EP3758057A4 - Kühlkörper - Google Patents
Kühlkörper Download PDFInfo
- Publication number
- EP3758057A4 EP3758057A4 EP20771182.1A EP20771182A EP3758057A4 EP 3758057 A4 EP3758057 A4 EP 3758057A4 EP 20771182 A EP20771182 A EP 20771182A EP 3758057 A4 EP3758057 A4 EP 3758057A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- heatsink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/26—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being integral with the element
- F28F1/28—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being integral with the element the element being built-up from finned sections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geometry (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019078219A JP6782326B2 (ja) | 2019-04-17 | 2019-04-17 | ヒートシンク |
PCT/JP2020/016355 WO2020213581A1 (ja) | 2019-04-17 | 2020-04-14 | ヒートシンク |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3758057A1 EP3758057A1 (de) | 2020-12-30 |
EP3758057A4 true EP3758057A4 (de) | 2021-08-11 |
Family
ID=72837922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20771182.1A Withdrawn EP3758057A4 (de) | 2019-04-17 | 2020-04-14 | Kühlkörper |
Country Status (6)
Country | Link |
---|---|
US (1) | US10996001B2 (de) |
EP (1) | EP3758057A4 (de) |
JP (1) | JP6782326B2 (de) |
CN (2) | CN212876430U (de) |
TW (1) | TWI717263B (de) |
WO (1) | WO2020213581A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6647439B1 (ja) | 2019-04-18 | 2020-02-14 | 古河電気工業株式会社 | ヒートシンク |
JP7501785B2 (ja) * | 2021-03-26 | 2024-06-18 | 三菱電機株式会社 | エレベータの制御盤 |
JP7129577B1 (ja) | 2022-02-24 | 2022-09-01 | 古河電気工業株式会社 | 熱輸送装置 |
WO2023189070A1 (ja) * | 2022-03-29 | 2023-10-05 | 古河電気工業株式会社 | ヒートシンク |
USD1026838S1 (en) * | 2022-04-26 | 2024-05-14 | Taiwan Microloops Corp. | Heat dissipation module |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55102889A (en) * | 1979-02-01 | 1980-08-06 | Pioneer Electronic Corp | Natural convection type radiator |
US20140182819A1 (en) * | 2013-01-01 | 2014-07-03 | Asia Vital Components Co., Ltd. | Heat dissipating device |
JP2016009828A (ja) * | 2014-06-26 | 2016-01-18 | 昭和電工株式会社 | 発熱素子用沸騰冷却器 |
EP3232752A1 (de) * | 2016-04-15 | 2017-10-18 | Google, Inc. | Kühlung von elektronischen vorrichtungen in einem datenzentrum |
US20170330819A1 (en) * | 2015-02-03 | 2017-11-16 | Qingdao Haier Joint Stock Co., Ltd. | Heat exchanging apparatus and semiconductor refrigerator having the same |
US20170363367A1 (en) * | 2016-06-21 | 2017-12-21 | Tai-Sol Electronics Co., Ltd. | Heat dissipation device |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3563309A (en) * | 1968-09-16 | 1971-02-16 | Hughes Aircraft Co | Heat pipe having improved dielectric strength |
US4632179A (en) * | 1982-09-20 | 1986-12-30 | Stirling Thermal Motors, Inc. | Heat pipe |
JPS6134375U (ja) * | 1984-07-30 | 1986-03-03 | 日立電線株式会社 | ヒ−トパイプ |
JPS61125590A (ja) * | 1984-11-21 | 1986-06-13 | Akutoronikusu Kk | ヒ−トパイプの内部構造 |
US5253702A (en) * | 1992-01-14 | 1993-10-19 | Sun Microsystems, Inc. | Integral heat pipe, heat exchanger, and clamping plate |
JPH06120383A (ja) * | 1992-10-05 | 1994-04-28 | Hitachi Ltd | 半導体冷却装置 |
JP3608286B2 (ja) * | 1996-03-14 | 2005-01-05 | 株式会社デンソー | 沸騰冷却装置 |
JP2003110072A (ja) | 2001-09-28 | 2003-04-11 | Fujikura Ltd | ヒートパイプ式ヒートシンク |
JP2006313056A (ja) * | 2005-04-05 | 2006-11-16 | Denso Corp | ヒートパイプおよびそれを用いた排熱回収装置 |
CN100561108C (zh) * | 2006-04-14 | 2009-11-18 | 富准精密工业(深圳)有限公司 | 热管 |
CN101398272A (zh) * | 2007-09-28 | 2009-04-01 | 富准精密工业(深圳)有限公司 | 热管 |
US8274300B2 (en) | 2008-01-18 | 2012-09-25 | Kes Systems & Service (1993) Pte Ltd. | Thermal control unit for semiconductor testing |
JP2009287821A (ja) * | 2008-05-28 | 2009-12-10 | Denso Corp | 熱交換装置 |
EP2460779B1 (de) | 2009-07-30 | 2019-03-06 | Nippon Electric Glass Co., Ltd. | Glasrolle und herstellungsverfahren dafür |
JP5323614B2 (ja) * | 2009-08-27 | 2013-10-23 | 古河電気工業株式会社 | ヒートパイプおよびその製造方法 |
HK1144647A2 (en) * | 2010-10-21 | 2011-02-25 | Wong Chuen Room A & B | A convertible universal platform for light emitting diodes with super heat-conducting tubes |
US9618275B1 (en) * | 2012-05-03 | 2017-04-11 | Advanced Cooling Technologies, Inc. | Hybrid heat pipe |
JP5654180B2 (ja) * | 2012-12-14 | 2015-01-14 | 古河電気工業株式会社 | 冷却装置 |
CN103165547B (zh) * | 2013-04-01 | 2015-09-02 | 河海大学常州校区 | 微槽群复合相变散热器 |
JP5778302B2 (ja) * | 2014-02-27 | 2015-09-16 | 古河電気工業株式会社 | 熱輸送装置 |
US20150308750A1 (en) * | 2014-04-28 | 2015-10-29 | J R Thermal LLC | Slug Pump Heat Pipe |
CN203934263U (zh) * | 2014-07-04 | 2014-11-05 | 讯凯国际股份有限公司 | 具有毛细构件的散热装置 |
CN104803011B (zh) * | 2015-05-12 | 2016-08-17 | 东南大学 | 月球车温控系统 |
US10330392B2 (en) * | 2016-02-05 | 2019-06-25 | Cooler Master Co., Ltd. | Three-dimensional heat transfer device |
US10012445B2 (en) * | 2016-09-08 | 2018-07-03 | Taiwan Microloops Corp. | Vapor chamber and heat pipe combined structure |
DE112017007338T5 (de) * | 2017-03-31 | 2019-12-12 | Mitsubishi Electric Corporation | Kühleinrichtung und Fahrzeug-Leistungswandlereinrichtung |
TWI645150B (zh) * | 2017-04-10 | 2018-12-21 | 華碩電腦股份有限公司 | 均溫板及使用該均溫板的散熱模組 |
CN107644855A (zh) * | 2017-09-08 | 2018-01-30 | 广东智科精创科技股份有限公司 | 一种均温板及均温板的生产方法 |
-
2019
- 2019-04-17 JP JP2019078219A patent/JP6782326B2/ja active Active
-
2020
- 2020-04-14 WO PCT/JP2020/016355 patent/WO2020213581A1/ja unknown
- 2020-04-14 EP EP20771182.1A patent/EP3758057A4/de not_active Withdrawn
- 2020-04-17 TW TW109112976A patent/TWI717263B/zh active
- 2020-04-17 CN CN202020583392.XU patent/CN212876430U/zh active Active
- 2020-04-17 CN CN202010305250.1A patent/CN111836515B/zh active Active
- 2020-09-01 US US17/009,206 patent/US10996001B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55102889A (en) * | 1979-02-01 | 1980-08-06 | Pioneer Electronic Corp | Natural convection type radiator |
US20140182819A1 (en) * | 2013-01-01 | 2014-07-03 | Asia Vital Components Co., Ltd. | Heat dissipating device |
JP2016009828A (ja) * | 2014-06-26 | 2016-01-18 | 昭和電工株式会社 | 発熱素子用沸騰冷却器 |
US20170330819A1 (en) * | 2015-02-03 | 2017-11-16 | Qingdao Haier Joint Stock Co., Ltd. | Heat exchanging apparatus and semiconductor refrigerator having the same |
EP3232752A1 (de) * | 2016-04-15 | 2017-10-18 | Google, Inc. | Kühlung von elektronischen vorrichtungen in einem datenzentrum |
US20170363367A1 (en) * | 2016-06-21 | 2017-12-21 | Tai-Sol Electronics Co., Ltd. | Heat dissipation device |
Non-Patent Citations (1)
Title |
---|
See also references of WO2020213581A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN212876430U (zh) | 2021-04-02 |
WO2020213581A1 (ja) | 2020-10-22 |
JP2020176752A (ja) | 2020-10-29 |
TW202040775A (zh) | 2020-11-01 |
US20200393201A1 (en) | 2020-12-17 |
CN111836515A (zh) | 2020-10-27 |
CN111836515B (zh) | 2021-10-15 |
US10996001B2 (en) | 2021-05-04 |
JP6782326B2 (ja) | 2020-11-11 |
TWI717263B (zh) | 2021-01-21 |
EP3758057A1 (de) | 2020-12-30 |
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Legal Events
Date | Code | Title | Description |
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STAA | Information on the status of an ep patent application or granted ep patent |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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17P | Request for examination filed |
Effective date: 20200921 |
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AK | Designated contracting states |
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A4 | Supplementary search report drawn up and despatched |
Effective date: 20210708 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 23/36 20060101AFI20210702BHEP Ipc: H01L 23/427 20060101ALI20210702BHEP Ipc: F28D 15/02 20060101ALI20210702BHEP Ipc: H05K 7/20 20060101ALI20210702BHEP |
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18D | Application deemed to be withdrawn |
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