EP3680367A3 - Film forming device and method for forming metal film using the same - Google Patents

Film forming device and method for forming metal film using the same Download PDF

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Publication number
EP3680367A3
EP3680367A3 EP19205455.9A EP19205455A EP3680367A3 EP 3680367 A3 EP3680367 A3 EP 3680367A3 EP 19205455 A EP19205455 A EP 19205455A EP 3680367 A3 EP3680367 A3 EP 3680367A3
Authority
EP
European Patent Office
Prior art keywords
film
metal film
forming device
anode
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19205455.9A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3680367A2 (en
Inventor
Hirofumi Iisaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of EP3680367A2 publication Critical patent/EP3680367A2/en
Publication of EP3680367A3 publication Critical patent/EP3680367A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
EP19205455.9A 2018-12-18 2019-10-25 Film forming device and method for forming metal film using the same Withdrawn EP3680367A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018236058A JP2020097764A (ja) 2018-12-18 2018-12-18 成膜装置、及びそれを用いた金属膜の形成方法

Publications (2)

Publication Number Publication Date
EP3680367A2 EP3680367A2 (en) 2020-07-15
EP3680367A3 true EP3680367A3 (en) 2020-09-30

Family

ID=68382196

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19205455.9A Withdrawn EP3680367A3 (en) 2018-12-18 2019-10-25 Film forming device and method for forming metal film using the same

Country Status (5)

Country Link
US (1) US20200190685A1 (zh)
EP (1) EP3680367A3 (zh)
JP (1) JP2020097764A (zh)
KR (1) KR20200075735A (zh)
CN (1) CN111334840A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7306344B2 (ja) * 2020-07-29 2023-07-11 トヨタ自動車株式会社 銀皮膜の形成方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999025902A1 (en) * 1997-11-13 1999-05-27 Novellus Systems, Inc. Membrane partition system for plating of wafers
US20050000820A1 (en) * 2003-05-30 2005-01-06 Koji Mishima Apparatus and method for processing a substrate
US20120138471A1 (en) * 2010-12-01 2012-06-07 Mayer Steven T Electroplating apparatus and process for wafer level packaging
EP2905361A1 (en) * 2014-02-04 2015-08-12 Toyota Jidosha Kabushiki Kaisha Electroplating cell, metal coating and method of forming the same
JP2016222991A (ja) * 2015-06-02 2016-12-28 株式会社豊田中央研究所 電気めっきセル、及び金属皮膜の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10047452B2 (en) * 2012-02-23 2018-08-14 Toyota Jidosha Kabushiki Kaisha Film formation device and film formation method for forming metal film
KR101799710B1 (ko) * 2013-11-14 2017-11-20 도요타 지도샤（주） 금속 피막의 성막 장치 및 그 성막 방법
JP5995906B2 (ja) 2014-05-19 2016-09-21 株式会社豊田中央研究所 隔膜の製造方法、及び金属被膜の製造方法
JP6435546B2 (ja) * 2014-10-17 2018-12-12 ディップソール株式会社 銅−ニッケル合金電気めっき装置
JP6222145B2 (ja) 2015-03-11 2017-11-01 トヨタ自動車株式会社 金属皮膜の成膜装置およびその成膜方法
JP6447575B2 (ja) * 2016-05-23 2019-01-09 トヨタ自動車株式会社 金属皮膜の成膜方法およびその成膜装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999025902A1 (en) * 1997-11-13 1999-05-27 Novellus Systems, Inc. Membrane partition system for plating of wafers
US20050000820A1 (en) * 2003-05-30 2005-01-06 Koji Mishima Apparatus and method for processing a substrate
US20120138471A1 (en) * 2010-12-01 2012-06-07 Mayer Steven T Electroplating apparatus and process for wafer level packaging
EP2905361A1 (en) * 2014-02-04 2015-08-12 Toyota Jidosha Kabushiki Kaisha Electroplating cell, metal coating and method of forming the same
JP2016222991A (ja) * 2015-06-02 2016-12-28 株式会社豊田中央研究所 電気めっきセル、及び金属皮膜の製造方法

Also Published As

Publication number Publication date
JP2020097764A (ja) 2020-06-25
CN111334840A (zh) 2020-06-26
KR20200075735A (ko) 2020-06-26
US20200190685A1 (en) 2020-06-18
EP3680367A2 (en) 2020-07-15

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