Strukturen erhalten bleiben. Anders ist dies bei Lot- Werkstoffen, welche zur Herstellung der Verbindung aufge schmolzen werden. Hierbei würden feine Ausformungen aufgrund der Oberflächenspannung des flüssigen Lotwerkstoffes verloren gehen . If the depot consists of a sintered material, it is possible to provide formations which have a comparatively fine geometry. This is because the sintered pots essentially maintain their shape during joining (apart from shrinkage), so that these fine structures are retained. This is different with solder W erkstoffen which are sealed up to prepare the compound. Here, fine formations would be lost due to the surface tension of the liquid solder material.
Die Ausformungen unterstützen vorteilhaft die Ausleitung von Ausgasungen während des Verfüllens des Spaltes mit Unterfüll material. Hierbei kommt den Ausformungen die Aufgabe zu, das Unterfüllmaterial, wenn dieses mit seiner Fließfront an der Ausformung ankommt, in eine bestimmte Richtung zu leiten, so- dass beispielsweise verhindert werden kann, dass dieses in Bereiche vordringt, in denen Blasen eingeschlossen werden können. Vorteilhaft können die Ausformungen dabei auch so eingesetzt werden, dass die Leitung der Fließfront hin zu ei nem Fließhindernis wie einer Ausnehmung in Form einer Vertie fung erfolgt (hierzu im Folgenden noch mehr) . Die Ausnehmun gen, welche als Fließhindernis eine Kante der Vertiefung zur Verfügung stellen, führen dann dazu, dass die Fließfront so lange gestoppt wird, bis sich am Ende die Ausnehmung auch mit Unterfüllmaterial füllt. Bis dahin kann die Ausnehmung als Kanal zum Transport von Ausgasungen verwendet werden. The formations advantageously support the diversion of outgassing during the filling of the gap with underfill material. In this case, the formations have the task of guiding the underfill material in a certain direction when its flow front arrives at the form, so that, for example, it can be prevented from penetrating into areas in which bubbles can be enclosed. The formations can also advantageously be used in such a way that the flow front is directed towards a flow obstacle such as a recess in the form of a recess (more on this below). The recesses, which provide an edge of the depression as a flow obstacle, then cause the flow front to be stopped until the recess also fills with underfill material at the end. Until then, the recess can be used as a channel for transporting outgassing.
Aber auch ohne die zusätzliche Wirkung der Ausnehmungen kön nen die Ausformungen durch Umleiten der Fließfronten oder Aufhalten der Fließfronten verhindern, das Unterfüllmaterial, welches beispielsweise von verschiedenen Ecken eines Einbau platzes den Spalt ausfüllt, zu früh zusammenfließt und so ein Ausgasen mit der Konsequenz einer Blasenbildung verhindern würde . But even without the additional effect of the recesses, the formations can be prevented by redirecting the flow fronts or by stopping the flow fronts, the underfill material, which fills the gap from different corners of an installation space, flows together too early and thus prevents outgassing with the consequence of bubbles would.
Die Ausformungen können, wenn man quadratische oder recht eckige Einbauplätze voraussetzt, bei diesen jeweils in der Mitte zwischen zwei Ecken angeordnet sein. Dies bedeutet, dass das ebenfalls rechteckige Depot aus Sinterwerkstoff ebenfalls rechteckig oder quadratisch ist und jeweils in der Mitte zwischen den Ecken die Ausformung aufweist. The formations can be arranged in the middle between two corners if one assumes square or rectangular installation spaces. This means that the depot made of sintered material, which is also rectangular, is also rectangular or square and has the shape in the middle between the corners.
Als Ausformung im Sinne der Erfindung soll eine Struktur ver standen werden, welche vom Rand des Depots aus Sinterwerk- Stoff absteht und so ein Hindernis ausbildet, welches eine entlang des Depots fließendes Unterfüllmaterial aufhält oder umlenkt . As a formation in the sense of the invention, a structure should be understood, which consists of sintering The fabric protrudes and thus forms an obstacle that stops or deflects an underfill material flowing along the depot.
Gemäß einer Ausgestaltung der Erfindung ist vorgesehen, dass die Ausformung die Form eines Keils hat, der von dem Rand des Depots absteht. According to one embodiment of the invention, it is provided that the shape has the shape of a wedge that protrudes from the edge of the depot.
Eine keilförmige Ausformung ist so angeordnet, dass der Keil sozusagen auf seiner dreieckigen Fläche liegt. Mit anderen Worten kann man sich die keilförmige Ausformung als Prisma mit einer dreieckigen Grundfläche vorstellen, wobei dieses Prisma mit einem seiner Seitenflächen an das Depot an A wedge-shaped shape is arranged so that the wedge lies on its triangular surface, so to speak. In other words, you can imagine the wedge-shaped shape as a prism with a triangular base, this prism with one of its side faces on the depot
schließt . closes.
Gemäß einer Ausgestaltung der Erfindung ist vorgesehen, dass die Breite des Keils gerade der Höhe des Depots entspricht. According to one embodiment of the invention, it is provided that the width of the wedge corresponds exactly to the height of the depot.
Besonders vorteilhaft ist es, wenn der Keil den Spalt auf seiner gesamten Spalthöhe ausfüllt. Da die Spaltbreite aller dings durch die Höhe des Sinterdepots gegeben ist, ist dies nur der Fall, wenn die Breite des Keils gerade der Höhe des Depots entspricht. Hierdurch wird die umleitende Funktion der Ausformung vorteilhaft am effektivsten genutzt. Außerdem lässt sich eine solche Ausformung, die der Höhe des Sinterde pots entspricht, am einfachsten hersteilen. Hierbei kommt ei ne Maske zum Einsatz, welche eine die Ausformung enthaltende Maskenöffnung aufweist, wobei die Ausfüllung dieser Masken öffnung neben dem Depot aus Sinterwerkstoff gleichzeitig die Ausformung in derselben Höhe erzeugt. It is particularly advantageous if the wedge fills the gap over its entire gap height. Since the gap width is given by the height of the sintered deposit, this is only the case if the width of the wedge corresponds to the height of the deposit. As a result, the redirecting function of the formation is advantageously used most effectively. In addition, it is easiest to manufacture such a shape, which corresponds to the height of the sintered deposit. Here, a mask is used which has a mask opening containing the molding, the filling of this mask opening in addition to the deposit made of sintered material simultaneously producing the molding at the same height.
Selbstverständlich kann die Ausformung auch andere Geometrien als die eines Keils aufweisen. Diese kann beispielsweise auch quaderförmig ausgebildet sein, wobei das Quader sozusagen an die Seite des Depots aus Sinterpaste anschließt. Auch hier ist es vorteilhaft, wenn der Quader dieselbe Höhe aufweist, wie das Depot. Eine andere Möglichkeit besteht darin, dass die Ausformung die Form eines Halbzylinders aufweist, der mit seiner flachen Seitenfläche an das Depot aus Sinterpaste anschließt. Auch hier ist es vorteilhaft, wenn die Höhe dieses Halbzylinders der Höhe des Depots entspricht. Of course, the shape can also have different geometries than that of a wedge. This can also be cuboidal, for example, the cuboid adjoining the side of the deposit made of sintering paste, so to speak. It is also advantageous here if the cuboid has the same height as the depot. Another possibility is that the formation has the shape of a half cylinder, which connects with its flat side surface to the deposit made of sintered paste. It is also advantageous here if the height of this half cylinder corresponds to the height of the depot.
Die Aufgabe wird alternativ mit dem eingangs angegebenen An spruchsgegenstand (elektronische Schaltung) erfindungsgemäß auch dadurch gelöst, dass der Schaltungsträger nach einem der Ansprüche 4 bis 8 ausgebildet ist, wobei das elektronische Bauelement auf dem Depot des Fügehilfsstoffes befestigt ist. The object is alternatively achieved with the subject matter specified at the beginning (electronic circuit) according to the invention in that the circuit carrier is designed according to one of claims 4 to 8, the electronic component being fastened to the depot of the joining aid.
Bei der elektronischen Schaltung handelt es sich um eine Um setzung, bei der für das Endprodukt der Schaltungsträger ge nutzt wird, der vorstehend bereits eingehend erläutert wurde. Wird eine solche elektronische Baugruppe mit Underfill- Material unterfüllt, lassen sich dadurch blasenfreie Unter füllergebnisse erzielen, wodurch die obenstehende Aufgabe ge löst wird. Das blasenfreie Unterfüllmaterial verbessert vor teilhaft sowohl die Wärmeleitung als auch die elektrische Isolation in der elektronischen Baugruppe. The electronic circuit is an implementation in which the circuit carrier is used for the end product, which has already been explained in detail above. If such an electronic assembly is underfilled with underfill material, bubble-free underfill results can be achieved as a result, whereby the above object is achieved. The bubble-free underfill material partially improves both the heat conduction and the electrical insulation in the electronic assembly.
Gemäß einer Ausgestaltung der Erfindung ist vorgesehen, dass ein Spalt zwischen dem Schaltungsträger und dem Bauelement mit einem Underfill-Material ausgefüllt ist. According to one embodiment of the invention, it is provided that a gap between the circuit carrier and the component is filled with an underfill material.
Die Aufgabe wird alternativ mit dem eingangs angegebenen An spruchsgegenstand (Verfahren) erfindungsgemäß auch dadurch gelöst, dass am Rand des Einbauplatzes mindestens eine Aus nehmung erzeugt wird, wobei diese als Vertiefung in der Ober fläche des Schaltungsträgers ausgebildet wird. The object is alternatively achieved with the subject matter (method) specified at the outset according to the invention in that at least one recess is produced at the edge of the installation space, this being formed as a depression in the upper surface of the circuit carrier.
Wird bei dem Verfahren eine Ausnehmung erzeugt, so kann das erzeugte Produkt, nämlich der Schaltungsträger, vorteilhaft verwendet werden, um die vorstehend erläuterte elektronische Baugruppe zu erzeugen. Die hiermit verbundenen Vorteile sind bereits genannt worden und sollen an dieser Stelle nicht noch einmal erwähnt werden. Gemäß einer Ausgestaltung der Erfindung ist vorgesehen, dass die Ausnehmung durch ein spanendes Verfahren, insbesondere durch Fräsen oder Bohren erzeugt wird. If a recess is produced in the method, the product produced, namely the circuit carrier, can advantageously be used to produce the electronic assembly explained above. The advantages associated with this have already been mentioned and should not be mentioned again here. According to one embodiment of the invention, it is provided that the recess is produced by a machining process, in particular by milling or drilling.
Wie bereits erläutert gestatten spanende Verfahren wie zum Beispiel Mikrofräsen oder Bohren besonders hohe Genauigkei ten. Insbesondere lassen sich in den Ausnehmungen die erfor derlichen Kanten, welche den Rand der Vertiefung bilden, scharfkantig ausbilden. As already explained, cutting processes such as micromilling or drilling allow particularly high accuracies. In particular, the necessary edges, which form the edge of the depression, can be formed with sharp edges in the recesses.
Beim Fräsen können längliche Ausnehmungen erzeugt werden. Je nachdem, ob die Drehachse des Fräskopfes senkrecht oder pa rallel zur Oberfläche des Schaltungsträgers liegt, können die länglichen Ausnehmungen rundherum eine scharfe Kante aufwei sen oder an ihren Enden eine auslaufende Kante aufweisen. Die auslaufende Kante am Ende der Ausnehmungen können als Fließ hilfe verwendet werden, damit sich die Ausnehmung am Ende des Unterfüllprozesses noch mit Unterfüllmaterial ausfüllt. Elongated recesses can be created during milling. Depending on whether the axis of rotation of the milling head is perpendicular or parallel to the surface of the circuit carrier, the elongated recesses can have a sharp edge all around or have a tapered edge at their ends. The tapered edge at the end of the recesses can be used as a flow aid so that the recess is still filled with underfill material at the end of the underfilling process.
Gemäß einer Ausgestaltung der Erfindung ist vorgesehen, dass Ausnehmung durch Strukturieren einer Schicht, insbesondere durch Strukturieren einer Isolationsschicht auf dem Schal tungsträger erzeugt wird. According to one embodiment of the invention, it is provided that recess is produced by structuring a layer, in particular by structuring an insulation layer on the circuit board.
Wie bereits erwähnt ist es auch möglich, durch Strukturieren der Schicht Ausnehmungen zu erzeugen. Der Vorteil dieses Fer tigungsverfahrens liegt daran, dass die Strukturierung ohne hin erfolgen muss und hierbei für die Ausbildung der Ausneh mungen kein zusätzlicher Fertigungsaufwand entsteht. As already mentioned, it is also possible to produce recesses by structuring the layer. The advantage of this manufacturing process lies in the fact that the structuring must be carried out without any additional work and there is no additional manufacturing effort for the formation of the recesses.
Gemäß einer Ausgestaltung der Erfindung ist vorgesehen, dass auf dem Einbauplatz ein Depot aus einem Fügehilfsstoff aufge bracht oder angebracht wird. According to one embodiment of the invention, it is provided that a depot made of a joining aid is brought up or attached to the installation location.
Wie bereits erwähnt können die Depots aus dem Fügehilfsstoff insbesondere dem Sinterwerkstoff vor Montage der elektroni schen Bauelemente auf den Schaltungsträger aufgebracht wer den. Die Qualität dieses Zwischenergebnis (vor Montage der Depots) kann dann begutachtet werden, bevor es zu einer End montage kommt. As already mentioned, the depots made of the joining aid, in particular the sintered material, can be applied to the circuit carrier prior to the assembly of the electronic components. The quality of this interim result (before assembly of the Depots) can then be inspected before final assembly takes place.
Die Aufgabe wird alternativ mit dem eingangs angegebenen An spruchsgegenstand (Verfahren) erfindungsgemäß auch dadurch gelöst, dass ein Schaltungsträger nach einem Verfahren gemäß Anspruch 13 hergestellt wird, As an alternative, the object is also achieved with the subject matter (method) specified at the outset in that a circuit carrier is produced by a method according to claim 13,
• auf dem Depot ein elektronisches Bauelement befestigt wird,  An electronic component is attached to the depot,
• ein Spalt zwischen Schaltungsträger und Bauelement mit einem Underfill-Material ausgefüllt wird.  • A gap between the circuit carrier and the component is filled with an underfill material.
Die Vorteile des Montageverfahrens für die elektronische Bau gruppe sind bereits eingehend erläutert worden. Hierbei ist es notwendig, die Depots (eventuell mit zusätzlichen Ausfor mungen versehen) auf den Schaltungsträger aufzubringen, wobei auf diesem die elektronischen Bauelemente zwecks Endmontage aufgesetzt werden. Dann wird der Spalt mit dem Underfill- Material ausgefüllt, wobei, wie bereits erläutert, ein bla senfreies Unterfüllergebnis erreicht werden kann. The advantages of the assembly process for the electronic assembly have already been explained in detail. In this case, it is necessary to apply the depots (possibly with additional information) to the circuit carrier, with the electronic components being placed thereon for the purpose of final assembly. Then the gap is filled with the underfill material, whereby, as already explained, a bubble-free underfill result can be achieved.
Gemäß einer Ausgestaltung der Erfindung ist vorgesehen, dass das Underfill-Material in einem Bereich außerhalb der mindes tens eine Ausnehmung, vorzugsweise genau in der Mitte zwi schen zwei Ausnehmungen, in den Spalt eingebracht wird. According to one embodiment of the invention, it is provided that the underfill material is introduced into the gap in an area outside the at least one recess, preferably exactly in the middle between two recesses.
Das Unterfüllmaterial dehnt sich, wenn es in der Mitte zwi schen zwei Ausnehmungen eingebracht wird, vorteilhaft zu bei den Seiten gleichmäßig aus. Sollte dies nicht der Fall sein, dienen die Ausnehmungen als Fließhindernis, um diese Un gleichmäßigkeiten zu beseitigen. Daher ist ein zuverlässiges Ausgasen leicht möglich. Wenn, wie bereits erläutert, ein quadratischer oder rechteckiger Einbauplatz vorgesehen ist und die Ausnehmungen in der Mitte der Seitenkanten vorgesehen sind, so befindet sich die Mitte zwischen den Ausnehmungen üblicherweise an den Ecken (bei quadratischen Einbauplätzen oder nahe der Ecken auch bei rechteckigen Einbauplätzen) . Weitere Einzelheiten der Erfindung werden nachfolgend anhand der Zeichnung beschrieben. Gleiche oder sich entsprechende Zeichnungselemente sind jeweils mit den gleichen Bezugszei chen versehen und werden nur insoweit mehrfach erläutert, wie sich Unterschiede zwischen den einzelnen Figuren ergeben. The underfill material expands when it is introduced in the middle between two recesses, advantageously to the sides. If this is not the case, the recesses serve as a flow obstacle to eliminate these irregularities. Reliable outgassing is therefore easily possible. If, as already explained, a square or rectangular installation space is provided and the recesses are provided in the middle of the side edges, the middle between the recesses is usually at the corners (in the case of square installation spaces or near the corners also in the case of rectangular installation spaces). Further details of the invention are described below with reference to the drawing. The same or corresponding drawing elements are each provided with the same reference characters and are only explained to the extent that there are differences between the individual figures.
Bei den im Folgenden erläuterten Ausführungsbeispielen han delt es sich um bevorzugte Ausführungsformen der Erfindung. Bei den Ausführungsbeispielen stellen die beschriebenen Kom ponenten der Ausführungsformen jeweils einzelne, unabhängig voneinander zu betrachtende Merkmale der Erfindung dar, wel che die Erfindung jeweils auch unabhängig voneinander weiter bilden und damit auch einzeln oder in einer anderen als der gezeigten Kombination als Bestandteil der Erfindung anzusehen sind. Des Weiteren sind die beschriebenen Ausführungsformen auch durch weitere der bereits beschriebenen Merkmale der Er findung ergänzbar. The exemplary embodiments explained below are preferred embodiments of the invention. In the exemplary embodiments, the described components of the embodiments each represent individual features of the invention that are to be considered independently of one another, and which also further develop the invention independently of one another and are therefore also to be regarded individually or in a combination other than that shown as part of the invention . Furthermore, the described embodiments can also be supplemented by further features of the invention already described.
Es zeigen: Show it:
Figur 1 ein Ausführungsbeispiel der erfindungsgemäßen elekt ronischen Baugruppe mit einem Ausführungsbeispiel des erfin dungsgemäßen Schaltungsträgers als Schnittbild, FIG. 1 shows an exemplary embodiment of the electronic assembly according to the invention with an exemplary embodiment of the circuit carrier according to the invention as a sectional view,
Figur 2 die Aufsicht auf ein Ausführungsbeispiel des erfin dungsgemäßen Schaltungsträgers , FIG. 2 shows the supervision of an exemplary embodiment of the circuit carrier according to the invention,
Figur 3 und 4 Ausführungsbeispiele für verschiedene Ausneh mungen und Ausformungen in der erfindungsgemäßen elektroni schen Baugruppe gemäß Figur 1, 3 and 4 embodiments for various Ausneh measures and formations in the electronic assembly's rule according to Figure 1,
Figur 5 bis 7 weitere Ausführungsbeispiele für Ausnehmungen des erfindungsgemäßen Schaltungsträgers , 5 to 7 further exemplary embodiments for recesses of the circuit carrier according to the invention,
Figur 8 eine Metallisierung mit Ausnehmungen als Ausführungs beispiel des erfindungsgemäßen Schaltungsträgers als Auf sicht, Figur 9 den Schaltungsträger gemäß Figur 8 mit aufgesetzten Sinterpastendepots als Aufsicht, FIG. 8 shows a metallization with recesses as an embodiment of the circuit carrier according to the invention as a view, FIG. 9 shows the circuit carrier according to FIG. 8 with sintered paste depots attached as a top view,
Figur 10 eine Maske, mit der das Ausführungsbeispiel der Sin terpastendepots gemäß Figur 9 gedruckt werden kann. 10 shows a mask with which the embodiment of the sinter paste depots according to FIG. 9 can be printed.
Gemäß Figur 1 ist eine elektronische Schaltung 11 dargestellt welche eine Schaltungsträger 12 und elektronische Bauelemente 13 aufweist. Die elektronischen Bauelemente 13 sind jeweils auf Einbauplätzen 14 des Schaltungsträgers 12 vorgesehen. Die Einbauplätze 14 entstehen dadurch, dass in einer Isolations schicht 15 aus einem Lötstoplack Öffnungen ausgebildet sind. In diesen Öffnungen ist jeweils ein Depot 16 auf der Oberflä che des Schaltungsträgers 12 vorgesehen (vergleiche bei spielsweise Figur 3) jeweils einer Sinterverbindung 17 umge schmolzen wurde. Ein verbleibender Spalt 18 ist mit einem Un- derfill-Material 19 ausgefüllt, welches den Spalt zwischen dem Bauelement 13 und dem Schaltungsträger 12 verschließt. Außerdem weist die elektronische Schaltung 11 eine Deckplatte 20 auf welche jeweils über eine weitere Sinterverbindung 21 mit den jeweiligen Oberseiten der Bauelemente 13 verbunden ist . According to FIG. 1, an electronic circuit 11 is shown which has a circuit carrier 12 and electronic components 13. The electronic components 13 are each provided in slots 14 of the circuit carrier 12. The installation locations 14 result from openings being formed in an insulation layer 15 from a solder resist. In each of these openings, a depot 16 is provided on the surface of the circuit carrier 12 (see, for example, FIG. 3), a sintered connection 17 was melted down. A remaining gap 18 is filled with an underfill material 19 which closes the gap between the component 13 and the circuit carrier 12. In addition, the electronic circuit 11 has a cover plate 20 which is in each case connected to the respective upper sides of the components 13 via a further sintered connection 21.
In Figur 1 ist die elektronische Schaltung 11 ohne jegliche Ausnehmungen 22 oder aus Formungen 23 (vergleiche aber Figu ren 3 bis 7) dargestellt. Die in diesen Figuren dargestellten Ausformungen und Ausnehmungen können jedoch vor oder hinter der Schnittebene liegen, die in Figur 1 dargestellt ist. In sofern können die Varianten gemäß deren genannten Figuren in die elektronische Schaltung 11 gemäß Figur 1 eingebracht wer den . In Figure 1, the electronic circuit 11 is shown without any recesses 22 or from moldings 23 (but compare Figures 3 to 7). The shapes and recesses shown in these figures can, however, lie in front of or behind the cutting plane which is shown in Figure 1. If so, the variants according to the figures mentioned can be introduced into the electronic circuit 11 according to FIG. 1.
Figur 1 zeigt jedoch auch einen Aufbau, wie dieser gemäß dem Stand der Technik ohne jegliche Ausnehmungen und Ausformungen aussehen würde. Ein solcher Aufbau wurde zu Textzwecken her gestellt, wobei dieser Aufbau in der Schnittebene II - II ge mäß Figur 1 aufgeschnitten wurde. Zu erkennen ist in dieser Schnittebene eine Schlifffläche, welche durch die Sinterver bindung 17 ausgebildet ist. Diese Sinterverbindung 17 ist von dem Underfill-Material 19 umgeben. Da die elektronische However, FIG. 1 also shows a structure of how it would look according to the prior art without any recesses and shapes. Such a structure was produced for text purposes, this structure being cut in section plane II-II in accordance with FIG. 1. It can be seen in this sectional plane a grinding surface, which is formed by the Sinterver bond 17. This sintered connection 17 is from surrounded the underfill material 19. Because the electronic
Schaltung 11 gemäß Figur 2 ohne Ausnehmungen und Ausformungen hergestellt wurde, sind beim Vergießen des Spaltes 18 (ver gleiche Figur 1) in dem Underfill-Material Blasen 24 entstan den, die ihren Ursprung durch Ausgasungen der Sinterverbin dung 17 haben. Diese Blasenbildung gilt es mit den erfin dungsgemäßen Ausformungen und Ausnehmungen zu verhindern. Circuit 11 according to FIG. 2 was produced without recesses and formations, bubbles 24 were created in the underfill material during casting of the gap 18 (see same FIG. 1), which originated from the sintering connection 17 by outgassing. This formation of bubbles is to be prevented with the inventive formations and recesses.
In Figur 2 ebenfalls zu erkennen sind Kontaktstrukturen 25, die aus Leiterbahnen zum Kontaktieren des in Figur 2 nicht dargestellten elektronischen Bauelements 21 (vergleiche Figur 1) dienen. FIG. 2 also shows contact structures 25, which are used for connecting the electronic component 21 (see FIG. 1) that is not shown in FIG. 2.
In Figur 3 ist ein Ausschnitt aus der elektronischen Baugrup pe dargestellt, die gemäß Figur 1 aufgebaut sein kann. Der Ausschnitt stellt ein Rand der Ausnehmung 14 dar, indem auch das Bauelement 13 zu erkennen ist. Anders als in Figur 1 wird jedoch der Rand der Ausnehmung 14 durch die Isolationsschicht 15 unterhalb des Bauelementes 13 gebildet. Allerdings reicht die Isolationsschicht 15 nicht an das Depot 16 aus einem Sin terwerkstoff heran, welches auf einer Kontaktschicht aufge bracht ist, die Teil einer strukturierten Metallisierung 26 ist. Die Metallisierung 26 sowie die Isolationsschicht 15 be finden sich jeweils auf der Oberfläche 27 des Schaltungsträ- gers 12. FIG. 3 shows a section of the electronic assembly, which can be constructed according to FIG. 1. The cutout represents an edge of the recess 14, in which the component 13 can also be seen. Unlike in FIG. 1, however, the edge of the recess 14 is formed by the insulation layer 15 below the component 13. However, the insulation layer 15 does not reach the depot 16 made of a sintered material which is brought up on a contact layer which is part of a structured metallization 26. The metallization 26 and the insulation layer 15 are each located on the surface 27 of the circuit carrier 12.
Außerdem ist gemäß Figur 3 die Ausnehmung 22 zu erkennen, die in die Isolationsschicht 15 eingebracht wurde. Dies ist durch einen Mikrofräser erfolgt, was daran zu erkennen ist, dass die Ausnehmung 22 nach außen hin ausläuft. Die Ausnehmung be steht daher aus einem Schlitz in der Isolationsschicht 15, durch den in Längsrichtung der Schnitt der Figur 3 verläuft. Alternativ könnte der Schlitz auch beispielsweise durch ein Ätzverfahren oder eine Laserbearbeitung hergestellt werden. In addition, according to FIG. 3, the recess 22 can be seen, which was made in the insulation layer 15. This has been done by a micro milling cutter, which can be seen from the fact that the recess 22 runs outwards. The recess is therefore a slot in the insulation layer 15 through which the section of FIG. 3 runs in the longitudinal direction. Alternatively, the slot could also be produced, for example, by an etching process or laser processing.
Gemäß Figur 3 ist außerdem die Ausformung 23 zu erkennen, welche anders Depot 26 angeschlossen ist und beispielsweise keilförmig, die Form eines Halbzylinders oder quaderförmig ausgebildet sein kann. Wie den Figuren 5 bis 7 zu entnehmen ist, schließt sich diese Ausformung 23 jeweils in der Mitte des Depots 16 an die Außenseite an und steht von dieser ab (deswegen der Begriff Ausformung) . Die Sinterdepots 16 haben den Vorteil, dass diese Ausformung auch nach der Wärmebehand lung zwecks Fügens der Sinterverbindung erhalten bleibt, da die Sinterkörper, die die Depots 16 bilden, während des Fu- gens formstabil bleiben. In den Figuren 5 bis 7 lässt sich außerdem die jeweilige Geometrie der Ausformungen entnehmen. Diese weisen die Höhe des Depots 16 auf und sind jeweils an die Außenkanten angeschlossen. Gemäß Figur 5 besteht die Aus formung aus einem Keil. Dieser ist mit anderen Worten ein Dreiecksprisma, wobei dieses mit einem seiner drei Seitenflä chen an die Außenseite des Depots 16 anschließt und somit mit der gegenüberliegenden Spitze von der Seitenkante ab ragt.According to FIG. 3, the shape 23 can also be seen, which is connected differently to the depot 26 and can be, for example, wedge-shaped, the shape of a half-cylinder or cuboid. As can be seen in FIGS. 5 to 7 , this formation 23 connects in the middle of the depot 16 to the outside and projects from it (hence the term formation). The sintered deposits 16 have the advantage that this shape is retained even after the heat treatment for the purpose of joining the sintered connection, since the sintered bodies which form the deposits 16 remain dimensionally stable during the joining. The respective geometry of the formations can also be seen in FIGS. 5 to 7. These have the height of the depot 16 and are each connected to the outer edges. According to Figure 5, the formation consists of a wedge. In other words, this is a triangular prism, which adjoins one of its three side surfaces on the outside of the depot 16 and thus protrudes from the side edge with the opposite tip.
Die Grund- und die Deckfläche dieses Prismas sind damit auf der Ebene jeweils der Unterseite und der Oberseite des Depots 16. The base and the top surface of this prism are thus on the level of the bottom and the top of the depot 16, respectively.
Gemäß Figur 6 ist die Ausformung als Halbzylinder ausgebil det, wobei dieser mit dem Teil der runden Mantelfläche nach außen ab ragt und mit der geraden Schnittfläche auf der Sei tenfläche des Depots 16 liegt. Grundfläche und Deckfläche sind damit jeweils wieder mit der Oberseite und der Untersei te des Depots 16 auf einer Ebene. According to Figure 6, the shape is ausgebil det as a half cylinder, which protrudes with the part of the round outer surface from the outside and lies with the straight cut surface on the side surface of the depot 16. Base and top surface are thus again with the top and bottom of the depot 16 on one level.
Gemäß Figur 7 ist die Ausformung 23 würfelförmig ausgebildet, wobei eine der Seitenfläche dieses Würfels auf der Seitenflä che des Depots 16 liegt. Die obere und die untere Würfelseite bilden jeweils eine gemeinsame Fläche mit der Oberseite und der Unterseite des Depots 16. According to FIG. 7, the formation 23 is cube-shaped, one of the side surfaces of this cube lying on the side surface of the depot 16. The upper and the lower side of the cube each form a common surface with the top and the bottom of the depot 16.
Gemäß Figur 4 ist eine Variante der elektrischen Schaltung 11 gemäß Figur 3 dargestellt, die sich lediglich darin unter scheidet, dass sowohl eine Ausformung 23 als auch eine Aus nehmung 22 gemeinsam zum Einsatz kommen. Wird der Spalt 18 mit dem Lotmaterial gefüllt so wirken sowohl die Ausnehmung 22 als auch die Ausformung 23 beide auf ihre Weise, um das Unterfüllmaterial 19 zu leiten. Dieses fließt sowohl bei dem Ausführungsbeispiel gemäß Figur 3 als auch bei dem Ausfüh- rungsbeispiel gemäß Figur 4 jeweils von den Ecken des Bauele mentes 13 (diese liegen jeweils vor und hinter der Schnitt ebene gemäß Figur 3 und 4) zur Ausformung 23 und Ausnehmung 22 hin. Diese Flussrichtung liegt senkrecht zur Zeichenebene. Durch die Ausformung 23 wird dieser Fluss dann in der Dar stellung gemäß Figur 3 und 4 nach rechts umgeleitet wobei dieser Fluss dann parallel zur Zeichenebene verläuft. Dabei stellt die Ausnehmung 22 zumindest für die Flussrichtung senkrecht zur seitlichen Ebene eine Fließbarriere dar, sodass das Underfill-Material zunächst an dieser Barriere zum Stehen kommt und Ausgasungen aus dem Depot 16 ungehindert ins Freie dringen können. Erst wenn die Fließfront von den äußeren Ecken beziehungsweise Kanten des Bauelementes 13 im Spalt 18 nach innen gelaufen ist, wird es durch die Ausformung 23 in den Spalt geleitet, sodass dieser von innen nach außen (in dieser Zeichnung von links nach rechts) ausgefüllt werden kann. Dies geschieht allerdings erst, bevor der Spalt 18 rundherum mit Underfill-Material gefüllt, sodass eine Blasen bildung vermieden werden kann. According to FIG. 4, a variant of the electrical circuit 11 according to FIG. 3 is shown, which only differs in that both a shape 23 and a recess 22 are used together. If the gap 18 is filled with the solder material, both the recess 22 and the formation 23 both act in their own way in order to conduct the underfill material 19. This flows both in the embodiment according to FIG. 3 and in the embodiment. Example of Figure 4 each from the corners of the component 13 Mentele (these are in front and behind the sectional plane of Figures 3 and 4) to the formation 23 and recess 22 out. This direction of flow is perpendicular to the plane of the drawing. Through the formation 23 this flow is then redirected to the right in the illustration according to FIGS. 3 and 4, this flow then running parallel to the plane of the drawing. The recess 22 represents a flow barrier, at least for the flow direction perpendicular to the lateral plane, so that the underfill material first comes to a standstill at this barrier and outgassings from the depot 16 can penetrate freely into the open. Only when the flow front has run inward from the outer corners or edges of the component 13 in the gap 18 is it passed through the formation 23 into the gap, so that it can be filled from the inside out (from left to right in this drawing) . However, this only happens before the gap 18 is completely filled with underfill material, so that bubbles can be avoided.
Gemäß den Figuren 5 bis 7 sind weitere Ausgestaltungen für die Ausnehmungen 22 dargestellt. Diese können in den elektro nischen Baugruppen 11, die in den anderen Figuren dargestellt sind, kombiniert werden. According to FIGS. 5 to 7, further configurations for the recesses 22 are shown. These can be combined in the electronic assemblies 11 shown in the other figures.
Gemäß Figur 5 besteht die Ausformung aus einer Strukturierung der Isolationsschicht 15. Diese Strukturierung kann bei spielsweise gleichzeitig mit der Ausbildung des Einbauplatzes 14 erzeugt werden. Die Isolationsschicht 15 liegt dabei di rekt auf der Oberfläche 27 des Substrates 12 auf, da die Me tallisierung 26 in diesem Bereich der Oberfläche 27 entfernt wurde . According to FIG. 5, the formation consists of a structuring of the insulation layer 15. This structuring can, for example, be generated simultaneously with the formation of the installation space 14. The insulation layer 15 lies directly on the surface 27 of the substrate 12, since the metalization 26 has been removed in this area of the surface 27.
Gemäß Figur 6 ist die Ausnehmung 22 durch Mikrofräsen herge stellt. Diese Ausnehmung befindet sich anders als gemäß Figur 3 dargestellt jedoch nicht nur in der Isolationsschicht 15 sondern auch in der Metallisierung 26, die in diesem Fall un terhalb der Isolationsschicht 15 noch vorhanden ist. Hier durch lassen sich in Bezug auf die Dicke der Isolations- Schicht 15 und der Metallisierung 26 vorteilhaft größere Spalttiefen erreichen, da diese in beiden Schichtbereichen vorgesehen werden können. Größere Spalttiefen stellen vor teilhaft auch ein schwerer zu überwindendes Hindernis für das fließende Underfill-Material dar. According to FIG. 6, the recess 22 is produced by micro-milling. This recess is located differently than shown in FIG. 3, but not only in the insulation layer 15 but also in the metallization 26, which in this case is still underneath the insulation layer 15. Here, in terms of the thickness of the insulation Layer 15 and the metallization 26 advantageously achieve greater gap depths, since these can be provided in both layer areas. Larger gap depths also present a difficult obstacle for the flowing underfill material to overcome.
In Figur 7 ist dargestellt, an welcher Stelle die Ausnehmun gen 22 vorgesehen werden können. Der Einbauplatz 14 ist von oben dargestellt, wobei auch zu erkennen ist, dass die Front des Lötstoplackes , der die Isolationsschicht 15 bildet, etwas unregelmäßig ausgebildet ist (in Figur 7 übertrieben darge stellt) . Die Ausnehmungen 22 sind in diesem Fall durch einen Laser erzeugt worden was die runden Enden der erzeugten Nut erklärt. Außerdem kann man in Figur 7 die Außenkontur des Bauelementes 13 erkennen welches allerdings erst später auf gesetzt wird. FIG. 7 shows the location at which the recesses 22 can be provided. The installation location 14 is shown from above, and it can also be seen that the front of the solder resist, which forms the insulation layer 15, is somewhat irregularly formed (exaggerated in FIG. 7). The recesses 22 have been produced in this case by a laser, which explains the round ends of the groove produced. In addition, the outer contour of the component 13 can be seen in FIG. 7, which is, however, only set to later.
In Figur 8 ist der Schaltungsträger 12 mit einer Metallisie rung zu erkennen, welcher neben den Kontaktstrukturen 25 auch die Ausnehmungen 22 aufweist. Die hierfür erforderlichen Aus sparungen können beispielsweise durch ätzen in der Metalli sierung hergestellt werden. Zu diesem Zweck ist es erforder lich, eine Druckmaske zu verwenden, die eine Negativ-Form der in Figur 3 dargestellten Metallstrukturen ausbildet. Mit an deren Worten weist eine solche Maske überall dort Ätzöffnun gen auf, wo gemäß Figur 8 die Oberfläche 27 des Schaltungs trägers 12 zu Tage tritt. 8 shows the circuit carrier 12 with a metallization, which in addition to the contact structures 25 also has the recesses 22. The savings required for this can be produced, for example, by etching in the metallization. For this purpose, it is necessary to use a print mask that forms a negative shape of the metal structures shown in FIG. 3. In other words, such a mask has Ätzöffnun conditions where, according to Figure 8, the surface 27 of the circuit carrier 12 comes to light.
In Figur 9 ist dargestellt, wie auf dem Schaltungsträger 12 gemäß Figur 8 die Depots 16 aus Sinterpaste aufgebracht wur den. Hier ist auch zu erkennen, dass die Ausformungen 23 mit den Ausnehmungen 22 korrespondieren, sodass der zu Figur 4 beschriebene Effekt einer Umleitung des Underfill-Materials erreicht werden kann. Außerdem ist zu erkennen, dass die De pots 16 aus Sinterpaste für manche Bauelemente aus mehreren Segmenten bestehen, um unterschiedliche Kontakte des zu fü genden elektronischen Bauelementes (in Figur 9 nicht darge stellt) zu gewährleisten. Gemäß Figur 10 ist eine Druckschablone dargestellt, welche Maskenöffnungen 28 an den Stellen aufweist, die die Depots 16 gemäß Figur 9 gedruckt werden sollen. Zu erkennen ist es, dass die Ausformungen 23 gemäß Figur 9 durch Einbuchtungen 29 in den Maskenöffnungen 28 realisiert sind. Diese werden beim Drucken mit dem Material beispielsweise der Sinterpaste aus gefüllt, damit die Depots 16 die Ausformungen 23 ausweisen. FIG. 9 shows how the depots 16 made of sintered paste were applied to the circuit carrier 12 according to FIG. It can also be seen here that the formations 23 correspond to the recesses 22, so that the effect of redirecting the underfill material described in FIG. 4 can be achieved. It can also be seen that the depots 16 of sintering paste for some components consist of several segments in order to ensure different contacts of the electronic component to be added (not shown in FIG. 9). According to FIG. 10, a printing stencil is shown, which has mask openings 28 at the locations that the depots 16 according to FIG. 9 are to be printed. It can be seen that the formations 23 according to FIG. 9 are realized by indentations 29 in the mask openings 28. These are filled out during printing with the material, for example the sintering paste, so that the depots 16 show the formations 23.
BezugsZeichen Reference calibrate Z
11 elektronische Schaltung11 electronic circuit
12 Schaltungsträger 12 circuit carriers
13 elektronische Bauelemente 13 electronic components
14 Einbauplätze 14 slots
15 Isolationsschicht  15 insulation layer
16 Depot  16 depot
17 Sinterverbindung  17 sintered connection
18 Spalt  18 gap
19 Underfill-Material  19 Underfill material
20 Deckplatte  20 cover plate
21 weitere Sinterverbindung 21 further sinter connections
22 Ausnehmungen 22 recesses
23 Ausformungen  23 forms
24 Blasen  24 bubbles
25 Kontaktstrukturen  25 contact structures
26 Metallisierung  26 metallization
27 Oberfläche  27 surface
28 Maskenöffnungen  28 mask openings
29 Einbuchtungen  29 indentations

Claims

Patentansprüche claims
1. Schaltungsträger (12) mit einem Einbauplatz (14) für ein elektronisches Bauelement (13), 1. circuit carrier (12) with a slot (14) for an electronic component (13),
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass der Einbauplatz (14) that the mounting location (14)
an seinem Rand mindestens eine Ausnehmung (22) aufweist, die eine Vertiefung in der Oberfläche (27) des Schaltungsträgers (12) ausbildet, und has at its edge at least one recess (22) which forms a depression in the surface (27) of the circuit carrier (12), and
dass auf dem Einbauplatz (14) ein Depot (16) eines Fügehilfs stoffes aufgetragen ist, wobei das Depot (16) aus einem Sin terwerkstoff besteht und am Rand des Depots (16) eine Ausfor mung (23) vorgesehen ist. that a depot (16) of a joining aid is applied to the installation site (14), the depot (16) consisting of a sintered material and a shape (23) is provided at the edge of the depot (16).
2. Schaltungsträger (12) nach Anspruch 1, 2. circuit carrier (12) according to claim 1,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass die Ausnehmung (22) aus einem Schlitz besteht, der senk recht zum Rand des Einbauplatzes (14) verläuft. that the recess (22) consists of a slot that runs perpendicular to the edge of the installation space (14).
3. Schaltungsträger (12) nach einem der voranstehenden An sprüche, 3. Circuit carrier (12) according to one of the preceding claims,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass die Vertiefung in einer die Oberfläche (27) des Schal tungsträgers (12) bildenden Isolationsschicht (15) und/oder in einer Metallisierung (26) auf dem Schaltungsträger (12) vorgesehen ist. that the recess is provided in a surface (27) of the circuit device carrier (12) forming insulation layer (15) and / or in a metallization (26) on the circuit carrier (12).
4. Schaltungsträger (12) nach Anspruch 1, 4. circuit carrier (12) according to claim 1,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass die Ausformung (23) die Form eines Keils hat, der von dem Rand des Depots (16) absteht. that the formation (23) has the shape of a wedge that protrudes from the edge of the depot (16).
5. Schaltungsträger (12) nach Anspruch 4, 5. circuit carrier (12) according to claim 4,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass die Breite des Keils gerade der Höhe des Depots (16) entspricht . that the width of the wedge corresponds exactly to the height of the depot (16).
6. Elektronische Schaltung (11) mit einem Schaltungsträger (12) nach einem der Ansprüche 1 bis 5 und einem elektroni schen Bauelement (13), 6. Electronic circuit (11) with a circuit carrier (12) according to one of claims 1 to 5 and an electronic component's (13),
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass das elektronische Bauelement (13) auf dem Depot des Fü- gehilfsstoffes befestigt ist. that the electronic component (13) is attached to the depot of the joining aid.
7. Elektronische Schaltung (11) nach Anspruch 6, 7. Electronic circuit (11) according to claim 6,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass ein Spalt zwischen dem Schaltungsträger (12) und dem Bauelement (13) mit einem Underfill-Material (19) ausgefüllt ist . that a gap between the circuit carrier (12) and the component (13) is filled with an underfill material (19).
8. Verfahren zum Herstellen eines Schaltungsträgers (12), bei dem ein Einbauplatz (14) für ein elektronisches Bauelement (13) erzeugt wird, 8. A method for producing a circuit carrier (12), in which an installation space (14) for an electronic component (13) is generated,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass am Rand des Einbauplatzes (14) mindestens eine Ausneh mung (22) erzeugt wird, wobei diese als Vertiefung in der Oberfläche (27) des Schaltungsträgers (12) ausgebildet wird oder eine Oberflächenstrukturierung hergestellt wird. that at least one recess (22) is produced at the edge of the installation space (14), said recess being formed as a depression in the surface (27) of the circuit carrier (12) or a surface structuring being produced.
9. Verfahren nach Anspruch 8, 9. The method according to claim 8,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass die Ausnehmung (22) durch ein spanendes Verfahren er zeugt wird. that the recess (22) is produced by a machining process.
10. Verfahren nach Anspruch 8, 10. The method according to claim 8,
d a d u r c h g e k e n n z e i c h n e t, dass d a d u r c h g e k e n n z e i c h n e t that
die Ausnehmung (22) oder Oberflächenstrukturierung durch Strukturieren einer Schicht auf dem Schaltungsträger (12) er zeugt wird. the recess (22) or surface structuring by structuring a layer on the circuit carrier (12) is generated.
11. Verfahren nach einem der Ansprüche 8 bis 10, 11. The method according to any one of claims 8 to 10,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass auf dem Einbauplatz (14) ein Depot (16) aus einem Füge hilfsstoff aufgebracht oder angebracht wird. that a depot (16) made of a joining aid is applied or attached to the installation site (14).
12. Verfahren zum Herstellen einer elektronischen Baugruppe, d a d u r c h g e k e n n z e i c h n e t, 12. A method for producing an electronic assembly, d a d u r c h g e k e n n z e i c h n e t,
dass that
• ein Schaltungsträger (12) nach einem Verfahren gemäß An spruch 11 hergestellt wird,  A circuit carrier (12) is produced by a method according to claim 11,
• auf dem Depot (16) ein elektronisches Bauelement (13) befestigt wird,  An electronic component (13) is attached to the depot (16),
• ein Spalt (18) zwischen Schaltungsträger (12) und Bau element (13) mit einem Underfill-Material (19) ausge füllt wird.  • a gap (18) between circuit carrier (12) and construction element (13) with an underfill material (19) is filled out.
13. Verfahren nach Anspruch 12, 13. The method according to claim 12,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass das Underfill-Material (19) in einem Bereich außerhalb der mindestens eine Ausnehmung (22), vorzugsweise genau in der Mitte zwischen zwei Ausnehmungen (22), in den Spalt (18) eingebracht wird. that the underfill material (19) is introduced into the gap (18) in an area outside the at least one recess (22), preferably exactly in the middle between two recesses (22).
EP19766184.6A 2018-08-31 2019-08-20 Circuit carrier having an installation place for electronic components, electronic circuit and production method Pending EP3797566A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP18192039.8A EP3618586A1 (en) 2018-08-31 2018-08-31 Circuit carrier comprising a mounting place for electronic components, electronic circuit and manufacturing method
PCT/EP2019/072203 WO2020043543A1 (en) 2018-08-31 2019-08-20 Circuit carrier having an installation place for electronic components, electronic circuit and production method

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US20210351151A1 (en) 2021-11-11
WO2020043543A1 (en) 2020-03-05
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